PIC32MZ1025DAK169T-I/HF - 200MHz 32-bit MCU 1MB Flash LFBGA-169 | Microchip
부품 번호: PIC32MZ1025DAK169T-I/HF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.85 | $14.85 |
| 10 | $13.52 | $135.20 |
| 100 | $12.08 | $1,208.00 |
| 500 | $10.93 | $5,465.00 |
| 1,000 | $9.75 | $9,750.00 |
PIC32MZ1025DAK169T-I/HF 개요
A 32-bit microcontroller (MCU) is a programmable system-on-chip that combines a high-performance processor core, Flash program memory, SRAM data memory, and a rich set of analog and digital peripherals in a single package. Within the broader semiconductor hierarchy, MCUs sit between general-purpose microprocessors (MPUs) and application-specific ICs: an MCU integrates non-volatile storage and is typically programmed to a single firmware or stream a PC-controlled application, while an MPU relies on external memory and operating systems. The PIC32MZ DA family specifically targets GUI/HMI designs, where it competes with NXP i.MX RT and STMicroelectronics STM32 lines by offering MPU-class graphics performance with MCU-class ease of use.
Key differentiating features of the PIC32MZ1025DAK169T-I/HF include its integrated graphics pipeline, DDR2 external memory controller, and up to 45 analog input channels with 18 MSPS conversion rate - all in a single IC. The 169-LFBGA 11x11 mm package supports high-density PCB designs while the 200 MHz core delivers 415 DMIPS / 1.6 DMIPS/MHz, suiting real-time GUI workloads. Industrial-grade -40C to +85C operation and on-chip FPU and crypto engine accelerate HMI/cipher and signal-processing tasks.
Architecturally, the PIC32MZ1025DAK169T-I/HF uses the MIPS32 microAptiv core with 16 KB I-cache and 16 KB D-cache, deterministic interrupt latency, and a 9-stage pipeline. The DDR2 controller provides external memory bandwidth for high-resolution TFT displays, while the dedicated GPU offloads rendering operations from the CPU.
Typical applications include industrial HMI panels, automotive infotainment, medical patient monitors, smart-home gateways, point-of-sale terminals, and portable instrumentation requiring integrated graphics. Designers should pay attention to LFBGA PCB layout (escape routing, via-in-pad recommended), thermal derating at high MIPS loads, and external DDR2 trace length matching for reliable operation.
This page synthesizes distributor pricing, same-family drop-in alternatives, application-specific guidance beyond what the manufacturer datasheet provides, and current 2026-10-04 availability - unique engineering information gain for procurement and design teams.
드롭인 대체품: PIC32MZ1025DAK169T-I/HF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1025DAK169T-I/HF (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Operating Temperature, Mounting Type, Package, CAN.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1025DAK169-I/HF
✅ 드롭인✓ 재고 있음
$10.95 / 개
데이터시트 보기 →PIC32MZ1025DAB169T-I/HF
✅ 드롭인✓ 재고 있음
$12.65 / 개
데이터시트 보기 →PIC32MZ1025DAK169T-V/HF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1025DAK169T-I/HF 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 microAptiv |
| Product Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| CPU Core Count | 1 |
| Maximum CPU Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 640 KB |
| External Memory Interface | DDR2 DRAM, up to 32 MB or 128 MB addressable |
| Graphics Controller | Integrated |
| Graphics Processor (GPU) | Integrated |
| ADC Resolution | 12-bit |
| ADC Sampling Rate | 18 MSPS |
| Analog Input Count | Up to 45 |
| 패키지 | 169-LFBGA (11x11 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial, -I suffix) |
| RoHS 상태 | Compliant |
| CAN | Yes |
| USB | High-Speed USB |
| Pin/Ball Count | 169 |
PIC32MZ1025DAK169T-I/HF 169-lfbga (11x11 mm) 핀 구성 가이드
PIC32MZ1025DAK169T-I/HF(169-lfbga (11x11 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ1025DAK169T-I/HF.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ1025DAK169T-I/HF 적합 용도: 6 애플리케이션s: Industrial HMI Panels, Automotive Infotainment, Medical Patient Monitors, Point-of-Sale Terminals, Smart Home Gateways, Portable Test & Measurement.
Industrial HMI Panels
The PIC32MZ1025DAK169T-I/HF is engineered for industrial human-machine interface panels requiring an integrated GPU plus 169-LFBGA 11x11 mm form factor. With its dedicated GPU, the part delivers smooth 2D rendering for TFT touchscreens at WVGA and higher resolutions, while the external DDR2 controller supports framebuffers up to 32 MB or 128 MB addressable. The 12-bit 18 MSPS ADC with up to 45 analog inputs handles analog sensor inputs from temperature, pressure, and current transducers. Industrial -40C to +85C operation and CAN bus support enable deployment directly on factory floor controllers and machine-control enclosures.
추천
Automotive Infotainment
The PIC32MZ1025DAK169T-I/HF serves automotive infotainment and cluster display designs that need 32-bit MCU ease of use with MPU-class graphics. Its integrated GPU accelerates 2D and 3D instrument cluster rendering, while the CAN bus interface connects to body and powertrain networks. Although the -I grade is industrial, the same die in -V packaging (-40C to +105C) addresses automotive cabin environments. The 200 MHz MIPS32 microAptiv core executes real-time OS kernels and HMI logic, and the 640 KB SRAM plus DDR2 controller manage rich graphics assets and audio buffering.
추천
Medical Patient Monitors
The PIC32MZ1025DAK169T-I/HF fits medical patient monitoring equipment that requires integrated graphics plus multi-channel analog acquisition. The 12-bit 18 MSPS ADC with up to 45 analog inputs handles ECG, SpO2, temperature, and respiration signals in parallel. The integrated GPU drives the bedside TFT display with smooth waveforms and trend graphs, while the 200 MHz core processes real-time DSP filtering. Industrial temperature grade plus 1 MB Flash allows IEC 62304-compliant firmware with a full safety stack. The DDR2 controller handles large waveform buffers and historical data without external memory ICs.
추천
Point-of-Sale Terminals
The PIC32MZ1025DAK169T-I/HF targets point-of-sale terminals that demand secure transactions plus multi-protocol connectivity. The 200 MHz MIPS32 core runs TLS/SSL stacks, payment applications, and printer drivers concurrently, while the integrated GPU drives the merchant-facing touchscreen. High-Speed USB supports peripherals like barcode scanners and receipt printers, and the CAN interface enables integration with store automation backbones. 1 MB Flash accommodates full application images plus bootloader, and the 640 KB SRAM keeps transaction pipelines in-chip. Industrial temperature operation suits retail back-room and outdoor kiosk deployments.
추천
Smart Home Gateways
The PIC32MZ1025DAK169T-I/HF is well-suited for smart-home gateways and home automation hubs that combine local control plus touchscreen-based dashboards. The integrated GPU renders animated home-control UIs on integrated TFT displays, while CAN plus HS USB provide connectivity to sensors and peripherals. With 640 KB SRAM and DDR2 support, the device manages Zigbee/Z-Wave/WiFi proxy stacks and on-device rule processing at the edge. The 169-LFBGA package supports compact hub enclosures with high-density PCB designs, and 1 MB Flash stores gateway firmware plus OTA staging images.
추천
Portable Test & Measurement
The PIC32MZ1025DAK169T-I/HF suits portable test and measurement instruments such as oscilloscopes, logic analyzers, and field testers. The 12-bit 18 MSPS ADC with up to 45 analog inputs captures high-bandwidth waveforms while the 200 MHz core performs real-time DSP for FFT and protocol decoding. The integrated GPU drives high-resolution displays showing waveforms, while the DDR2 controller handles deep acquisition memory. Industrial temperature rating supports field use, and CAN plus HS USB allow instrument clustering and PC connectivity. The 1 MB Flash stores instrument firmware plus calibration data with secure boot.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1025DAK169T-I/HF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1025DAK169-I/HF | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAK169T-V/HF |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| CPU Core | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit |
| Max CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB |
| External Memory | DDR2 up to 32 MB or 128 MB addressable | DDR2 up to 32 MB or 128 MB addressable | DDR2 smaller window | DDR2 up to 32 MB or 128 MB addressable |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Extended) |
| Graphics Controller | Integrated GPU + LCD controller | Integrated GPU + LCD controller | Integrated GPU + LCD controller | Integrated GPU + LCD controller |
| ADC | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, up to 45 channels |
주요 차별점
- Industrial operating temperature grade -40C to +85C (vs PIC32MZ1025DAK169T-V/HF)
- Larger external DDR2 address window of up to 32 MB or 128 MB (vs PIC32MZ1025DAB169T-I/HF)
- Tape-and-reel packaging code (T suffix) for SMT production lines (vs PIC32MZ1025DAK169-I/HF)
설계 노트
The 169-LFBGA 11x11 mm package requires via-in-pad escape routing for reliable assembly. Use a 6-layer or thicker PCB stackup with dedicated ground and power planes directly beneath the BGA. Microchip recommends 0.4 mm ball pitch with non-solder-mask-defined (NSMD) pads and micro-via diameters of 0.2 mm or smaller to avoid solder joint voiding during reflow.
DDR2 external memory requires strict trace length matching within +/- 25 mils (0.6 mm) for clock, address, command, and data groups. Termination resistors and reference voltage (Vref) must follow the JEDEC DDR2 standard. Failing to match lengths causes intermittent read/write failures under temperature stress, and Vref drift directly degrades signal integrity.
At full 200 MHz MIPS load with the DDR2 controller active and the GPU rendering full-screen updates, internal power dissipation can exceed 1 W. Without sufficient copper pour (at least 1 square inch connected to the LFBGA thermal balls), junction temperature climbs toward 125C. Add thermal vias beneath the thermal ball array and connect to internal ground planes for heat spreading.
Place the 12-bit ADC analog inputs physically separated from high-speed digital GPIO and TFT display signals. Use a ferrite bead or pi-filter on the AVDD supply pin to isolate analog and digital domains. Microchip's PIC32MZ DA family datasheet recommends a dedicated ground plane partition under analog traces to maximize ADC SNR and minimize crosstalk from switching noise.
규정 준수 정보
RoHS and lead-free per Microchip product page. Industrial -I grade; choose -V variant for automotive-style environmental testing. AEC-Q100 qualification not explicitly stated for this part number.