SM2261XT - PCIe Gen3 x2 DRAM-less NVMe SSD Controller
부품 번호: SM2261XT ✓ 활성| 수량 | 단가 | 합계 |
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| 1 | $0 | $0.00 |
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SM2261XT 개요
A PCIe SSD controller is the central conversion and management device between a host computer and nonvolatile flash memory. It handles PCIe transactions, NAND interface activity, flash translation, data protection, wear management, and the mapping between logical blocks and physical NAND pages. The SM2261XT is therefore positioned between a PCIe host interface and 3D NAND storage rather than as a general-purpose processor or memory device.
The SM2261XT supports two PCIe Gen3 lanes operating at 8 GT/s per lane and two NAND channels capable of 1,200 MT/s per channel according to the manufacturer product brief. It uses proprietary NANDXtend ECC technology, SRAM ECC, and end-to-end data-path protection to improve NAND error handling, endurance, and retention. Its DRAM-less design reduces external memory requirements and is intended for cost-sensitive, compact consumer storage applications.
Typical SSD designs use the controller with 3D TLC or QLC NAND, power-management circuitry, flash channels, thermal management, and an M.2 or BGA package implementation. A listed MTC-C610 Series SSD uses SM2261XT-based configurations from 64GB to 1TB and supports up to 1,700 MB/s read and 1,200 MB/s write under specified flash configurations. These figures describe a finished SSD system, not guaranteed controller-only performance.
Designers should verify the exact package, pinout, NAND compatibility, firmware configuration, power rails, thermal limits, and SSD qualification requirements with the manufacturer documentation. The controller supports a 3.3 V operating voltage and NVMe 1.3 according to the provided source material. PCIe Gen3 x2 bandwidth and NAND channel performance must also be evaluated with the selected NAND devices and the complete SSD firmware profile.
This product data consolidates manufacturer controller information, SSD application examples, source links, and design cautions for engineers evaluating the SM2261XT. It is not a substitute for the complete manufacturer datasheet, NAND compatibility list, firmware documentation, or SSD validation report.
드롭인 대체품: SM2261XT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
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이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청SM2261XT 사양
| Product Type | PCIe NVMe SSD controller |
| Host Interface | PCIe Gen3 x2 |
| PCIe Data Rate | 8 GT/s per lane |
| NAND Channels | 2 |
| NAND Data Rate | Up to 1,200 MT/s per channel |
| Supported NAND Types | 3D TLC NAND and 3D QLC NAND |
| DRAM Architecture | DRAM-less with HMB support |
| NVMe Version | NVMe 1.3 |
| Operating Voltage | 3.3 V ± 10% |
| ECC Technology | NANDXtend ECC, SRAM ECC, and end-to-end data-path protection |
| SSD Form-Factor Context | 9 mm x 6.7 mm BGA SSD and M.2 SSD designs |
| SSD Capacity Context | 64GB to 1TB in MTC-C610 Series reference |
| Finished SSD Read Performance | Up to 1,700 MB/s |
| Finished SSD Write Performance | Up to 1,200 MB/s |
| Data Retention Compliance Context | JESD47 compliant reference context |
| Wear Leveling | Supported in referenced SSD platform |
| Bad Block Management | Supported in referenced SSD platform |
| MTBF Reference | >1,000,000 hours |
| 수명 주기 상태 | Active |
SM2261XT standard 핀 구성 가이드
SM2261XT(standard 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: SM2261XT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SM2261XT 적합 용도: 6 애플리케이션s: Compact M.2 Consumer NVMe SSD, Small BGA SSD Module, Entry-Level Gaming PC SSD, Laptop Storage Module, External NVMe Storage Enclosure, Cost-Optimized Consumer SSD.
Compact M.2 Consumer NVMe SSD
The SM2261XT fits cost-sensitive M.2 SSD designs that require PCIe Gen3 x2 connectivity without a dedicated external DRAM. Its HMB architecture helps reduce BOM requirements, while two NAND channels provide a path to high transfer rates when paired with qualified 3D TLC or QLC devices. A referenced MTC-C610 platform spans 64GB to 1TB, demonstrating the intended consumer-storage use case. The engineer must still confirm package height, connector compatibility, thermal limits, power sequencing, and the selected NAND qualification list.
추천
Small BGA SSD Module
The SM2261XT is suitable for small-form-factor SSD modules where board area and component count are important. The manufacturer brief specifically describes support for 9 mm x 6.7 mm BGA SSD designs and a DRAM-less architecture. Two NAND channels can provide a compact storage engine, but the final layout must follow the exact package drawing and validated reference design. Power integrity, flash routing, heat spreading, and assembly yield should be reviewed before scaling production.
추천
Entry-Level Gaming PC SSD
The SM2261XT can support an entry-level gaming PC SSD where fast startup, low cost, and compact packaging matter. PCIe Gen3 x2 and a dual-NAND-channel architecture provide a modern NVMe path, while HMB can reduce the need for dedicated DRAM. Gaming workloads may involve sustained writes, so designers should test thermal behavior, steady-state throughput, endurance behavior, and host-memory availability. The controller should be validated with the exact NAND and firmware configuration intended for production.
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Laptop Storage Module
The SM2261XT is appropriate for laptop storage modules where PCIe NVMe performance, low power, and small board area are priorities. Its DRAM-less design can simplify the power and component budget, while HMB supports a host-memory-assisted architecture. Laptop designs should account for thermal throttling, power-state transitions, sleep/resume behavior, and compatibility with the operating system and storage driver. Validate the complete SSD module rather than relying only on controller headline specifications.
추천
External NVMe Storage Enclosure
The SM2261XT can serve as the SSD engine inside an external NVMe enclosure when the enclosure exposes a compatible PCIe Gen3 x2 interface. The controller's two NAND channels and 3D TLC/QLC support make it relevant to portable storage products. The enclosure must provide adequate thermal dissipation, stable power, USB-to-PCIe bridge compatibility, and enclosure-level power management. Real-world performance also depends on bridge throughput, thermal conditions, and the NAND configuration selected for the module.
추천
Cost-Optimized Consumer SSD
The SM2261XT supports cost-optimized consumer SSDs by combining a DRAM-less architecture with HMB support and broad 3D TLC/QLC NAND support. This combination can reduce external memory requirements and simplify the bill of materials while retaining NVMe 1.3 functionality. The design must balance cost against sustained-write behavior, thermal performance, ECC capability, and NAND endurance. Manufacturer-qualified NAND lists and firmware validation should be treated as mandatory engineering inputs rather than optional procurement details.
추천
추천 제품 요약
엔지니어링 참조 데이터: SM2261XT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Product Type | DRAM-less PCIe NVMe SSD controller |
| Host Interface | PCIe Gen3 x2 |
| PCIe Data Rate | 8 GT/s per lane |
| NAND Channels | 2 |
| NAND Data Rate | Up to 1,200 MT/s per channel |
| Supported NAND | 3D TLC NAND and 3D QLC NAND |
| DRAM Architecture | DRAM-less with HMB support |
| NVMe Version | NVMe 1.3 |
| Operating Voltage | 3.3 V ± 10% |
| Error Correction | NANDXtend ECC, SRAM ECC, and end-to-end data-path protection |
| Brand | Silicon Motion |
| SSD Reference Capacity | 64GB to 1TB in MTC-C610 Series reference |
주요 차별점
- DRAM-less operation with HMB support (vs External-DRAM SSD controller architectures)
- Dual high-speed NAND-channel configuration (vs Single-channel SSD controller designs)
- Integrated NAND data-protection features (vs SSD controllers without the same stated protection feature set)
- Targeted compact consumer-storage positioning (vs Higher-power or higher-complexity SSD controller platforms)
설계 노트
The provided platform reference identifies Vcc = 3.3 V ± 10%, but an SSD implementation still requires a complete power tree. Validate controller current, NAND current, inrush, power sequencing, rail noise, and capacitor sizing against the manufacturer electrical requirements. Place decoupling capacitors at the package pins and provide separate, low-impedance paths for controller and NAND supplies. Do not derive capacitor values from the platform reference alone; use the datasheet and measured transient requirements.
PCIe and NAND interfaces are high-speed digital paths, so routing should follow the manufacturer reference layout as closely as possible. Keep the PCIe pair short, impedance controlled, and free of unnecessary vias or stubs. Route NAND channels with matched topology where specified, provide solid return paths, and isolate noisy switching or power-regulator regions from the controller and flash interface. Exact trace geometry cannot be specified here because the verified excerpts do not include the package pinout or layout stack-up.
Thermal behavior depends on NAND density, SSD capacity, sustained workload, enclosure, and board copper. The referenced MTC-C610 Series reports up to 1,700 MB/s read and 1,200 MB/s write under specified flash configurations, but these finished-system figures do not replace a controller thermal test. Measure steady-state temperature, throttle behavior, and error rates in the intended enclosure. Use adequate copper spreading and, where needed, a thermal pad or heat-spreading structure, subject to the SSD mechanical design.
Do not treat SM2261XT, SM2263XT, or another PCIe SSD controller as interchangeable without verifying package, pin compatibility, PCIe lane configuration, NAND support, firmware, and validation requirements. Also do not assume that an SSD's headline read or write speed is guaranteed controller performance. The source material reports finished SSD figures for particular NAND configurations, and those results vary with the host, thermal state, capacity, and workload.
규정 준수 정보
The verified excerpts do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-mineral status for SM2261XT. A referenced platform lists JESD47 data-retention compliance, wear leveling, bad-block management, and MTBF greater than 1,000,000 hours; these are platform-level references and not complete component compliance claims.
