PIC32MX764F128HT-I/MR - 80MHz 32-bit MCU 128KB Flash USB/CAN/ETH | Microchip
부품 번호: PIC32MX764F128HT-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.18 | $9.18 |
| 10 | $8.41 | $84.10 |
| 100 | $7.62 | $762.00 |
| 500 | $6.85 | $3,425.00 |
| 1,000 | $6.04 | $6,040.00 |
PIC32MX764F128HT-I/MR 개요
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit CPU core, volatile and non-volatile memory, and a rich set of programmable peripherals around a shared bus. PIC32MX parts extend the classic PIC architecture to a MIPS-based 32-bit RISC core, sitting in the hierarchy: MCU -> 32-bit MCU -> MIPS M4K core -> PIC32MX family -> PIC32MX5/6/7 connectivity sub-family. This positioning lets the part replace 16-bit or ARM Cortex-M0 designs while keeping the PIC ecosystem, MPLAB X toolchain, and Harmony framework compatibility.
Key features include 128 KB flash (128K x 8), 32 KB RAM, 53 user I/O lines, an internal oscillator with PLL, an 8-bit parallel master port, four 16-bit timers, five input-capture, five output-compare, and a peripheral pin-select engine that remaps digital peripherals to any remappable pin. The MR suffix designates a 64-pin VQFN with an exposed thermal pad, giving the device an exposed pad with 31.4 C/W thermal resistance on a 4-layer JEDEC JESD51 test board.
The PIC32MX764F128HT-I/MR is built on a 0.18 µm CMOS process and supports an industrial -40C to +85C operating range. Its shadow register set and fast interrupt context save restore accelerate real-time responses, while the bus matrix and 4-channel DMA offload the CPU from peripheral and memory-to-memory transfers, freeing cycles for the TCP/IP stack and application logic.
Typical applications include industrial Ethernet nodes, USB device peripherals, CAN-based automotive sub-networks, building automation gateways, and embedded web servers. The integrated Ethernet MAC and USB peripheral pair cleanly with external PHYs and USB transceivers, while the CAN module supports OBD-II and CANopen nodes.
When designing with this part, note that the 'T' suffix denotes tape-and-reel packaging, 'I' is the industrial temperature grade, and 'MR' identifies the 64-pin VQFN. Adecquate PCB copper under the exposed pad is required to meet the published thermal resistance; without it, junction temperature can exceed 85C under continuous full-load operation.
This page synthesizes distributor pricing, drop-in Microchip family alternatives, and design notes not found in the manufacturer datasheet, giving procurement and firmware engineers a single reference for the PIC32MX764F128HT-I/MR.
드롭인 대체품: PIC32MX764F128HT-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX764F128HT-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, CAN, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX564F128HT-I/MR
✅ 드롭인✓ 재고 있음
$4.73 / 개
데이터시트 보기 →PIC32MX664F128H-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX675F512HT-80I/MR
✅ 드롭인✓ 재고 있음
$6.45 / 개
데이터시트 보기 →PIC32MX695F512HT-80I/MR
✅ 드롭인✓ 재고 있음
$8.42 / 개
데이터시트 보기 →PIC32MX575F512H-80I/PT
✅ 드롭인✓ 재고 있음
$5.11 / 개
데이터시트 보기 →PIC32MX764F128HT-I/MR 최대 정격 & 전기적 특성
| Core | MIPS32 M4K |
| Core Architecture | 32-bit RISC |
| Family | PIC32MX5/6/7 |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Data Memory (SRAM) | 32 KB (32K x 8) |
| Number of I/O Pins | 53 |
| 공급 전압 | 2.3 V to 3.6 V |
| 동작 온도 | -40C to +85C (industrial) |
| 패키지 | 64-VQFN (9x9 mm) with exposed thermal pad |
| 실장 유형 | Surface Mount |
| DMA Channels | 4 |
| ADC | 16-channel, 10-bit |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | CAN 2.0B |
| Ethernet | 10/100 Mbps MAC (external PHY required) |
| Timers | Five 16-bit, two 32-bit (capture/compare) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Oscillator Type | Internal with PLL |
PIC32MX764F128HT-I/MR 핀 구성
| 핀 1 | RP15/RD15 — Remappable I/O, also RD15 |
| 핀 2 | RP14/RD14 — Remappable I/O, also RD14 |
| 핀 3 | RP13/RD13 — Remappable I/O, also RD13 |
| 핀 4 | RP12/RD12 — Remappable I/O, also RD12 |
| 핀 5 | RP11/RD11 — Remappable I/O, also RD11 |
| 핀 6 | RP10/RD10 — Remappable I/O, also RD10 |
| 핀 7 | RP9/RD9 — Remappable I/O, also RD9 |
| 핀 8 | VDD — 3.3 V core supply |
| 핀 9 | RP8/RD8 — Remappable I/O, also RD8 |
| 핀 10 | RP7/RD7 — Remappable I/O, also RD7 |
| 핀 11 | RP6/RD6 — Remappable I/O, also RD6 |
| 핀 12 | RP5/RD5 — Remappable I/O, also RD5 |
| 핀 13 | RP4/RD4 — Remappable I/O, also RD4 |
| 핀 14 | RP3/RD3 — Remappable I/O, also RD3 |
| 핀 15 | RP2/RD2 — Remappable I/O, also RD2 |
| 핀 16 | RP1/RD1 — Remappable I/O, also RD1 |
| 핀 17 | RP0/RD0 — Remappable I/O, also RD0 |
| 핀 18 | AVDD — Analog supply for ADC |
| 핀 19 | AVSS — Analog ground |
| 핀 20 | VREF+ — ADC voltage reference positive |
| 핀 21 | VREF- — ADC voltage reference negative |
| 핀 22 | AN0/C2IN+/RP4 — Analog input 0 / comparator input |
| 핀 23 | AN1/C2IN-/RP3 — Analog input 1 |
| 핀 24 | AN2/C1IN+/RP2 — Analog input 2 |
| 핀 25 | AN3/C1IN-/RP1 — Analog input 3 |
| 핀 26 | AN4/RB0 — Analog input 4 |
| 핀 27 | AN5/RB1 — Analog input 5 |
| 핀 28 | AN6/RB2 — Analog input 6 |
| 핀 29 | AN7/RB3 — Analog input 7 |
| 핀 30 | AN8/RB4 — Analog input 8 |
| 핀 31 | AN9/RB5 — Analog input 9 |
| 핀 32 | AN10/RB6 — Analog input 10 |
| 핀 33 | AN11/RB7 — Analog input 11 |
| 핀 34 | AN12/RB8 — Analog input 12 |
| 핀 35 | AN13/RB9 — Analog input 13 |
| 핀 36 | D+/RG2 — USB D+ data line |
| 핀 37 | D-/RG3 — USB D- data line |
| 핀 38 | VBUS — USB VBUS detect input |
| 핀 39 | VUSB — USB 3.3 V supply |
| 핀 40 | RG15 — General-purpose I/O |
| 핀 41 | RG12 — General-purpose I/O |
| 핀 42 | RG13 — General-purpose I/O |
| 핀 43 | RG14 — General-purpose I/O |
| 핀 44 | RA15 — General-purpose I/O |
| 핀 45 | RA14 — General-purpose I/O |
| 핀 46 | VDD — 3.3 V core supply |
| 핀 47 | VSS — Digital ground |
| 핀 48 | RA9 — General-purpose I/O |
| 핀 49 | RA8 — General-purpose I/O |
| 핀 50 | RA10 — General-purpose I/O |
| 핀 51 | RA7 — General-purpose I/O |
| 핀 52 | RA6 — General-purpose I/O |
| 핀 53 | RA5 — General-purpose I/O |
| 핀 54 | RA4 — General-purpose I/O |
| 핀 55 | RA3 — General-purpose I/O |
| 핀 56 | RA2 — General-purpose I/O |
| 핀 57 | RA1 — General-purpose I/O |
| 핀 58 | RA0 — General-purpose I/O |
| 핀 59 | MCLR — Master clear reset input |
| 핀 60 | SOSCI/RF13 — Secondary oscillator input or GPIO |
| 핀 61 | SOSCO/RF12 — Secondary oscillator output or GPIO |
| 핀 62 | CLKI/RC12 — External clock input or GPIO |
| 핀 63 | OSC1/RC15 — Primary oscillator input |
| 핀 64 | OSC2/RC14 — Primary oscillator output |
일반적인 애플리케이션
PIC32MX764F128HT-I/MR 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, USB Device Peripherals, CAN-based Automotive Sub-Networks, Building Automation and HVAC Controllers, Embedded Web Server / IoT Node, Data Acquisition and Control Module.
Industrial Ethernet Gateway
The PIC32MX764F128HT-I/MR's integrated 10/100 Ethernet MAC and 80 MHz MIPS32 M4K core make it ideal for industrial protocol-conversion gateways. The MAC supports MII and RMII to external PHYs such as the LAN8720A, and the 32 KB SRAM holds a Modbus TCP server plus Profibus-to-Ethernet bridge tables. The 4-channel DMA offloads TCP/IP packet transfers, freeing the CPU for application logic. The 128 KB flash accommodates the MPLAB Harmony TCP/IP stack with TLS, and the -40C to +85C industrial range tolerates factory-floor temperatures.
추천
USB Device Peripherals
The PIC32MX764F128HT-I/MR integrates USB 2.0 full-speed Device/Host/OTG with on-chip transceivers, eliminating the need for an external PHY. Its 16-channel 10-bit ADC samples sensor data at up to 500 ksps, while 4-channel DMA streams samples to USB endpoints without CPU intervention. The 53 user I/O lines drive indicator LEDs and accept user inputs, and 32 KB RAM comfortably buffers USB HID or CDC transfers. Designers can implement CDC virtual COM ports, HID keyboards, or vendor-class devices using the MPLAB Harmony USB framework.
추천
CAN-based Automotive Sub-Networks
The PIC32MX764F128HT-I/MR's integrated CAN 2.0B module supports bit rates up to 1 Mbit/s, with 32 acceptance filters and masks for message routing. The 80 MHz MIPS32 M4K core handles the OBD-II response stack and CANopen SDO transfers with comfortable headroom. 128 KB flash holds the CANopen or J1939 protocol stack plus application logic, and 32 KB SRAM buffers incoming PDOs. The exposed thermal pad and 64-pin VQFN footprint are suited to automotive sub-network modules and body-control accessories in non-safety-critical zones.
추천
Building Automation and HVAC Controllers
The PIC32MX764F128HT-I/MR's combination of USB, CAN, and Ethernet interfaces suits BACnet, Modbus, and LonWorks building-automation controllers. The 16-channel 10-bit ADC reads temperature, humidity, and pressure sensors, while the 5 output-compare units generate PWM for damper and valve actuators. The 128 KB flash hosts the BACnet/IP stack, and the -40C to +85C range covers unheated plant-room environments. The peripheral pin-select engine remaps UART and SPI to free pins, simplifying PCB layout when the design grows beyond 53 I/Os.
추천
Embedded Web Server / IoT Node
The PIC32MX764F128HT-I/MR runs an embedded HTTP/HTTPS web server via the MPLAB Harmony TCP/IP stack, with the 80 MHz core handling TLS handshakes and 32 KB SRAM caching connection state. The peripheral pin-select engine maps SPI to an external Wi-Fi or Ethernet module if the user prefers modular connectivity. 128 KB flash stores web pages, REST handlers, and JSON payloads, while the 4-channel DMA accelerates SPI transfers to flash storage. Industrial temperature range supports outdoor enclosures.
추천
Data Acquisition and Control Module
The PIC32MX764F128HT-I/MR's 16-channel 10-bit ADC, five input-capture, and five output-compare units provide a complete data-acquisition front-end for test and measurement modules. The 4-channel DMA streams ADC samples to RAM at 500 ksps aggregate, while the Ethernet MAC uploads data to a host PC. 32 KB SRAM buffers 16,000 samples (10-bit) before transfer, and 128 KB flash holds calibration constants and control algorithms. The 53 user I/O lines drive front-panel buttons and displays, making the part a fit for compact bench instruments.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX764F128HT-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX564F128HT-I/MR | PIC32MX664F128H-I/MR | PIC32MX675F512HT-80I/MR | PIC32MX695F512HT-80I/MR | PIC32MX575F512H-80I/PT |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 128 KB | 128 KB | 128 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Ethernet MAC | 10/100 Mbit | Not present | 10/100 Mbit | 10/100 Mbit | 10/100 Mbit | Not present |
| USB | USB 2.0 FS | USB 2.0 FS | USB 2.0 FS | USB 2.0 FS | USB 2.0 FS/HS OTG | Not present |
| CAN | 1x CAN 2.0B | 1x CAN 2.0B | Not present | 1x CAN 2.0B | 1x CAN 2.0B | Not present |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
주요 차별점
- Full Ethernet MAC plus dual CAN in a single 64-pin VQFN (vs PIC32MX564F128HT-I/MR)
- USB 2.0 with on-chip transceiver plus peripheral pin-select (vs PIC32MX575F512H-80I/PT)
- Industrial temperature grade and exposed thermal pad (vs PIC32MX675F512HT-80I/MR)
설계 노트
The 64-pin VQFN exposed thermal pad MUST be soldered to a copper pour of at least 1 square inch (645 mm^2) on a 4-layer JEDEC JESD51 test board. Without this, theta_JA degrades from approximately 31 C/W to above 50 C/W, and at 80 MHz full-load the junction temperature can exceed 100C at 70C ambient. Place at least 8 thermal vias (0.3 mm drill, 1 oz plating) under the pad to break the thermal barrier.
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 5 mm of the pin and tied to a low-impedance ground via. AVDD needs its own 100 nF decoupling plus a 10 uF bulk; VUSB needs a 10 uF bulk if USB host mode is used. Keep the USB D+/D- traces at 90 ohm differential, length-matched within 2 mm, and isolated from switching signals to avoid radiated EMI compliance failures.
Do not enable JTAG and ICSP simultaneously on the same port without verifying the pin mapping, otherwise debugging will fail. Ensure the MCLR pin has a 10 kohm pull-up and a 100 nF cap to ground for in-circuit serial programming stability. AVDD must be powered at the same time as VDD; floating AVDD causes spurious ADC readings and unpredictable behavior on the comparator peripherals.
규정 준수 정보
RoHS compliant per Microchip product page; lead-free (Pb-free) matte-tin finish on VQFN leads; industrial temperature grade -40C to +85C; not AEC-Q100 qualified - this is a 32-bit MCU for industrial connectivity, not automotive safety-critical applications.
