PIC32MZ1064DAK176-V/2J - 200MHz 32-bit MCU, 1MB Flash, 176-LQFP | Microchip
부품 번호: PIC32MZ1064DAK176-V/2J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.62 | $14.62 |
| 10 | $13.18 | $131.80 |
| 100 | $11.74 | $1,174.00 |
| 500 | $10.55 | $5,275.00 |
| 1,000 | $9.51 | $9,510.00 |
PIC32MZ1064DAK176-V/2J 개요
A 32-bit microcontroller (MCU) is an integrated processor core, memory and peripherals on a single silicon die, designed for embedded control tasks. The PIC32MZ family specifically bridges MCU simplicity with MPU-class performance, providing high computational throughput, large memory footprints, and rich peripherals (DDR2 controller, 12-bit ADC, USB, CAN). This product sits within the Graphics (DAK/DAL/DAR/DAS) family, a hypernym taxonomy of: microcontroller -> 32-bit MCU -> MIPS-based MCU -> PIC32MZ -> PIC32MZ Graphics family.
Key differentiating features include 1 MB on-chip Flash, integrated DDR2 DRAM controller supporting up to 128 MB external memory, dedicated 2D Graphics Processing Unit (GPU), 12-bit 18 MSPS ADC with up to 45 analog inputs, Hi-Speed USB 2.0, CAN, and up to 200 MHz CPU clock. The 640 KB SRAM is split between main and a tightly-coupled cache, delivering deterministic throughput for HMI rendering.
The device uses a 5-stage pipeline MIPS32 microAptiv core with Harvard architecture, MMU and dual ICache/DCache. The integrated GPU accelerates line draw, block transfer, chroma keying and alpha blending, offloading display tasks from the CPU. The DDR2 interface allows large framebuffers to be placed in low-cost external DRAM rather than on-chip SRAM.
Typical applications include industrial HMI panels, medical graphical displays, automotive cluster displays, point-of-sale terminals, and any GUI-driven embedded product requiring MPU-class performance with MCU simplicity. The wide peripheral set (USB, CAN, ADC, PWM) makes it a single-chip solution for graphical industrial controllers.
When designing, ensure the DDR2 trace lengths are matched per JEDEC recommendations and that the LQFP-176 thermal pad is soldered to the PCB ground plane for adequate heat dissipation. Decoupling capacitors should be placed within 3 mm of each power pin per the manufacturer reference design.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet, helping engineers accelerate design-in.
드롭인 대체품: PIC32MZ1064DAK176-V/2J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1064DAK176-V/2J (동일 폼 팩터 및 풋프린트) — 차이점: USB, Core Architecture, External Memory Interface, CAN, Graphics Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1064DAK176T-V/2J
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1064DAK176-I/2J
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1025DAK176-V/2J
✅ 드롭인✓ 재고 있음
$5.72 / 개
데이터시트 보기 →PIC32MZ1025DAS176T-V/2J
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →PIC32MZ1025DAR176-V/2J
✅ 드롭인✓ 재고 있음
$15.92 / 개
데이터시트 보기 →PIC32MZ1064DAB176-I/2J
✅ 드롭인✓ 재고 있음
$4.45 / 개
데이터시트 보기 →PIC32MZ1064DAK176-V/2J 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Core Count | Single-Core |
| Maximum CPU Frequency | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 640 KB (per family datasheet) |
| External Memory Interface | DDR2 DRAM controller, up to 128 MB |
| Graphics Controller | Integrated 2D GPU |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| 패키지 | 176-LQFP (20x20 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +105C (V-temp) |
| Temperature Grade | V-temp (Industrial) |
| RoHS 상태 | Compliant |
PIC32MZ1064DAK176-V/2J 176-lqfp (20x20 mm) 핀 구성 가이드
PIC32MZ1064DAK176-V/2J(176-lqfp (20x20 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ1064DAK176-V/2J.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ1064DAK176-V/2J 적합 용도: 8 애플리케이션s: Industrial HMI Control Panels, Medical Graphical Displays, Point-of-Sale Terminals, Automotive Cluster Displays, Smart Home Control Panels, Industrial IoT Gateways with Display, Avionics Secondary Displays, Building Automation Touch Panels.
Industrial HMI Control Panels
The PIC32MZ1064DAK176-V/2J is purpose-built for industrial HMI control panels where engineers need MPU-class graphics performance with MCU simplicity. Its 200 MHz MIPS32 microAptiv core combined with the integrated 2D GPU and DDR2 controller (supporting up to 128 MB external memory) can drive large TFT displays with smooth rendering of buttons, gauges, and trend charts. The 12-bit 18 MSPS ADC with up to 45 analog inputs accepts sensor inputs for process monitoring, while Hi-Speed USB and CAN support connectivity to PLCs and supervisory systems. The V-temp grade (-40C to +105C) tolerates factory floor environments, making it ideal for human-machine interfaces on machine tools, packaging equipment, and process automation skids.
추천
Medical Graphical Displays
Medical devices such as patient monitors, infusion pumps, and diagnostic imaging consoles require reliable graphical interfaces to convey critical information. The PIC32MZ1064DAK176-V/2J delivers deterministic real-time rendering via the dedicated 2D GPU, which offloads drawing tasks from the CPU to maintain consistent frame rates on medical displays. The DDR2 interface accommodates large waveform and image buffers, while the 12-bit ADC handles analog sensor inputs from ECG, SpO2, and temperature transducers. The MIPS32 core's deterministic interrupt latency supports safety-critical response timing, and the V-temp grade supports clinical and laboratory environments. Compact 176-LQFP packaging keeps PCB footprint small for portable medical instruments.
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Point-of-Sale Terminals
Point-of-sale (POS) terminals combine a graphical touch interface, barcode scanning, payment processing, and connectivity. The PIC32MZ1064DAK176-V/2J provides all these capabilities on a single chip: the 2D GPU drives the touchscreen GUI, Hi-Speed USB interfaces to barcode readers and receipt printers, and CAN or Ethernet handles back-office connectivity. The 1 MB Flash stores the firmware and graphical assets, while 640 KB SRAM supports transaction buffering and UI rendering. The industrial V-temp grade suits both indoor retail and outdoor market environments. Single-chip integration reduces BOM cost versus MCU plus external graphics chip architectures.
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Automotive Cluster Displays
Instrument cluster displays in two-wheelers, EVs, and aftermarket automotive products require graphical rendering of speed, RPM, fuel, and warning indicators. The PIC32MZ1064DAK176-V/2J handles TFT panel driving via its integrated GPU and DDR2 framebuffer support, with the 200 MHz MIPS32 core computing speedometer and tachometer dynamics in real time. CAN connectivity links the cluster to vehicle ECUs for sensor data, while the 12-bit ADC reads analog automotive sensors. Although not AEC-Q100 qualified, the device's V-temp grade supports under-dash thermal environments in non-safety-critical cluster applications such as two-wheeler dashes and EV auxiliary displays.
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Smart Home Control Panels
Wall-mounted smart home control panels combine a touchscreen interface with multi-protocol wireless connectivity (Wi-Fi, Zigbee, Thread, BLE) for controlling lights, HVAC, and security systems. The PIC32MZ1064DAK176-V/2J drives the touchscreen GUI through its integrated 2D GPU while the MIPS32 core runs the application logic and home automation protocols. USB connects to external wireless modules, and the 12-bit ADC reads analog sensors like temperature and humidity. The compact 176-LQFP package fits behind slim wall-mount enclosures, and the V-temp grade handles indoor environmental variation. Compared to host processor + external MCU designs, the single-chip approach reduces cost and simplifies firmware development.
추천
Industrial IoT Gateways with Display
Edge IoT gateways aggregate sensor data from field devices, apply local analytics, and present status on a local graphical display. The PIC32MZ1064DAK176-V/2J serves both roles: its Ethernet/USB connectivity handles field-bus aggregation, while the 2D GPU renders local dashboards showing sensor trends, alarm states, and connectivity status. The DDR2 controller supports large historical data buffers, and the 12-bit ADC reads analog sensor inputs directly. The 200 MHz MIPS32 core runs edge analytics in real time. V-temp grade supports factory floor and outdoor enclosure environments. This combination replaces traditional MCU + display controller + external memory designs with a single integrated solution.
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Avionics Secondary Displays
Secondary cockpit displays such as engine monitors, fuel quantity indicators, and backup instruments require reliable graphical rendering under wide temperature variation. The PIC32MZ1064DAK176-V/2J drives these displays via its 2D GPU and DDR2 framebuffer, while the 200 MHz MIPS32 core computes flight parameters in real time. Hi-Speed USB supports firmware loading and data logging, and CAN interfaces to avionics buses. The V-temp grade handles avionics bay thermal environments. Although not DO-178 qualified for primary flight displays, it is suitable for non-safety-critical secondary displays in UAV ground stations and experimental avionics where its cost-effective graphics performance is advantageous.
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Building Automation Touch Panels
Building automation touch panels centralize control of HVAC, lighting, blinds, and security across commercial buildings. The PIC32MZ1064DAK176-V/2J's 2D GPU drives the multi-zone graphical interface, while CAN or Ethernet connects to BACnet, Modbus, or KNX field buses. The 1 MB Flash stores zone configuration and graphical assets, and 640 KB SRAM supports runtime UI state. The 12-bit ADC accepts analog inputs from light sensors and temperature probes. The V-temp grade covers indoor plenum environments. Compared to MCU plus external touch controller designs, the integrated solution reduces BOM cost and simplifies EMC compliance.
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추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1064DAK176-V/2J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1064DAK176T-V/2J | PIC32MZ1064DAK176-I/2J | PIC32MZ1025DAK176-V/2J | PIC32MZ1025DAS176T-V/2J |
|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv 32-bit @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 2 MB | 2 MB |
| Integrated GPU | Yes (2D) | Yes | Yes | Yes | Yes |
| DDR2 Controller | Yes (up to 128 MB external) | Yes | Yes | Yes | Yes |
| Temperature Grade | V-temp (-40C to +105C) | V-temp | I-temp (-40C to +85C) | V-temp | V-temp |
| Hi-Speed USB | Yes | Yes | Yes | Yes | Yes |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes |
| ADC | 12-bit, 18 MSPS, up to 45 inputs | 12-bit, 18 MSPS | 12-bit, 18 MSPS | 12-bit, 18 MSPS | 12-bit, 18 MSPS |
주요 차별점
- Integrated 2D GPU with DDR2 controller in single MCU (vs PIC32MZ1064DAL176)
- 1 MB Flash with 640 KB SRAM for graphics workloads (vs PIC32MX795F512L)
- V-temp grade for industrial environments (vs PIC32MZ1064DAK176-I/2J)
- 12-bit 18 MSPS ADC with 45 analog inputs (vs PIC32MX695F512L)
- Single-chip MCU + MPU-class graphics integration (vs External MCU + external GPU architectures)
설계 노트
Estimated: The PIC32MZ1064DAK176-V/2J operates from a single 3.3V supply (2.3V-3.6V range). Place 100 nF decoupling capacitors within 3 mm of each VDDCORE, VDDIO, and VDDPHY pin. A bulk 10 uF ceramic capacitor near the package's power pins reduces supply droop during DDR2 burst operations, which can draw transients exceeding 200 mA. Add a ferrite bead between the 3.3V regulator and DDR2 supply rail to isolate digital switching noise.
At 200 MHz CPU load with DDR2 active, the 176-LQFP package dissipates approximately 0.5-1W depending on peripheral activity. Solder the exposed thermal pad (if present on the package variant) to a 4x4 cm copper pour with thermal vias to the inner ground plane to keep junction temperature below 100C at 105C ambient. Without thermal management, derate the operating frequency or ambient temperature.
DDR2 traces require matched lengths per JEDEC recommendations: data byte lanes within +/-25 mil, clock to strobe within +/-20 mil. Place the DDR2 memory as close as possible to the MCU (within 50 mm) to minimize reflections. Use 50 ohm controlled impedance for DDR2 traces, with reference to a continuous ground plane 4 mils below the signal layer. Avoid routing DDR2 signals across plane splits.
Do not enable DDR2 without first configuring the DDR2 controller's timing parameters for the specific DRAM chip used. Read the SPD or manually enter CAS latency, tRCD, tRP, and tRFC from the DRAM datasheet. Mismatched timing causes intermittent boot failures or data corruption. Also ensure the DDR2 supply voltage is correctly set to 1.8V (not 3.3V) before enabling the controller.
Route Hi-Speed USB differential pair (D+/D-) with 90 ohm differential impedance, keeping traces matched within 150 mil. Place the USB ESD protection diode within 3 mm of the USB connector. Keep the crystal traces short (under 5 mm) and surrounded by ground pour to avoid noise coupling into the oscillator. Use a guard ring around the RTC crystal to minimize leakage from adjacent noisy traces.
규정 준수 정보
RoHS and REACH compliant per Microchip product environmental declarations. Lead-free 176-LQFP package. Not AEC-Q100 qualified; the device is not designed for automotive safety-critical applications.