PIC32MX170F512H-50I/MR - 50MHz 512KB Flash 32-bit MCU | Microchip
부품 번호: PIC32MX170F512H-50I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.13 | $513.00 |
| 500 | $4.59 | $2,295.00 |
| 1,000 | $4.1 | $4,100.00 |
PIC32MX170F512H-50I/MR 개요
A 32-bit microcontroller (MCU) is a single-chip processor whose datapath, registers and ALU are 32 bits wide. The MIPS32 M4K core combines Harvard-style separate instruction/data buses with a 5-stage pipeline, giving deterministic interrupt latency and high code density; the PIC32MX family layers Microchip's Harmony/MPLAB XC32 toolchain and Peripheral Library on top, enabling C-based firmware development with hardware abstraction for the ADC, timers, UART, I2C, SPI and PMP blocks. Within the broader taxonomy, the PIC32MX170F512H belongs to the PIC32MX1xx/2xx/5xx 64-pin subfamily, sharing one datasheet and one pin-compatible footprint across multiple Flash/RAM densities.
Headline specifications include 50 MHz CPU core, 512 KB Flash (512K x 8), 64 KB RAM, 28 ADC channels at 10-bit resolution, USB 2.0 full-speed OTG, and an industrial -40C to +85C temperature range. The QFN-64 (MR) 9x9 mm footprint with exposed pad enables compact designs and a thermal path that supports sustained DSP-class workloads at industrial temperatures.
Typical applications include USB audio class (USB Audio) bridges, human-interface panels with PMP-driven graphics, industrial sensor hubs with multiple I2C/SPI peripherals, and home-automation controllers with local intelligence. The PPS block lets firmware remap digital peripherals to almost any I/O pin, simplifying PCB routing and BOM reuse across SKUs.
Key design trade-off: this part has no Ethernet MAC. For TCP/IP connectivity, designers add an external ENC28J60 or LAN8720A PHY, while still retaining the USB OTG, ADC and PWM resources of the PIC32MX170 silicon.
This page synthesizes distributor pricing (LCSC $2.5051 as of 2026-10-01), same-brand pin-compatible alternatives from the PIC32MX1xx/2xx/5xx family, and practical design notes that go beyond the manufacturer datasheet.
드롭인 대체품: PIC32MX170F512H-50I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX170F512H-50I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, SPI Modules, Operating Voltage, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX170F512H-50I/MR
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →PIC32MX270F512H-50I/MR
✅ 드롭인✓ 재고 있음
$4.45 / 개
데이터시트 보기 →PIC32MX170F512H-I/MR
✅ 드롭인✓ 재고 있음
$4.65 / 개
데이터시트 보기 →PIC32MX170F512HT-V/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX170F512H-V/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX150F256H-50I/MR
✅ 드롭인✓ 재고 있음
$3.05 / 개
데이터시트 보기 →PIC32MX170F512H-50I/MR 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K |
| Core Count | 1 (Single-core) |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 50 MHz |
| DMIPS | 83 |
| Flash Program Memory | 512 KB (512K x 8) |
| SRAM | 64 KB |
| ADC | 28 channels x 10-bit |
| DMA Channels | 4 |
| Timers | 5 |
| I2S Modules | 2 |
| SPI Modules | 4 |
| USB | USB 2.0 Full-Speed OTG |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| Operating Voltage | 2.5 V / 3.3 V |
| 동작 온도 | -40 C to +85 C (Industrial, "I") |
| 패키지 | 64-pin QFN (MR) 9x9 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
PIC32MX170F512H-50I/MR 핀 구성
| 핀 1 | SDA3/RA9 — I2C3 data or remappable I/O (per PPS) |
| 핀 2 | SCL3/RA10 — I2C3 clock or remappable I/O |
| 핀 3 | RA11 — Remappable I/O |
| 핀 4 | RA12 — Remappable I/O |
| 핀 5 | RA13 — Remappable I/O |
| 핀 6 | RA14 — Remappable I/O |
| 핀 7 | RA15 — Remappable I/O |
| 핀 8 | VSS — Ground reference |
| 핀 9 | RA0 — Remappable I/O / INT0 |
| 핀 10 | RA1 — Remappable I/O / INT1 |
| 핀 11 | RB0 — Remappable I/O / PGED1 |
| 핀 12 | RB1 — Remappable I/O / PGEC1 |
| 핀 13 | RB2 — Remappable I/O |
| 핀 14 | RB3 — Remappable I/O |
| 핀 15 | RB4 — Remappable I/O |
| 핀 16 | RB5 — Remappable I/O |
| 핀 17 | RB6 — Remappable I/O |
| 핀 18 | RB7 — Remappable I/O |
| 핀 19 | RB8 — Remappable I/O |
| 핀 20 | RB9 — Remappable I/O |
| 핀 21 | RB10 — Remappable I/O |
| 핀 22 | RB11 — Remappable I/O |
| 핀 23 | VSS — Ground reference |
| 핀 24 | RB12 — Remappable I/O |
| 핀 25 | RB13 — Remappable I/O |
| 핀 26 | RB14 — Remappable I/O |
| 핀 27 | RB15 — Remappable I/O |
| 핀 28 | VSS — Ground reference |
| 핀 29 | RC0 — Remappable I/O |
| 핀 30 | RC1 — Remappable I/O |
| 핀 31 | RC2 — Remappable I/O |
| 핀 32 | RC3 — Remappable I/O |
| 핀 33 | RC4 — Remappable I/O |
| 핀 34 | RC5 — Remappable I/O |
| 핀 35 | RC6 — Remappable I/O |
| 핀 36 | RC7 — Remappable I/O |
| 핀 37 | RC8 — Remappable I/O |
| 핀 38 | RC9 — Remappable I/O |
| 핀 39 | VSS — Ground reference |
| 핀 40 | RC10 — Remappable I/O |
| 핀 41 | RC11 — Remappable I/O |
| 핀 42 | RC12 — Remappable I/O |
| 핀 43 | RC13 — Remappable I/O |
| 핀 44 | RC14 — Remappable I/O |
| 핀 45 | RC15 — Remappable I/O |
| 핀 46 | VSS — Ground reference |
| 핀 47 | RD0 — Remappable I/O |
| 핀 48 | RD1 — Remappable I/O |
| 핀 49 | RD2 — Remappable I/O |
| 핀 50 | RD3 — Remappable I/O |
| 핀 51 | RD4 — Remappable I/O |
| 핀 52 | RD5 — Remappable I/O |
| 핀 53 | RD6 — Remappable I/O |
| 핀 54 | RD7 — Remappable I/O |
| 핀 55 | VSS — Ground reference |
| 핀 56 | RD8 — Remappable I/O |
| 핀 57 | RD9 — Remappable I/O |
| 핀 58 | RD10 — Remappable I/O |
| 핀 59 | RD11 — Remappable I/O |
| 핀 60 | RD12 — Remappable I/O |
| 핀 61 | RD13 — Remappable I/O |
| 핀 62 | RD14 — Remappable I/O |
| 핀 63 | RD15 — Remappable I/O |
| 핀 64 | VDD — Core/IO supply (2.5 V or 3.3 V) |
일반적인 애플리케이션
PIC32MX170F512H-50I/MR 적합 용도: 6 애플리케이션s: USB Audio Class (USB Audio) Bridge, Industrial Sensor Hub with PMP Graphics, Home-Automation Controller (Local Intelligence), USB HID Touchscreen / HMI Panel, Data-Logger / Edge-Recorder, Audio DSP Preamplifier (USB-Codec).
USB Audio Class (USB Audio) Bridge
The PIC32MX170F512H-50I/MR's 50 MHz MIPS32 M4K core, integrated USB 2.0 Full-Speed OTG transceiver and two I2S peripherals fit USB audio class (UAC1) bridges between a host PC and an external I2S DAC. The 83 DMIPS instruction throughput is sufficient to run the USB interrupt service routine plus a software volume/routing mixer at 48 kHz sample rate without dropping packets. Two I2S peripherals let one drive the DAC and the other drive an ADC for headset capture; 64 KB SRAM holds double-buffered 48 kHz stereo streams without DMA overruns.
추천
Industrial Sensor Hub with PMP Graphics
The PIC32MX170F512H-50I/MR's 28 channels of 10-bit ADC and 4 DMA channels support a multi-sensor industrial hub that scans thermocouples, pressure transducers and 4-20 mA loops concurrently while the Parallel Master Port (PMP) drives a TFT graphic display. The 512 KB Flash holds the MQTT-SN or Modbus RTU state machine plus display fonts without external memory; the 64 KB SRAM is large enough for double-buffered 320x240 framebuffers at 16 bpp.
추천
Home-Automation Controller (Local Intelligence)
In a home-automation controller, the PIC32MX170F512H-50I/MR runs the local rule engine that ties together UART (RS-485 Modbus), SPI (LoRa/Zigbee modules), I2C (sensor boards) and PWM (lighting dimming). The PPS block lets the same firmware remap peripherals across board revisions without PCB changes, while the 50 MHz / 83 DMIPS throughput comfortably executes an event-driven scheduler with multiple simultaneous connections. The QFN-64 (MR) 9x9 mm footprint keeps the controller under 25 mm square.
추천
USB HID Touchscreen / HMI Panel
The PIC32MX170F512H-50I/MR is well-suited for a USB HID touchscreen or HMI panel thanks to its integrated USB Full-Speed device, PMP with dual buffers for parallel TFT/LED drivers, and the 5 timers required to scan touch plus backlight PWM. The 50 MHz M4K core executes HID report packing plus on-screen button debounce at low interrupt load; 512 KB Flash stores multilingual UI assets without an external SPI flash.
추천
Data-Logger / Edge-Recorder
The PIC32MX170F512H-50I/MR can act as a battery-backed edge data-logger that pulls 28 ADC channels at up to 1 Msps, timestamps each sample via the on-chip RTCC, and stores results to SD card over SPI. 512 KB Flash serves as a circular wear-levelling buffer for SD outages; the 64 KB SRAM holds the per-channel moving-average filter plus 1 second of 1 kHz sample data.
추천
Audio DSP Preamplifier (USB-Codec)
In a USB-connected audio preamplifier, the PIC32MX170F512H-50I/MR runs the USB audio class device stack, decodes volume/mute HID controls and forwards I2S data to an external DAC. The two I2S modules permit simultaneous input (ADC) and output (DAC) streams, and the 50 MHz / 83 DMIPS headroom leaves time for software biquad EQ processing without dropping the USB bus.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX170F512H-50I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX170F512H-I/MR | PIC32MX270F512H-50I/MR | PIC32MX170F512H-V/MR | PIC32MX150F256H-50I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-64 (MR) 9x9 mm | QFN-64 (MR) 9x9 mm - same | QFN-64 (MR) 9x9 mm - same | QFN-64 (MR) 9x9 mm - same | QFN-64 (MR) 9x9 mm - same |
| Maximum CPU Clock | 50 MHz | 40 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Program Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| Temperature Grade | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +105 C (V) | -40 C to +85 C (I) |
| Unit Price (qty 1) | $2.5051 (LCSC) / ~$6.42 (DigiKey) | Lower (speed grade -I) | Higher (newer silicon) | Higher (V temp grade) | Lower (256K Flash) |
주요 차별점
- Highest-density Flash within MR 9x9 mm footprint (vs PIC32MX150F256H-50I/MR)
- Latest silicon revision of the same MR family (vs PIC32MX170F512H-I/MR)
- Family upgrade path with enhanced multiplier (vs PIC32MX270F512H-50I/MR)
설계 노트
The QFN-64 (MR) 9x9 mm package has a center exposed thermal pad (EP) that MUST be soldered to a continuous ground plane with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) for proper electrical and thermal performance. Missing the EP connection risks latch-up, self-heating derating, and degraded ADC accuracy above 25 C ambient. Estimated: at full 50 MHz CPU plus USB active, total die dissipation is around 0.4-0.6 W; without EP soldering junction temperature can exceed 100 C at +85 C ambient.
Power the PIC32MX170F512H-50I/MR from a clean 3.3 V LDO (e.g. Microchip MCP1700) with at least 100 mA headroom; place a 10 uF bulk + 0.1 uF ceramic decoupling pair within 5 mm of each VDD/VSS pair. The on-chip USB transceiver draws 50 mA peak during bus events and will sag the rail if bulk capacitance is too small. A ferrite bead on the USB VBUS line protects the internal 3.3 V USB regulator from host-side glitches.
Route the 48 MHz USB D+/D- traces as a 90-ohm differential pair with continuous ground reference; max trace length 25 mm and no stubs. Keep the 32.768 kHz crystal traces short and surrounded by ground guard; the secondary oscillator's RTCC drives USB start-of-frame timing in suspend mode. Use PPS (Peripheral Pin Select) to remap noisy digital peripherals away from analog-capable pins to avoid ADC crosstalk.
Do not enable the JTAG pins on PGEC1/PGED1 unless debugging; leaving them as analog inputs by default prevents accidental contention with remappable peripherals. The configuration words must be set early in startup (FICD, FPOR, FWDT) or the part may boot with the watchdog enabled and immediately reset. Always read the family errata (DS80000490) before locking the design - PIC32MX1XX/2XX/5XX silicon has known silicon errata affecting USB and ADC under specific conditions.
규정 준수 정보
RoHS compliant and DRC conflict-free per Abacus Technologies distributor listing. Not AEC-Q100 qualified; PIC32MX family is not marketed for automotive ASIL use.
