PIC32MX170F256B-V/SP - 256KB Flash 32-bit MCU 40MHz | Microchip
부품 번호: PIC32MX170F256B-V/SP ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.72 | $4.72 |
| 10 | $4.25 | $42.50 |
| 100 | $3.78 | $378.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.05 | $3,050.00 |
PIC32MX170F256B-V/SP 개요
An MCU (microcontroller unit) is a single-chip computer containing a CPU core, volatile and on-RAM non-volatile program/storage, microphone and on-chip peripherals. The PIC32MX family belongs to the broader 32-bit microcontroller category, which sits hierarchically above 8-bit and 16-bit MCUs and below microprocessors in the embedded computing hierarchy. The MIPS32 M4K core in this device delivers 83 DMIPS at 50 MHz while consuming only 0.5 mA/MHz typical active current, a balance that suits battery-aware designs.
Key features include two I2S/SPI modules for codec and serial audio, Peripheral Pin Select (PPS) for flexible pin mapping, a Parallel Master Port (PMP) for graphics interfaces, mTouch capacitive touch support, 1 ns high-resolution time measurement, on-chip temperature measurement, and a 10-bit ADC. Communication is provided by USB 2.0 full-speed device/host/OTG, I2C, SPI, I2S, and UART peripherals.
The device combines deterministic interrupt response with rich connectivity, allowing it to act as both an application processor and a peripheral controller. The PPS feature decouples peripheral pin assignments from the silicon, enabling late-stage PCB routing decisions. Built-in DMA and DMA enable the DMA and DMA and on-chip analog blocks operate without the CPU, freeing MIPS for application code.
Typical applications include automotive body and HVAC control, USB peripherals (HID, CDC, audio), industrial sensing nodes, consumer audio with I2S codecs, and small graphical HMI displays via PMP. The 28-pin SPDIP package is favored for prototyping and through-hole manufacturing lines. The wide operating voltage range of 2.3V to 3.6V supports both 3.3V and lower-voltage rails.
When designing with this part, pay attention to the PPS configuration lockout sequence and ensure the RTCC and ADC use separate analog supply pins. The AEC-Q100 grade and 256 KB Flash exposure allows automotive OEMs to qualify one part across multiple SKUs, reducing BOM risk. This page synthesizes distributor pricing, drop-in alternative inventory, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: PIC32MX170F256B-V/SP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX170F256B-V/SP (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, SRAM, Active Current Consumption, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX170F256B-50I/SP
✅ 드롭인✓ 재고 있음
$4.55 / 개
데이터시트 보기 →PIC32MX150F256H-I/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX150F128B-I/SP
✅ 드롭인✓ 재고 있음
$3.56 / 개
데이터시트 보기 →PIC32MX130F256B-I/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX170F256B-I/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX170F256B-V/SP 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz (83 DMIPS) |
| Flash Program Memory | 256 KB |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| 동작 온도 범위 | -40 C to +105 C (Automotive, V grade) |
| 패키지 | 28-pin SPDIP (SP) |
| 실장 유형 | Through-Hole (DIP) |
| ADC | 10-bit |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Communication Peripherals | 2x I2S/SPI, I2C, PMP |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch | Supported |
| High-Resolution Timer | 1 ns resolution |
| On-chip Temperature Sensor | Yes |
| Active Current Consumption | 0.5 mA/MHz typical |
| AEC-Q100 Qualification | Qualified (V automotive grade) |
| RoHS 상태 | Compliant |
PIC32MX170F256B-V/SP 핀 구성
| 핀 1 | RA0 — I/O port A bit 0 |
| 핀 2 | RA1 — I/O port A bit 1 |
| 핀 3 | RA2 — I/O port A bit 2 |
| 핀 4 | RA3 — I/O port A bit 3 |
| 핀 5 | RA4 — I/O port A bit 4 |
| 핀 6 | AVDD — Analog supply voltage |
| 핀 7 | AVSS — Analog ground |
| 핀 8 | RB0 — I/O port B bit 0 (PPS-capable) |
| 핀 9 | RB1 — I/O port B bit 1 (PPS-capable) |
| 핀 10 | RB2 — I/O port B bit 2 (PPS-capable) |
| 핀 11 | RB3 — I/O port B bit 3 (PPS-capable) |
| 핀 12 | RB4 — I/O port B bit 4 (PPS-capable) |
| 핀 13 | RB5 — I/O port B bit 5 (PPS-capable) |
| 핀 14 | VSS — Digital ground |
| 핀 15 | VDD — Digital supply voltage |
| 핀 16 | RB6 — I/O port B bit 6 (PPS-capable) |
| 핀 17 | RB7 — I/O port B bit 7 (PPS-capable) |
| 핀 18 | RB8 — I/O port B bit 8 (PPS-capable) |
| 핀 19 | RB9 — I/O port B bit 9 (PPS-capable) |
| 핀 20 | RA5 — I/O port A bit 5 |
| 핀 21 | RA6 — I/O port A bit 6 |
| 핀 22 | RA7 — I/O port A bit 7 |
| 핀 23 | RC0 — I/O port C bit 0 |
| 핀 24 | RC1 — I/O port C bit 1 |
| 핀 25 | RC2 — I/O port C bit 2 |
| 핀 26 | RC3 — I/O port C bit 3 |
| 핀 27 | RC4 — I/O port C bit 4 |
| 핀 28 | VSS — Digital ground |
일반적인 애플리케이션
PIC32MX170F256B-V/SP 적합 용도: 6 애플리케이션s: Automotive Body Control Module, USB Audio Device, Industrial Sensing Node, Capacitive Touch Control Panel, Small Graphical HMI Display, Battery-Powered IoT Sensor.
Automotive Body Control Module
The PIC32MX170F256B-V/SP in automotive body control modules (BCMs) and HVAC applications: the AEC-Q100 grade (-40C to +105C) and 256K Flash allow engineers to integrate LIN/CAN stacks, motor-control PWM, and capacitive mTouch buttons into a single chip. The 64K SRAM is sufficient for CAN message buffers and small RTOS instances. USB 2.0 FS OTG enables diagnostics. The 28-SPDIP package suits through-hole manufacturing lines still common in production with automotive BCM PCBs.
추천
USB Audio Device
USB audio applications such as USB headsets, USB speakers, and USB microphones benefit from the PIC32MX170F256B-V/SP's USB 2.0 Full-Speed Device capability and two I2S/SPI modules for codec interfacing. The 256K Flash accommodates USB Audio Class 1.0 stacks plus I2S driver code. The 64K SRAM allows audio buffering at 48 kHz stereo. PPS enables flexible PCB design. The PIC32MX170F256B-V/SP integrates USB PHY and audio peripherals, eliminating external interface ICs and BOM cost.
추천
Industrial Sensing Node
Industrial sensing nodes such as Modbus sensors, environmental monitors, and predictive-maintenance controllers use the PIC32MX170F256B-V/SP for its 10-bit ADC, I2C bus interfaces, and AEC-Q100 industrial grade. The 256K Flash supports complex Modbus stacks and security libraries. The 64K SRAM enables time-series buffering. The on-chip temperature sensor reduces BOM. PMP allows small graphical HMI displays. The 28-SPDIP package suits industrial through-hole manufacturing lines with higher mechanical robustness than SMD.
추천
Capacitive Touch Control Panel
Capacitive touch control panels and appliances use the PIC32MX170F256B-V/SP for its hardware mTouch capacitive touch sensing peripherals (PPS allows CMC and PWM modules to be remapped for button and slider scanning). The 256K Flash fits touch libraries and UI logic. The 1 ns high-resolution timer enables accurate capacitance measurement. The on-chip temperature sensor compensates for temperature drift. The 28-SPDIP package suits prototyping and through-hole manufacturing lines.
추천
Small Graphical HMI Display
Small graphical HMI displays up to 4.3-inch TFT use the PIC32MX170F256B-V/SP's Parallel Master Port (PMP) interface for fast TFT data transfer to ST7789V and ILI9341TI-based control ICs. The 256K Flash fits lightweight graphical libraries. The 64K SRAM enables double-buffer display and display-list buffering. USB device support enables HMI configuration via USB. The 28-SPDIP package suits industrial HMI through-hole manufacturing lines.
추천
Battery-Powered IoT Sensor
Battery-powered IoT sensors with periodic sensing benefit from the PIC32MX170F256B-V/SP's low-power Sleep and Idle modes, with active current of 0.5 mA/MHz typical and on-chip temperature sensor eliminating external parts. The 256K Flash supports BLE/Zigbee stacks via UART peripherals. The 64K SRAM allows time-series buffering. USB device support enables battery-charging interfaces. The 28-SPDIP package suits low-volume through-hole designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX170F256B-V/SP — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX170F256B-50I/SP | PIC32MX150F256H-I/SP | PIC32MX150F128B-I/SP | PIC32MX130F256B-I/SP | PIC32MX170F256B-I/SP |
|---|---|---|---|---|---|---|
| Package | 28-SPDIP (SP) | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB | 64 KB |
| Temperature Grade | Automotive -40C to +105C (-V) | Industrial -40C to +85C (-I) | Industrial -40C to +85C (-I) | Industrial -40C to +85C (-I) | Industrial -40C to +85C (-I) | Industrial -40C to +85C (-I) |
| USB | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | No USB | No USB | No USB | USB 2.0 FS Device/Host/OTG |
| AEC-Q100 Qualified | Yes (-V suffix) | No | No | No | No | No |
주요 차별점
- AEC-Q100 automotive qualified at 105C (vs PIC32MX170F256B-I/SP)
- USB 2.0 Full-Speed with OTG (vs PIC32MX130F256B-I/SP)
- 256 KB Flash with 64 KB SRAM (vs PIC32MX150F128B-I/SP)
- 28-SPDIP through-hole package (vs PIC32MX170F256B-V/SO (SOIC-28))
설계 노트
The PIC32MX170F256B-V/SP operates from 2.3V to 3.6V; place a 10 uF bulk capacitor plus a 0.1 uF decoupling capacitor on each VDD pin and a separate 10 uF + 0.1 uF pair on AVDD/AVSS to keep the analog supply clean. The on-chip voltage regulator requires a 10 uF low-ESR capacitor on the VCAP pin. USB applications need a 0.1 uF capacitor on the VBUS pin. The device draws 0.5 mA/MHz typical active current; with 40 MHz activity, full-load current is approximately 20 mA plus I/O pin leakage.
Keep analog and digital grounds separated with a single-point star connection near the AVSS pin to minimize ground-loop noise. The 28-SPDIP package leaves space for short traces to bypass capacitors. Route the USB D+/D- pair as a 90-ohm differential pair with series 15K pull-down resistors on each line, and add common-mode choke for EMI immunity. The 28-SPDIP package layout should reserve adequate spacing for the package's wide lead pitch, leaving wide lay-down pads and connector-area-ready thermal interfaces.
Configure the Peripheral Pin Select (PPS) locks correctly - PPS configuration must be unlocked via a specific sequence in OSCCON before writing PPS registers, and PPS must be locked before entering Sleep to prevent glitch. Wait for the RTCC clock source to stabilize after switch before using RTCC. For USB applications, do not enable USB without the 48 MHz USB PLL running, as this will block bus lock. Reset the device correctly after voltage-rail transition to avoid brown-out reset misbehavior.
The 28-SPDIP package has higher thermal resistance than the QFN equivalent; in enclosed industrial enclosures at +85C ambient, ensure 0.5 mA/MHz typical active current with 40 MHz full-load gives 20 mA plus I/O leakage. Estimated: at 3.6V worst-case VIN and 25 mA full-load, power dissipation is approximately 90 mW. The 28-SPDIP package's thermal resistance of approximately 60 C/W yields 5.4C junction rise at +85C ambient, well within the 105C automotive limit.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified due to the -V suffix denoting automotive grade.
