STM32F302VCT6 - 72MHz Cortex-M4 MCU, 256KB Flash | STMicroelectronics
부품 번호: STM32F302VCT6 ✓ 활성STM32F302VCT6 개요
A microcontroller is a programmable semiconductor that integrates a processor core, memory, peripherals, and communication interfaces into one compact device. Within the embedded-system hierarchy, the STM32F302VCT6 belongs to the STM32F3 family of 32-bit ARM Cortex-M4 MCUs. It combines general-purpose control with fast analog conversion, making it suitable for industrial monitoring, motor-control, sensor acquisition, communications, and compact embedded-control systems.
Three headline capabilities define the device. Its 72 MHz Arm Cortex-M4 core provides substantially greater processing capacity than basic 8-bit or 16-bit controllers. Its 256 KB Flash capacity accommodates firmware, boot code, configuration data, and application libraries, while the 40 KB SRAM reported for this device supports working memory and data buffering. The 100-LQFP package provides 100 external connection points for mixed analog, digital, and communication functions.
The STM32F302VC product family supports a 12-bit ADC capable of 5 MSPS operation, along with programmable gain amplifiers and comparators. These features enable the MCU to sample and condition analog inputs without relying entirely on external signal-chain components. DSP instructions and the integrated floating-point unit accelerate filtering, transforms, and control calculations, while the memory protection unit supports safer isolation of code and data in more structured firmware environments.
Typical applications include industrial sensor nodes, motor-control controllers, data-acquisition systems, power-conversion equipment, communications equipment, and compact embedded platforms. The combination of high-speed conversion and deterministic Cortex-M4 processing is particularly useful when an application must acquire analog measurements and execute control algorithms in one device.
PCB design should account for analog and digital return paths, power-supply decoupling, exposed signal-pin limits, and the thermal requirements of the LQFP package. Place the MCU’s decoupling capacitors close to its supply pins, provide clean return paths beneath sensitive analog circuitry, and validate analog-noise performance with the same external network used in production.
This product page combines the manufacturer’s device positioning, distributor specifications, lifecycle information, exact-package details, replacement analysis, and practical implementation guidance. It also distinguishes confirmed alternatives from candidates requiring engineering review, helping teams assess fit before committing to a redesign or second-source strategy.
드롭인 대체품: STM32F302VCT6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32F302VCT6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Product Type, SRAM, Flash Organization, Processor Core.
STM32F303VCT6
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →STM32F303VCT7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F303VCT8
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F302VCT6 최대 정격 & 전기적 특성
| Product Type | 32-bit ARM Cortex-M4 mixed-signal microcontroller |
| CPU Core | Arm Cortex-M4 with DSP and FPU |
| Maximum CPU Frequency | 72 MHz |
| Architecture | 32-bit RISC |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 bits |
| SRAM | 40 KB |
| ADC Resolution | 12 bits |
| ADC Conversion Rate | 5 MSPS |
| Analog Features | PGA and comparators |
| Memory Protection | MPU |
| 공급 전압 | 2.5 V to 3.3 V |
| 패키지 | 100-pin LQFP, 14 x 14 mm |
| 실장 유형 | Surface mount |
| 수명 주기 상태 | Active Mainstream |
| RoHS Compliance | RoHS3 compliant |
STM32F302VCT6 100-pin lqfp, 14 x 14 mm 핀 구성 가이드
STM32F302VCT6(100-pin lqfp, 14 x 14 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F302VCT6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F302VCT6 적합 용도: 6 애플리케이션s: Industrial Sensor Acquisition, Motor Control, Data Acquisition Equipment, Power Conversion Control, Communication Equipment, Condition Monitoring.
Industrial Sensor Acquisition
The STM32F302VCT6 suits compact industrial sensor nodes that need fast conversion and local real-time processing. Its 12-bit ADC operates up to 5 MSPS, while the 72 MHz Cortex-M4 core can execute filtering, calibration, threshold logic, and communications without a separate processor. The 256 KB Flash stores application firmware and configuration tables, and 40 KB of SRAM provides room for acquisition buffers and working state. A practical implementation uses the ADC for sampled measurements, the DSP instructions for digital signal processing, and the FPU for floating-point control calculations.
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Motor Control
The STM32F302VCT6 is appropriate for motor-control subsystems requiring a high-performance control core alongside mixed-signal measurement. Its 72 MHz Cortex-M4 core provides computational headroom for current-loop and position-control calculations, while DSP and floating-point instructions accelerate transforms and control arithmetic. Analog comparators, PGA resources, and a 5 MSPS 12-bit ADC support feedback and sensing functions. Designers should allocate timers and pins to the required motor-control topology, preserve signal-to-noise performance, and validate timing against the worst-case control workload.
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Data Acquisition Equipment
The STM32F302VCT6 can serve as the control and conversion engine in compact data-acquisition equipment. Its 12-bit ADC conversion rate of up to 5 MSPS supports higher-rate sampling than a basic low-speed microcontroller, and the 72 MHz core can perform buffering, scaling, filtering, and packet preparation. The 256 KB Flash accommodates firmware while 40 KB of SRAM supports acquisition buffers. For precision measurement, connect analog inputs through the required conditioning network and test noise, channel isolation, and acquisition timing on the completed PCB rather than relying only on simulation.
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Power Conversion Control
The STM32F302VCT6 is well matched to digital power controllers that require real-time computation and analog feedback in one package. The 72 MHz Cortex-M4 core can execute control loops, while the FPU and DSP instructions improve handling of transformed measurements and compensation calculations. The 12-bit ADC, PGA, and comparators provide a foundation for voltage, current, and temperature monitoring. The 100-pin LQFP offers numerous mixed-signal connections, but the final design must map each control loop to available timers, ADC channels, and comparator inputs while observing the 2.5 V to 3.3 V device supply.
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Communication Equipment
The STM32F302VCT6 can act as the host controller in compact communications equipment that combines protocol handling with analog monitoring. Its 72 MHz Cortex-M4 core supports responsive packet processing and background tasks, while the 256 KB Flash provides room for networking, application, and update code. Peripheral functions can monitor supply voltage, temperature, or signal levels through the integrated analog resources. The device’s package also exposes a large number of digital and analog pins, but designers must check the exact peripheral multiplexing and pin-conflict table in the manufacturer documentation before assigning communication interfaces.
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Condition Monitoring
The STM32F302VCT6 fits embedded condition-monitoring systems that sample vibration, temperature, pressure, or analog sensor signals and make local decisions. Fast ADC operation supports time-based sampling, while the DSP instructions and FPU help implement filtering and feature calculations. The 40 KB of SRAM allows larger working buffers than the identified STM32F303VCT7 candidate, which is useful when maintaining a history of samples. A practical design must provide suitable excitation or conditioning for each sensor, synchronize timing, and validate the filter response across the intended operating range.
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추천 제품 요약
엔지니어링 참조 데이터: STM32F302VCT6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F303VCT6 | STM32F303VCT7 | STM32F303VCT8 |
|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 100-LQFP (14 x 14 mm) | 100-LQFP (14 x 14 mm) | 100-LQFP - same package | 100-LQFP (14 x 14 mm) |
| CPU Core | Arm Cortex-M4 with DSP and FPU | Arm Cortex-M4 with DSP and FPU | Arm Cortex-M4 | Arm Cortex-M4 with DSP and FPU |
| Maximum CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 40 KB | 32 KB | 32 KB | 32 KB |
| Architecture | 32-bit | 32-bit | 32-bit | 32-bit |
주요 차별점
- Larger SRAM for acquisition buffers and real-time working state (vs STM32F303VCT7)
- 72 MHz Cortex-M4 performance with integrated floating-point support (vs STM32F303VCT6)
- Mixed-signal conversion capability (vs STM32F303VCT8)
설계 노트
Place the required input, output, and analog-decoupling capacitors directly beside the corresponding STM32F302VCT6 power pins, following the manufacturer’s recommended layout and capacitor values. Keep the supply traces short and use an uninterrupted ground plane so switching return current does not flow beneath sensitive analog inputs. Treat analog and digital return currents as separate design concerns until measured noise and reference stability are confirmed on the assembled board.
Assign analog inputs according to the exact STM32F302VC pin-description table and account for alternate-function multiplexing before routing communication or timer signals. Keep high-speed edges away from ADC inputs and comparators, and provide a quiet reference path for analog measurements. The 100-LQFP footprint offers many pins, but routing density should not force long loops or vias through sensitive analog nets.
Do not treat a shared package and clock rate as proof of drop-in compatibility. The STM32F303VCT7 and other same-family candidates have 32 KB of SRAM versus 40 KB on the STM32F302VCT6, and their peripheral assignments or ordering suffixes may differ. Before substitution, compare the complete pin table, clock configuration, startup code, interrupt vector definitions, ADC channels, timer resources, and device-specific safety limits.
Estimate worst-case junction temperature from ambient temperature, package power dissipation, and the PCB thermal path. The LQFP’s exposed thermal performance depends on the actual copper area, inner-layer connection, airflow, and nearby heat sources, so a nominal package dimension is not enough to establish reliability. Validate the final layout under maximum clock activity and peripheral load, and avoid placing temperature-sensitive analog circuitry immediately beneath the MCU.
규정 준수 정보
The PartGenie comparison page identifies the device as RoHS3 compliant. REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status were not established from the manufacturer product page.