SN65LVDS22DR - Dual Multiplexed LVDS Repeater 250Mbps | TI
부품 번호: SN65LVDS22DR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $2.88 | $28.80 |
| 100 | $2.55 | $255.00 |
| 500 | $2.3 | $1,150.00 |
| 1,000 | $2.1 | $2,100.00 |
SN65LVDS22DR 개요
An LVDS (Low-Voltage Differential Signaling) repeater is an interface buffer that regenerates and redistributes differential signal pairs, restoring signal amplitude and edge quality degraded by long backplanes, cables, or multiple loads. As a member of the broader voltage-mode driver and interface IC family, an LVDS repeater sits between a differential transmitter and receiver in the signal chain hierarchy, isolating loading effects and enabling fan-out of a single LVDS source to multiple destinations without signal degradation.
Key features include ANSI TIA/EIA-644-1995 standard compliance, LVDS output voltages of 350 mV into a 100-ohm load, and a typical propagation delay of 4 ns. ESD protection exceeds 12 kV on bus pins and exceeds 2000 V per MIL-STD-883, Method 3015 (HBM), with machine-model protection exceeding 200 V (200 pF, 0 ohm). The device is pin compatible with the SN65LVDS122 and SN65LVDT122 1.5 Gbps 2x2 crosspoint switches from TI, providing a direct speed-upgrade path.
The multiplexed 1x2:2 architecture allows each LVDS input to be selectively routed or repeated, giving system designers flexible signal-distribution topologies. Low differential output swing (typically 350 mV) minimizes EMI and power consumption compared with older differential standards, while the 4 ns propagation delay keeps timing budgets small even at 250 Mbps data rates.
Typical applications include backplane signal buffering in industrial control systems, clock distribution in telecom and datacom line cards, and LVDS signal fan-out in automotive communication modules, where the device is qualified for automotive applications.
Design considerations: TI specifies the SN65LVDS22 (100-ohm load) and SN65LVDM22 (50-ohm load) as load-specific variants, so select the termination impedance variant to match the bus. When more bandwidth is needed, drop in the pin-compatible SN65LVDS122/SN65LVDT122 for up to 1.5 Gbps operation.
This page synthesizes distributor availability, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: SN65LVDS22DR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SN65LVDS22DRG4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SN65LVDM22DR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SN65LVDS22DR 사양
| 기능 | Dual multiplexed LVDS repeater (buffer/multiplexer, 1 x 2:2 channel) |
| Data Signaling Rate (clock) | 400 Mbps (200 MHz) |
| Data Signaling Rate (data) | 250 Mbps |
| Interface Standard | ANSI TIA/EIA-644-1995 (LVDS) |
| 공급 전압 | 3.3 V |
| Differential Output Voltage | 350 mV into 100-ohm load |
| Propagation Delay Time | 4 ns typ |
| ESD Protection (bus pins) | > 12 kV |
| ESD Protection (HBM) | > 2000 V per MIL-STD-883, Method 3015 |
| ESD Protection (MM) | > 200 V (200 pF, 0 ohm) |
| 동작 온도 범위 | -40C to +85C |
| 패키지 | 16-pin SOIC (D) |
| 실장 유형 | Surface Mount |
| Pin Compatibility | SN65LVDS122 / SN65LVDT122 (1.5 Gbps crosspoint upgrade) |
| Automotive Qualification | Qualified for automotive applications |
SN65LVDS22DR 16-pin soic (d) 핀 구성 가이드
SN65LVDS22DR(16-pin soic (d) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: SN65LVDS22DR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SN65LVDS22DR 적합 용도: 6 애플리케이션s: Backplane Signal Buffering, Clock Distribution in Telecom Line Cards, Automotive LVDS Communication Modules, LVDS Fan-Out and Signal Redundancy, Industrial Imaging and Machine-Vision Links, Test and Measurement Signal Distribution.
Backplane Signal Buffering
In industrial control and telecom backplanes, LVDS signals from a single line card must reach several destination cards across long, heavily loaded traces that degrade differential amplitude and edge rate. The SN65LVDS22DR regenerates each pair with a full 350 mV differential swing into a 100-ohm load and adds only 4 ns typical propagation delay, preserving timing margins at 250 Mbps data rates. Its multiplexed 1x2:2 architecture lets one input pair be distributed or repeated selectively, reducing the number of transmitter loads seen by the source. Bus-pin ESD protection exceeding 12 kV withstands handling and connector transients typical of pluggable backplane environments. Operating from a single 3.3 V supply, it drops directly into existing card power budgets without additional rails.
추천
Clock Distribution in Telecom Line Cards
Telecom and datacom line cards require a low-jitter system clock distributed to multiple FPGA, ASIC, and PHY devices. The SN65LVDS22DR repeats a 200 MHz LVDS clock (400 Mbps) with a typical propagation delay of only 4 ns, keeping skew budgets small across the card. LVDS signaling per ANSI TIA/EIA-644-1995 with a 350 mV differential swing minimizes EMI compared to single-ended clock trees, important for meeting emissions requirements in dense card cages. The 1x2:2 multiplexed channels allow redundant clock sources to be routed through the same repeater footprint, and over 12 kV bus-pin ESD protection adds robustness during board handling. The device's -40C to +85C range covers telecom central-office ambient specifications.
추천
Automotive LVDS Communication Modules
Automotive body, infotainment, and communication modules increasingly use LVDS for in-vehicle high-speed links between cameras, displays, and control units. The SN65LVDS22DR is qualified for automotive applications per TI's datasheet, which is a prerequisite for vehicle deployments. Its ESD protection exceeding 12 kV on bus pins and over 2000 V HBM (MIL-STD-883, Method 3015) addresses the harsh transient environment of vehicle wiring, and the -40C to +85C operating range covers under-dash and engine-bay-adjacent modules. Repeating 250 Mbps LVDS data with 4 ns delay supports camera and display link budgets, while the 3.3 V single supply aligns with standard automotive logic rails after post-regulation.
추천
LVDS Fan-Out and Signal Redundancy
When a single LVDS source must drive multiple receivers, direct paralleling degrades signal integrity through excessive loading. The SN65LVDS22DR provides a buffered 1x2:2 multiplexed fan-out: each output pair presents a clean 350 mV differential swing into 100 ohms regardless of how many destinations follow, and the multiplexer input allows a redundant secondary source to be selected in the same device. At 400 Mbps clock capability the repeater supports most industrial LVDS buses, and the 4 ns typical delay simplifies deterministic-latency designs. Failover schemes benefit from TI's pin-compatible SN65LVDS122 upgrade path if future systems push toward 1.5 Gbps, requiring no PCB respin.
추천
Industrial Imaging and Machine-Vision Links
Industrial cameras transmit high-rate image data over LVDS pairs between sensor heads and frame grabbers. The SN65LVDS22DR repeats these links at up to 250 Mbps data rate with only 4 ns typical propagation delay, restoring differential amplitude degraded by long cable runs and maintaining eye-opening at the receiver. Compliance with ANSI TIA/EIA-644-1995 ensures interoperability with standard LVDS camera interfaces, and the 350 mV low-swing signaling limits radiated emissions inside shielded machine enclosures. Factory-floor temperature swings of -40C to +85C are fully covered. For longer or faster links, the pin-compatible SN65LVDS122 provides 1.5 Gbps capability in the same signal arrangement, protecting the design investment.
추천
Test and Measurement Signal Distribution
Bench instruments and automated test equipment frequently need one high-quality differential signal replicated to several measurement channels or DUT connections. The SN65LVDS22DR buffers LVDS signals up to 400 Mbps with a 4 ns typical delay and regenerates a full 350 mV swing into 100 ohms, so channel-to-channel amplitude differences introduced by fan-out loading are eliminated. Over 12 kV bus-pin ESD protection protects the repeater against electrostatic discharge during probe handling and DUT swapping, a frequent failure mode in lab environments. The single 3.3 V supply and 16-pin SOIC footprint make it easy to retrofit into existing instrument signal-conditioning boards without power or layout redesign.
추천
추천 제품 요약
엔지니어링 참조 데이터: SN65LVDS22DR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SN65LVDS22DRG4 | SN65LVDM22DR |
|---|---|---|---|
| Package | SOIC-16 (D) | SOIC-16 (D) - same | SOIC-16 (D) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments |
| Data Rate (clock / data) | 400 Mbps / 250 Mbps | 400 Mbps / 250 Mbps | 400 Mbps / 250 Mbps |
| Differential Output Load | 350 mV into 100-ohm | 350 mV into 100-ohm | 350 mV into 50-ohm |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V |
| Propagation Delay | 4 ns typ | 4 ns typ | 4 ns typ |
| ESD (bus pins) | > 12 kV | > 12 kV | > 12 kV |
| Interface Standard | ANSI TIA/EIA-644-1995 | ANSI TIA/EIA-644-1995 | ANSI TIA/EIA-644-1995 |
주요 차별점
- Multiplexed 1x2:2 architecture in a 16-pin SOIC (vs SN65LVDM22DR)
- Cost-effective 250 Mbps with guaranteed upgrade path (vs SN65LVDS122PW)
- >12 kV bus-pin ESD protection (vs Generic third-party LVDS repeaters)
설계 노트
Terminate each LVDS pair with a 100-ohm resistor across the pair at the receiver input, matching the SN65LVDS22DR specification of 350 mV differential swing into 100 ohms. If your bus segment presents a 50-ohm effective differential load, select the SN65LVDM22 variant instead, which TI characterizes for that load. Keep pair lengths matched within a few millimeters and route over a continuous reference plane to preserve the 4 ns typical propagation delay advantage at 250 Mbps.
Place 0.1 uF ceramic decoupling capacitors within a few millimeters of the 3.3 V pin, with an additional bulk capacitor per device group. Because this repeater handles 400 Mbps edges, maintain an unbroken ground plane under all LVDS routing and avoid stubs on differential pairs. The 16-pin SOIC (D) footprint is standard MS-012 style; ensure the land pattern follows TI's package drawing so that migration to the pin-compatible SN65LVDS122 remains footprint-agnostic in signal terms.
Do not substitute a generic LVDS buffer without confirming the multiplexed 1x2:2 signal mapping - the SN65LVDS22DR multiplexes inputs to outputs, and a simple repeater with different routing logic will change system behavior. Also note the package family split: the pin-compatible SN65LVDS122/SN65LVDT122 use TSSOP-16 (PW) bodies, so a speed upgrade to 1.5 Gbps requires footprint verification even though the pin functions match. Verify the 100-ohm vs 50-ohm load variant before releasing the BOM.
규정 준수 정보
Datasheet states Qualified for Automotive Applications. DR suffix is TI's standard RoHS Tape and Reel packaging; DRG4 denotes green packaging. REACH and halogen-free status not stated in provided data.
