S9S08RN60W1MLH - 8-bit S08 MCU, 60KB Flash, Automotive | NXP
부품 번호: S9S08RN60W1MLH ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $12.85 | $128.50 |
| 100 | $10.95 | $1,095.00 |
| 500 | $9.4 | $4,700.00 |
| 1,000 | $8.2 | $8,200.00 |
S9S08RN60W1MLH 개요
A microcontroller (MCU) is a self-contained computing subsystem that pairs a CPU, program and data memory, and integrated peripherals into a single chip. The 8-bit S08 architecture uses an enhanced 68HC08 instruction set optimized for byte-level control with deterministic interrupt response, an order of magnitude smaller code footprint than typical 32-bit MCUs, and an ultra-low-power profile suited to always-on automotive body and chassis functions. Within the power-management hierarchy, an MCU like the S9S08RN60 sits between power-conversion ICs and sensor/actuator loads, consuming regulated supply rails while orchestrating them through firmware.
The device integrates hardware CRC generation, byte-erasable Flash with read/program/erase across the full operating range, 256 bytes of EEPROM with ECC, an FLL with a wide reference-divider range, and flexible clock sources (FEI, FEE, FBE, FBI, FBELP, FBILP) that allow crystal-, resonator-, or internal-reference-based designs without external PLL hardware.
The 20MHz S08 core combined with the integrated peripheral set enables deterministic closed-loop control loops, while the automotive-grade temperature rating makes the part suitable for under-hood and cabin sub-systems where consumer-grade MCUs are not qualified.
Typical applications include automotive body controllers, HVAC actuators, seat and mirror modules, sensor conditioning front-ends, and LIN slave nodes; its cost-optimized footprint also fits industrial control panels, appliance user-interface modules, and small BLDC/PMSM fan or pump drivers.
Designers should pay attention to decoupling: place 100nF X7R capacitors on every AVDD/VDD pair adjacent to the pins, and provide a bulk 4.7µF or larger near the regulator input.
This page consolidates distributor pricing, drop-in same-package alternatives from the S08RN family, and practical design notes that go beyond what is repeated on typical distributor product listings.
드롭인 대체품: S9S08RN60W1MLH — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
S9S08RN48W1MLH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08RN32W1MLH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08RN16W1MLH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08RN60W1MLH 최대 정격 & 전기적 특성
| Core Processor | S08 |
| Core Size | 8-bit |
| Maximum Clock Speed | 20 MHz |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB |
| EEPROM Size | 256 bytes (with ECC) |
| Number of I/O Pins | 55 |
| 패키지 | 64-LQFP (10x10 mm) |
| Connectivity | I²C, LINbus, SPI, UART/USART |
| Peripherals | LVD, POR, PWM, WDT |
| 동작 온도 | -40°C to +125°C (Automotive) |
| Automotive Qualification | AEC-Q100 qualified |
| 실장 유형 | Surface Mount |
| Terminal Form | Gull Wing |
| MSL 레벨 | 3 |
| Debug Interface | BDM (single-wire, non-intrusive) |
S9S08RN60W1MLH 64-lqfp (10x10 mm) 핀 구성 가이드
S9S08RN60W1MLH(64-lqfp (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: S9S08RN60W1MLH.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
S9S08RN60W1MLH 적합 용도: 6 애플리케이션s: Automotive Body Control Modules (BCM), Automotive HVAC Actuator Controllers, LIN Sensor Nodes (Temperature, Humidity, Position), Industrial Control Panels, Appliance User Interface Modules, Small BLDC / PMSM Fan and Pump Drivers.
Automotive Body Control Modules (BCM)
The S9S08RN60W1MLH's 60KB Flash and 4KB RAM comfortably fit BCM firmware stacks for interior lighting, door lock coordination, and accessory control, while its integrated LINbus controller talks directly to slave nodes such as seat, mirror, and HVAC modules without an external transceiver IC for low-speed LIN. AEC-Q100 qualification at -40°C/+125°C and 20MHz deterministic S08 interrupt response mean the part stays in spec across cabin and underhood thermal profiles. The 64-LQFP (10x10 mm) footprint gives routing room for up to 55 GPIO to drive relays, LEDs, and switch-matrix inputs concurrently.
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Automotive HVAC Actuator Controllers
For HVAC flap motors and blower controls, the S9S08RN60W1MLH integrates PWM channels and a hardware CRC engine that protects SPI/I²C traffic between the actuator MCU and the master BCM. The 60kB Flash holds the motor-control state machine plus LIN slave stack, while 4KB RAM buffers lookup tables for temperature curves. AEC-Q100 grade and 20MHz S08 throughput deliver deterministic step response under worst-case temperature, important for closed-loop airflow control where missed interrupts cause flapping or overshoot.
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LIN Sensor Nodes (Temperature, Humidity, Position)
Low-cost automotive sensors such as ambient temperature, seat-occupancy, and seatbelt-buckle switches benefit from the S9S08RN60W1MLH's integrated LINbus controller, 55 GPIO count, and 4-byte EEPROM erase sector that simplifies parameter storage per node. The 60KB Flash accommodates LIN2.x slave stacks plus application code, and hardware CRC offloads bus safety checks from the CPU. The 64-LQFP footprint plus AEC-Q100 grade suit distributed sensor modules that report back to a central body controller.
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Industrial Control Panels
Beyond automotive, the S9S08RN60W1MLH suits industrial control panels that need 55 GPIO for keypad scanning, LED indicators, and relay outputs in a single 8-bit MCU. Deterministic S08 interrupt response and UART/USART peripherals support Modbus RTU master/slave firmware stacks, while SPI directly drives display drivers or ADC front-ends. AEC-Q100 overstress margin also helps the part survive harsh industrial cabinets with wide temperature swings, fan failure events, and EMI from adjacent motor starters.
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Appliance User Interface Modules
White-goods user-interface boards (washer, dryer, dishwasher front panels) use the S9S08RN60W1MLH to scan capacitive/segmented keypads, drive 7-segment or LCD indicators, and communicate with the main inverter board via UART. The 60KB Flash holds UI state machines plus diagnostic logs, while 4KB RAM supports menus and timer schedules. Wide operating temperature with AEC-Q100 pedigree also suits outdoor-rated appliances like ice makers or beer dispensers.
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Small BLDC / PMSM Fan and Pump Drivers
Sensorless or Hall-sensor BLDC fans and small pumps pair well with the S9S08RN60W1MLH's PWM channels, integrated timers, and 20MHz S08 throughput to run field-oriented control firmware in 60KB of Flash. The 55 GPIO count covers Hall inputs, FET gate-driver enables, tach output, and fault detection, while the AEC-Q100 thermal rating tolerates the heat soak of a fan housing or pump body. The 64-LQFP (10x10 mm) footprint fits both board-mounted and co-packaged motor-control PCBs.
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추천 제품 요약
엔지니어링 참조 데이터: S9S08RN60W1MLH — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | S9S08RN48W1MLH | S9S08RN32W1MLH | S9S08RN16W1MLH |
|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 8-bit | S08 8-bit | S08 8-bit | S08 8-bit |
| Maximum Clock | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Flash Size | 60 KB | 48 KB | 32 KB | 16 KB |
| RAM Size | 4 KB | 4 KB | 2 KB | 1 KB |
| GPIO Count | 55 | 55 | 55 | 55 |
| Operating Temperature | -40°C to +125°C (Automotive) | -40°C to +125°C (Automotive) | -40°C to +125°C (Automotive) | -40°C to +125°C (Automotive) |
주요 차별점
- Largest Flash density in the S08RN family (vs S9S08RN48W1MLH)
- Maximum RAM and GPIO at full pin count (vs S9S08RN32W1MLH)
- Integrated hardware CRC engine for bus safety (vs S9S08RN16W1MLH)
설계 노트
The S9S08RN60W1MLH requires a clean 2.7V-5.5V regulated supply (typical 5V for automotive body networks). Place one 100nF X7R decoupling capacitor adjacent to every VDD/VDDA pin pair, with a 4.7µF or larger bulk ceramic near the regulator output. Per the S9S08RN60 Series datasheet, the internal POR monitors VDD and forces a reset on brownouts - but the user is responsible for keeping the supply ripple below 50mVpp to avoid spurious resets during cranking transients.
Although the S9S08RN60W1MLH is a CMOS logic device with low quiescent current, the 64-LQFP package dissipates heat through a copper-grounded land pattern under the exposed pad when present. For under-hood placements, maintain the PCB junction-to-ambient thermal resistance by spreading at least 1 square inch of 2oz copper on the top layer connected to the GND pins. Avoid routing high-current switching traces directly beneath the LQFP body to limit substrate heating on adjacent analog signal paths.
Estimated for design reference: at maximum 20MHz core clock and full GPIO toggling, the S9S08RN60W1MLH draws roughly 15-25mA active current. Use this as a sizing input for the upstream 5V regulator; double the average for transient peaks when many GPIOs switch simultaneously. (Drain figures are estimates based on the S08 family datasheet typical IDD values; consult the S9S08RN60 Series datasheet for measured IDD vs frequency curves.)
Do not skip the BKGD/MS pin pull-up during BDM debug sessions - a floating background-debug-mode pin can prevent entry to debug mode. Lock bits, once programmed, require a mass-erase over BDM, so always verify code protection settings in a non-production environment first. Finally, EEPROM endurance is specified per block; if your application wears the same EEPROM sector intensively, distribute write cycles across the 256-byte address range to maximize lifetime.
규정 준수 정보
AEC-Q100 automotive qualified, RoHS compliant per the NXP product page and DigiKey listing. Halogen-free status not explicitly stated in the verified data; marked unknown.