SPC5602BK0MLL4 - 32-bit MCU 256KB Flash 48MHz Auto LQFP-100 | NXP
부품 번호: SPC5602BK0MLL4 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.85 | $6.85 |
| 10 | $6.12 | $61.20 |
| 100 | $5.4 | $540.00 |
| 500 | $4.78 | $2,390.00 |
| 1,000 | $4.25 | $4,250.00 |
SPC5602BK0MLL4 개요
An automotive microcontroller (MCU) is a specialized microprocessor engineered for harsh vehicle environments, combining a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and on-chip peripherals such as timers, ADCs, and communication controllers into a single IC. The SPC5602BK0MLL4 sits at the small-memory end of the MPC56xx Qorivva family, occupying the entry tier where cost-sensitive body control modules (BCMs), sensor nodes, and lighting controllers need Power Architecture compatibility without the larger Flash/RAM footprints of the upper-tier siblings.
Key features include a Power Architecture e200z0h core delivering 48MHz performance, 256KB (256K x 8) of on-chip Flash program memory, multi-protocol connectivity (CANbus, I2C, LINbus, SCI, SPI), and integrated peripherals (DMA, POR, PWM, WDT). The device operates from a 5V supply and is qualified for the -40C to +125C automotive temperature range, making it suitable for under-hood and cabin-mounted ECUs.
The architecture leverages the Power Architecture book-e instruction set, providing deterministic interrupt latency and a Memory Protection Unit for software isolation - critical for automotive functional-safety architectures built on the ISO 26262 framework. The 79 I/O count and rich peripheral mix enable direct interface to switches, sensors, actuators, and vehicle network transceivers without external glue logic.
Typical applications include automotive body control modules, HVAC control panels, instrument cluster sub-controllers, lighting/ECM nodes, CAN/LIN gateway slave devices, and industrial PLC I/O modules. The device's combination of automotive qualification and Qorivva ecosystem support (S32 Design Studio IDE, MPC56xx drivers and AUTOSAR MCAL) accelerates functional-safety certification.
When designing with this part, note that 5V supply is the canonical rail; for 3.3V-only designs consider the SPC5602 3.3V variants. Ensure PCB layout allocates sufficient decoupling (100nF + 4.7uF bulk per VDD rail) and keep the oscillator traces short to meet automotive EMI/ESD immunity.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: SPC5602BK0MLL4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SPC5602BK0MLL4 (동일 폼 팩터 및 풋프린트) — 차이점: Program Memory Size, Series, Supply Voltage, RoHS Status, Automotive Qualification.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SPC5603CF2CLL6
✅ 드롭인✓ 재고 있음
$7.85 / 개
데이터시트 보기 →SPC5606SF2CLU6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.78 / 개
데이터시트 보기 →SPC5606SF2VLU6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$11.1 / 개
데이터시트 보기 →SPC5602BK0MLL4 최대 정격 & 전기적 특성
| Core Processor | e200z0h (Power Architecture) |
| Core Size | 32-Bit |
| Maximum CPU Clock | 48 MHz |
| Program Memory Size | 256 KB (256K x 8) |
| Program Memory Type | FLASH |
| Number of I/O | 79 |
| 공급 전압 | 5 V |
| 동작 온도 범위 | -40C to +125C (Automotive Grade) |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Series | MPC56xx Qorivva (SPC5602) |
| 패키지 | 100-LQFP (14x14 mm) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (per NXP product page) |
| AEC-Q100 Grade | Qualified (Automotive Grade per Mouser listing) |
SPC5602BK0MLL4 100-lqfp (14x14 mm) 핀 구성 가이드
SPC5602BK0MLL4(100-lqfp (14x14 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SPC5602BK0MLL4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SPC5602BK0MLL4 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), LIN Sensor/Actuator Node, HVAC Control Panel, Instrument Cluster Sub-Controller, Industrial PLC I/O Module, Powertrain/Lighting Sub-Nodes.
Automotive Body Control Module (BCM)
The SPC5602BK0MLL4 is well suited to body control modules where it centralizes switch/actuator logic for door locks, wipers, and interior lighting. The e200z0h core at 48MHz and CAN/LIN connectivity enable direct connection to vehicle networks without external bridge ICs. The 256KB Flash accommodates mid-range BCM firmware including diagnostics and partial networking stacks. AEC-Q100 qualification at -40C to +125C and the 5V supply match the automotive body-electronics environment. Designers typically pair the MCU with a CAN transceiver (e.g., TJA1043) and LIN transceiver (e.g., TJA1027) on a single PCB. The 79 I/O count covers typical BCM pin needs including switch inputs, LED drivers, and motor control PWM outputs.
추천
LIN Sensor/Actuator Node
The SPC5602BK0MLL4 is a strong fit for LIN 2.x sensor nodes (rain/light sensors, mirror controls, seat position sensors) where its LINbus peripheral drives the master-less or slave node directly. The integrated SCI/UART and PWM channels support actuator drivers and sensor sampling, while 256KB Flash handles localized fault logging. The 5V supply and -40C to +125C rating suit in-cabin mounting. Compared to discrete 8-bit LIN solutions, this MCU adds headroom for software differentiation. Designers typically pair it with a TJA1027 LIN transceiver and a small 3.3V LDO for any sensors requiring 3.3V rails. The 79 I/O pins allow expansion to multi-channel sensor fusion.
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HVAC Control Panel
The SPC5602BK0MLL4 powers HVAC control panels with its 48MHz e200z0h core managing PID control loops for blower speed, blend door, and temperature regulation. The 256KB Flash holds the climate-control algorithm, sensor filtering, and CAN/LIN diagnostics. The 5V analog-domain support and 12-bit ADC simplify thermistor and pressure-sensor readout. The 100-LQFP package offers compact PCB integration while leaving headroom for additional I/O. Designers typically add a stepper motor driver for blend-door actuation and a CAN transceiver for body-network integration. AEC-Q100 qualification and the -40C to +125C range suit placement behind the center console in high-thermal environments.
추천
Instrument Cluster Sub-Controller
The SPC5602BK0MLL4 can serve as a sub-controller in instrument cluster architectures where a higher-end graphics MCU handles display rendering and this part handles switch matrix, telltale LED drivers, and CAN gatewaying. The e200z0h core and 79 I/O support multiplexed switch scanning and PWM LED dimming. 256KB Flash stores telltale logic, gauge mathematics, and diagnostic routines. The 5V supply tolerates automotive load-dump events with proper external protection. The 100-LQFP package allows compact PCB placement behind the cluster housing. Designers often pair it with a graphics MCU such as S32K144 family or SPC56EC for the display processor.
추천
Industrial PLC I/O Module
Outside its automotive focus, the SPC5602BK0MLL4 is also viable for industrial PLC I/O modules where its CAN and serial peripherals handle fieldbus connectivity, and its PWM/timer channels drive output switching. The 256KB Flash supports IEC 61131-3 runtime plus device descriptors, and 5V supply tolerates 24V industrial rails with regulators. AEC-Q100 rated silicon provides extra margin for industrial temperature and shock. The 100-LQFP package supports automated SMT assembly lines. Designers typically combine the MCU with isolated CAN/RS-485 transceivers and digital input optocouplers for a complete I/O slice.
추천
Powertrain/Lighting Sub-Nodes
The SPC5602BK0MLL4 is positioned for automotive lighting modules (headlamp levelling, adaptive front-lighting sub-nodes, tail-light diagnostics) where 256KB Flash holds LED matrix control firmware and CAN/LIN interfaces connect to the lighting ECU. The e200z0h core and PWM channels drive constant-current LED drivers with deterministic timing. AEC-Q100 qualification supports under-hood or headlamp-mounted placement. The 5V rail tolerates load-dump transients with TVS protection. The 100-LQFP package supports harsh-environment PCB layouts with thermal vias. Designers usually add a multi-channel LED driver and a CAN transceiver to the BOM.
추천
추천 제품 요약
엔지니어링 참조 데이터: SPC5602BK0MLL4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SPC5603CF2CLL6 | SPC5606SF2CLU6 | SPC5606SF2VLU6 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (14x14 mm) | 100-LQFP | 176-LQFP | 176-LQFP |
| Core | e200z0h (Power Architecture) | e200z0h (Power Architecture) | e200z0h (Power Architecture) | e200z0h (Power Architecture) |
| Maximum CPU Clock | 48 MHz | 48 MHz | 64 MHz | 64 MHz |
| Flash Memory | 256 KB | 384 KB | 1 MB | 1 MB |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| Connectivity | CAN, I2C, LIN, SCI, SPI | CAN, I2C, LIN, SCI, SPI | CAN, I2C, LIN, SCI, SPI (additional instances) | CAN, I2C, LIN, SCI, SPI (additional instances) |
주요 차별점
- Lowest-Flash entry point in MPC560xB/C/D family (vs SPC5603CF2CLL6)
- 100-LQFP compact package (vs SPC5606SF2CLU6)
- AEC-Q100 qualified for -40C to +125C (vs Generic industrial MCUs)
설계 노트
Place a 100nF X7R ceramic capacitor as close as possible to each VDD/VDDA pin pair, and add a shared 4.7uF X5R bulk capacitor on the 5V supply rail. The e200z0h core has separate digital and analog supply pins (VDD, VDDA, VDDPLL) - do not bridge them externally; routing should follow the NXP reference design. A 10uF tantalum or polymer bulk at the regulator output suppresses load-dump transients in automotive 12V/24V systems.
At 48MHz with all peripherals active, the LQFP-100 dissipates roughly 200-400 mW depending on I/O switching - well within the package's thermal envelope. For under-hood placement, ensure adequate PCB copper area (>=1 sq inch) to keep junction below 125C. The LQFP-100 (14x14mm) package has a lower theta-JA than the 176-LQFP variants but still benefits from thermal vias under the exposed lead frame for headroom in high-ambient applications.
Keep the external crystal or resonator traces (XTAL/EXTAL) shorter than 10mm and guard them with a ground ring to meet automotive EMI/ESD immunity (ISO 11452, IEC 61967). Place CAN/LIN bus capacitors (typically 100pF split termination) as close to the transceiver as possible. Avoid routing high-speed signals across gaps in the ground plane, which can create antennas in the 100-LQFP footprint's escape region.
Do not confuse the SPC5602BK0MLL4 (100-LQFP, 5V) with the SPC5602BK0VLQ4 (144-LQFP) or the SPC5602BK0CLQ4R (176-LQFP) - the suffix codes pin-count and reel orientation differ. The 'R' suffix indicates Tape & Reel orientation, not a different package family. For 3.3V-only designs the SPC5602B 3.3V variants exist as separate order codes; do NOT power a 5V SPC5602 from 3.3V without a level shifter or DC-DC.
규정 준수 정보
AEC-Q100 qualified and RoHS compliant per NXP product page and Mouser ProductDetail listing. Halogen-free status not stated in the verified web data - marked unknown.