STM32F301K6T7 - 32KB Flash Cortex-M4 MCU 32-LQFP | STMicroelectronics
부품 번호: STM32F301K6T7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.95 | $3.95 |
| 10 | $3.55 | $35.50 |
| 100 | $2.98 | $298.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $2.18 | $2,180.00 |
| 2,500 | $1.92 | $4,800.00 |
STM32F301K6T7 개요
What is a mixed-signal MCU? A mixed-signal microcontroller integrates a digital processor core with on-chip analog peripherals such as ADCs, DACs, comparators and operational amplifiers, allowing one chip to interface directly with sensors and analog signal chains without external analog components. This category sits beneath the broader product hierarchy of microcontroller -> embedded MCU -> ARM Cortex-M device -> mixed-signal MCU -> semiconductor.
Key features of the STM32F301K6T7 include up to two 12-bit fast ADCs (5 MSPS) with selectable resolution, one 12-bit DAC channel, four fast rail-to-rail analog comparators with programmable threshold, one 8 MHz operational amplifier with PGA capability, and advanced-control PWM timers for motor-control and digital-power topologies. Communication peripherals include one I2C, up to two SPI, up to three USART, and a CAN 2.0B interface. The device supports up to 21 fast GPIOs and embeds a 16-channel DMA controller.
Architecturally the part leverages the Cortex-M4 core with FPU, enabling C-level DSP code without software emulation and accurate math for sensor fusion, while the on-chip analog front-end reduces BOM cost. Reset and power-management blocks include power-on reset, brown-out reset, programmable voltage detector, and a low-power RTC with backup-domain registers.
Typical applications include digital power conversion (SMPS digital control loops), motor drives for low-voltage BLDC and PMSM systems, sensor-hub and signal-conditioning front-ends, factory-automation I/O modules, consumer appliance control boards, and low-cost instrumentation. When laying out the PCB, place the VDDA decoupling network within 5 mm of the VDDA pin, use an external ferrite or resistor between VDD and VDDA, and keep the analog ground plane separate from the switching-return path to preserve ADC SNR.
드롭인 대체품: STM32F301K6T7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
STM32F301K6T7-TR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F301K8T7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F302K6T7
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F301K6T3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
GD32F301K6T7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F301K6T7 최대 정격 & 전기적 특성
| Core Architecture | Arm 32-bit Cortex-M4 with FPU |
| 최대 클록 주파수 | 72 MHz |
| Flash Memory | 32 KB |
| SRAM | 16 KB |
| Supply Voltage (VDD/VDDA) | 2.0 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (Grade 7) |
| 패키지 | 32-LQFP |
| GPIO Count | Up to 21 fast GPIOs |
| ADC | Up to 2x 12-bit, 5 MSPS |
| DAC | 1x 12-bit |
| Comparators | 4 fast rail-to-rail |
| Operational Amplifiers | 1x 8 MHz op-amp with PGA |
| Communication Interfaces | 1x I2C, up to 2x SPI, up to 3x USART, 1x CAN 2.0B |
| DMA Channels | 7 (or 5 depending on variant) |
| CRC Unit | Yes (hardware CRC calculation unit) |
| 실장 유형 | Surface Mount (LQFP) |
| RoHS Compliance | Compliant |
STM32F301K6T7 핀 구성
| 핀 1 | PF0 — General-purpose I/O / OSC_IN |
| 핀 2 | PF1 — General-purpose I/O / OSC_OUT |
| 핀 3 | NRST — Reset (active low, internal pull-up) |
| 핀 4 | VSSA — Analog ground |
| 핀 5 | VDDA — Analog supply (2.0-3.6 V) |
| 핀 6 | PA0 — GPIO / TIM2_CH1 / ADC1_IN1 |
| 핀 7 | PA1 — GPIO / TIM2_CH2 / ADC1_IN2 / OPAMP1_VINP |
| 핀 8 | PA2 — GPIO / USART2_TX / ADC1_IN3 |
| 핀 9 | PA3 — GPIO / USART2_RX / ADC1_IN4 |
| 핀 10 | PA4 — GPIO / SPI1_NSS / ADC1_IN5 / OPAMP1_VINM |
| 핀 11 | PA5 — GPIO / SPI1_SCK / ADC1_IN6 / DAC1_OUT1 |
| 핀 12 | PA6 — GPIO / SPI1_MISO / ADC1_IN7 / COMP1_OUT |
| 핀 13 | PA7 — GPIO / SPI1_MOSI / ADC1_IN8 / COMP2_OUT |
| 핀 14 | PB0 — GPIO / TIM3_CH3 / ADC1_IN11 |
| 핀 15 | PB1 — GPIO / TIM3_CH4 / ADC1_IN12 / OPAMP1_VOUT |
| 핀 16 | PB2 — GPIO / BOOT1 |
| 핀 17 | VDD — Digital supply (2.0-3.6 V) |
| 핀 18 | VSS — Digital ground |
| 핀 19 | PB10 — GPIO / USART3_TX / TIM2_CH3 |
| 핀 20 | PB11 — GPIO / USART3_RX / TIM2_CH4 |
| 핀 21 | PB12 — GPIO / SPI2_NSS / TIM1_BKIN |
| 핀 22 | PB13 — GPIO / SPI2_SCK / TIM1_CH1N |
| 핀 23 | PB14 — GPIO / SPI2_MISO / TIM1_CH2N |
| 핀 24 | PB15 — GPIO / SPI2_MOSI / TIM1_CH3N |
| 핀 25 | PA8 — GPIO / TIM1_CH1 / USART1_CK |
| 핀 26 | PA9 — GPIO / TIM1_CH2 / USART1_TX |
| 핀 27 | PA10 — GPIO / TIM1_CH3 / USART1_RX |
| 핀 28 | PA13 — GPIO / SWDIO (debug data) |
| 핀 29 | VSS_2 — Digital ground (second pin) |
| 핀 30 | VDD_2 — Digital supply (second pin) |
| 핀 31 | PA14 — GPIO / SWCLK (debug clock) |
| 핀 32 | PA15 — GPIO / TIM2_CH1_ETR / SPI1_NSS |
일반적인 애플리케이션
STM32F301K6T7 적합 용도: 6 애플리케이션s: Digital Power SMPS Control Loops, Low-Voltage BLDC / PMSM Motor Drives, Analog Sensor-Hub / Signal Conditioning, Industrial Field I/O Modules, Consumer Appliance Control Boards, Low-Cost Test & Measurement Instrumentation.
Digital Power SMPS Control Loops
The STM32F301K6T7 fits digital power factor correction (PFC), LLC and phase-shift full-bridge control because the 72 MHz Cortex-M4 + FPU executes voltage-mode and peak-current-mode compensation algorithms in native floating point, while the 5 MSPS 12-bit ADC samples the inductor current and output voltage with deterministic phase alignment. Compared with Cortex-M0 parts, the FPU removes the quantization error that contaminates PI/Digital-filter coefficients and improves step-load response by 20-30%. The advanced-control timer (TIM1) generates up to 6 pairs of complementary PWM with programmable dead-time and hardware blanking, so the firmware simply loads duty-cycle values while the on-chip analog comparator triggers cycle-by-cycle current protection. Designers place the IC downstream of a 12 V auxiliary rail, deriving 3.3 V through a small buck converter that feeds VDD and VDDA via a ferrite bead, and supervise rail-monitor interrupts through the on-chip voltage detector. The 32 KB Flash is more than adequate for state-machine control plus telemetry over I2C/SPI, and 16 KB SRAM supports ring-buffer histograms for ac-line cycle tracking.
추천
Low-Voltage BLDC / PMSM Motor Drives
For 24-48 V sensorless BLDC and PMSM motors, the STM32F301K6T7 combines the Cortex-M4 + FPU with the on-chip op-amp (PGA), four rail-to-rail comparators, and TIM1 complementary PWM so a complete FOC or trapezoidal drive runs with zero external analog components. The op-amp conditions shunt-resistor current directly into the ADC, the comparators handle zero-crossing detection for back-EMF sensorless commutation, and the FPU speeds up Park/Clarke transforms in single-cycle math. Designers report drive loops running at 10-20 kHz switching frequency with 1-2 kHz current-control bandwidth on this chip, well below the 72 MHz ceiling. The 32-LQFP footprint allows mounting close to the half-bridge to keep gate-drive traces short, and the integrated CAN 2.0B interface suits industrial fieldbus motor nodes.
추천
Analog Sensor-Hub / Signal Conditioning
The STM32F301K6T7 acts as a low-cost sensor-hub for thermocouples, RTDs, load cells and 4-20 mA loops. Two 12-bit 5 MSPS ADCs simultaneously sample bridge-sensor differential signals, the on-chip op-amp with PGA gain up to 16 amplifies microvolt-level transducer outputs, and the DAC drives 4-20 mA excitation. The FPU executes digital linearization and calibration math at sample rates up to tens of kilohertz without saturating the CPU, while the DMA offloads register bursts into SRAM buffers. Compared with an external ADC + CPLD architecture, this single-chip solution cuts the BOM to one IC plus a regulator and protects noise-sensitive signal chains by keeping the analog and digital return paths on a shared LQFP-exposed pad. SPI/I2C/USART links connect the hub to a host PLC or gateway over Modbus or CANopen.
추천
Industrial Field I/O Modules
Factory-automation digital-input and digital-output modules use the STM32F301K6T7 to read 24 V logic, drive relays, debounce contact inputs, and report status over CAN, RS-485 or IO-Link. The wide 2.0-3.6 V supply lets the part run from a 24 V -> 3.3 V buck directly off the backplane, while the integrated comparators provide fast over-current detection on output driver stages without external trip circuitry. The FPU accelerates the IEC 61131-3 function-block execution and supports safety diagnostics such as channel-to-channel timing comparisons. Designers size 32 KB Flash to fit the IO-Link stack plus diagnostics, and use the DMA + USART combination to offload frame parsing at 38.4 kBaud without CPU intervention; the 32-LQFP footprint fits compact IP20 module housings.
추천
Consumer Appliance Control Boards
In washing machines, induction cookers and induction rice-cookers, the STM32F301K6T7 serves as the main MCU driving power-stage PWMs, reading capacitive/proximity touch sensors through the analog comparator, and exposing user interfaces via UART-to-display ICs. Its FPU makes the appliance's FFT-based feature extraction (inverter fault detection, gas-spark recognition) trivial in C, while the on-chip op-amp conditions thermocouple inputs in induction heating control loops. The 2.0-3.6 V supply covers entire 3.3 V common-rail designs and the 32-LQFP drops onto existing appliance control PCBs that previously used 8-bit PICs or Cortex-M0 parts. With 32 KB Flash and 16 KB SRAM the firmware comfortably fits an RTOS kernel plus drivers plus a GSM/Wi-Fi gateway protocol task, allowing single-PCB bill-of-material minimization.
추천
Low-Cost Test & Measurement Instrumentation
Bench-grade instruments and educational lab tools use the STM32F301K6T7 to digitize analog inputs at 5 MSPS, generate analog outputs via the 12-bit DAC, and stream data over USB-CDC or USART to a host. The FPU executes FFTs and Goertzel algorithms on the buffered samples for frequency response analysis or harmonic-distortion calculation, while the comparator enables zero-crossing detection for phase measurements. The wide 2.0-3.6 V supply and small 32-LQFP footprint simplify battery-powered handhelds, and the rich timer pool provides precise event-time stamping for waveform captures. Compared with an 8-bit MCU, the Cortex-M4 + FPU delivers 50-100x faster DSP kernels for true instrument-grade accuracy in the same power envelope.
추천
추천 제품 요약
엔지니어링 참조 데이터: STM32F301K6T7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F301K6T7-TR | STM32F301K8T7 | STM32F302K6T7 | STM32F301K6T3 | GD32F301K6T7 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | GigaDevice |
| Package | 32-LQFP | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same |
| Core | Cortex-M4 + FPU | Cortex-M4 + FPU | Cortex-M4 + FPU | Cortex-M4 + FPU | Cortex-M4 + FPU | Cortex-M4 (no FPU in some SKUs) |
| Maximum Clock | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 72 MHz |
| Flash Memory | 32 KB | 32 KB | 64 KB | 32 KB | 32 KB | 32 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| DAC Channels | 1 | 1 | 1 | 2 | 1 | 1 |
주요 차별점
- On-chip op-amp with PGA gain up to 16 (vs STM32F301K6T3)
- Cortex-M4 with FPU vs Cortex-M0 MCU (vs STM32F071CBT7)
- Drop-in 32-LQFP footprint across STM32F30x family (vs GD32F301K6T7)
설계 노트
Power the STM32F301K6T7 from a single 3.3 V rail derived from the system supply through a low-dropout regulator. Place a 100 nF X7R ceramic decoupling capacitor on every VDD/VDDA pair, plus a 4.7 uF bulk capacitor within 5 mm of the VDDA pin. Insert a ferrite bead or low-value resistor (10 ohm) between VDD and VDDA to keep digital switching noise out of the analog supply rail. If a separate analog LDO is available, route it through the bead to provide a cleaner VDDA reference for the ADC and DAC.
Estimated: at 72 MHz, 3.3 V operation, and full peripheral enable, the STM32F301K6T7 typically dissipates around 100-120 mW in the 32-LQFP package. With a theta_JA of approximately 65-70 C/W on a 2-layer board, junction rise above ambient is 6-10 C, so no heatsink is required for general embedded designs. For industrial enclosures at 60 C ambient, plan for 5-7 C margin below the +85 C operating limit; upgrade to a 4-layer PCB with thermal via array under the exposed pad to drop theta_JA to ~30 C/W if the application is sealed.
Route the SWD signals (PA13/PA14) as a short matched pair to a 10-pin Cortex debug header with 100 ohm series damping resistors near the MCU side. Keep digital switching return currents (PWM, communication) on a single ground plane that connects to VSS at one point via a wide trace, and isolate analog grounds on a separate polygon that joins at the VSSA pin. Avoid routing high-speed PWM traces across analog input traces to preserve ADC SNR; the analog comparator inputs should sit away from PWM edges.
Do not leave unused pins floating - configure them as analog-mode to suppress mid-rail current draw. Always populate the NRST external pull-up (typ. 100 kohm to VDD) plus a 100 nF decoupling cap to ensure clean reset behavior. When boot-mode select is required, leave BOOT0 accessible (jumper) but pull it to VSS through a 100 kohm default-down. The VDDA supply must rise monotonically with VDD; if not, add an external diode or sequencing supervisor.
규정 준수 정보
RoHS and REACH compliance per ST product page; LQFP package is Pb-free and rated MSL3. Industrial temperature grade 7 applies (-40 C to +85 C).
