STM32F302ZDT6 - 72MHz Cortex-M4 384KB MCU | STMicroelectronics
부품 번호: STM32F302ZDT6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.7958 | $14.80 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
STM32F302ZDT6 개요
A microcontroller is a compact embedded-processing system that integrates a CPU, memory, peripherals, and interfaces on one semiconductor device. The STM32F3 family is positioned within the broader hierarchy of ARM Cortex-M microcontrollers, embedded processors, and semiconductor control devices. These components execute firmware for real-time measurement, actuation, communications, motor control, data acquisition, and safety-oriented industrial functions. The Cortex-M4 architecture supports efficient fixed-point and floating-point instruction execution while retaining a broad embedded-software ecosystem.
The verified listing identifies the STM32F302ZDT6 as an ARM Cortex-M4 device operating at 72 MHz and storing 384 KB of Flash memory. Its 144-LQFP package exposes 115 I/O, enabling dense mixed-signal designs where analog and digital functions must share a single controller. The STM32F302xD/E family is described by STMicroelectronics as combining the Cortex-M4 core with an FPU. Exact peripheral assignments, voltage limits, temperature limits, and electrical characteristics are not fully present in the supplied data and must be confirmed in the manufacturer documentation.
A 72 MHz clock rate supports responsive control loops and timely peripheral servicing. The 384 KB Flash capacity provides room for application firmware, configuration data, and boot logic, while the verified 64 KB SRAM figure supports working memory and data buffering. Compared with a smaller microcontroller package, the 144-LQFP format offers a large pin count and practical routing flexibility for boards requiring numerous external signals.
Typical uses include industrial automation controllers, motor-control and digital power systems, data-acquisition equipment, communications gateways, and embedded measurement platforms. The 115-I/O count can be valuable when a design must connect sensors, actuators, converters, displays, and communication transceivers without using multiple controllers. The STM32F302ZDT6 is therefore appropriate where 72 MHz processing, substantial Flash memory, and a high pin count are more important than the smallest possible footprint.
Designers should confirm the exact peripheral mix, alternate-function mappings, pin constraints, electrical limits, and startup requirements against the STMicroelectronics product documentation before layout. The large LQFP package is easy to inspect and solder relative to fine-pitch alternatives, but its 144 leads require careful fanout and ground-return planning. Firmware qualification, clock configuration, peripheral initialization, and package-level validation remain essential before production release.
This page consolidates verified distributor and manufacturer information with package, procurement, comparison, and design guidance. It is intended to help engineers identify whether the STM32F302ZDT6's 72 MHz core, 384 KB Flash, 64 KB SRAM, and 144-LQFP package fit a new embedded design while clearly separating verified facts from unavailable parameters.
드롭인 대체품: STM32F302ZDT6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청STM32F302ZDT6 최대 정격 & 전기적 특성
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Core | ARM Cortex-M4 with FPU |
| 최대 클록 주파수 | 72 MHz |
| Flash Memory | 384 KB |
| SRAM | 64 KB |
| Architecture | 32-bit RISC |
| I/O Count | 115 I/O |
| 패키지 | 144-LQFP (20 mm x 20 mm) |
| Series | STM32F3 series |
| 공급 전압 | 2.5 V / 3.3 V |
| 실장 유형 | Surface Mount |
| DSP Support | DSP instructions |
| Floating-Point Unit | Yes |
| ADC Resolution | 12-bit |
| Package Pin Count | 144 pins |
STM32F302ZDT6 144 pins 핀 구성 가이드
STM32F302ZDT6(144 pins 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F302ZDT6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F302ZDT6 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Motor Control System, Data Acquisition and Measurement, Communications Gateway, Digital Power and Monitoring, Embedded Measurement Instrument.
Industrial Automation Controller
The STM32F302ZDT6 fits an industrial automation controller that needs a 72 MHz Cortex-M4 core for real-time control logic, 384 KB of Flash for application firmware, and 115 I/O for connecting sensors, actuators, status indicators, and field-bus transceivers. Its 144-LQFP package provides ample routing options for mixed-signal boards, while the FPU can support arithmetic in filtering and control calculations. Design validation must still check temperature, EMC, isolation, protection, and the exact pin functions required by the installation.
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Motor Control System
The STM32F302ZDT6 is a candidate for motor-control systems requiring deterministic real-time execution and a substantial set of external signals. Its Cortex-M4 core operates at up to 72 MHz, and the floating-point unit can accelerate common control and filtering operations. The 115-I/O count can support encoder inputs, gate-driver interfaces, control signals, diagnostics, and communications. The final design must verify timer channel placement, complementary outputs, ADC characteristics, PWM limits, current sensing, and thermal conditions in the manufacturer documentation.
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Data Acquisition and Measurement
For data-acquisition equipment, the STM32F302ZDT6 combines 72 MHz processing with 384 KB of Flash and 64 KB of SRAM, providing resources for sampling, buffering, calibration, and communications firmware. Its 115 I/O offers room for sensor inputs, control outputs, status signals, and external converters. The verified 12-bit ADC mention should be treated as a starting point, while resolution, sample rate, input impedance, acquisition timing, and channel multiplexing must be confirmed against the exact datasheet. Analog layout and reference design are critical.
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Communications Gateway
The STM32F302ZDT6 can serve as the control processor in a communications gateway when the gateway needs local protocol handling, real-time status processing, and numerous interface signals. The 72 MHz Cortex-M4 core supports firmware execution, while 384 KB of Flash and 64 KB of SRAM provide storage and working memory for protocol stacks and buffers. Its 115 I/O can simplify connections between UART, SPI, Ethernet, status LEDs, and reset or configuration controls. Verify transceiver compatibility, timing, electrical levels, and package-specific pin multiplexing.
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Digital Power and Monitoring
The STM32F302ZDT6 is suitable for supervisory or digital-power monitoring functions where a control loop, measurement path, and communication interface share one MCU. At up to 72 MHz, the Cortex-M4 core can service timing and control tasks, while the 384 KB Flash capacity supports configuration, logging, and boot code. The 115-I/O package can connect measurement signals, fault inputs, enable outputs, and communications. Validate regulator requirements, ADC accuracy, PWM behavior, fault handling, thermal margins, and safety requirements before deployment.
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Embedded Measurement Instrument
The STM32F302ZDT6 can support a compact measurement instrument when firmware, calibration, and interface tasks must coexist on one controller. Its 384 KB Flash provides room for application code and nonvolatile parameters, while 64 KB of SRAM supports acquisition buffers and working variables. The 115 I/O allows connection of analog front ends, displays, controls, communications, and status signals without immediately forcing a larger controller. For precision instruments, verify ADC performance, reference accuracy, noise, timing, calibration storage, and analog-board isolation.
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추천 제품 요약
엔지니어링 참조 데이터: STM32F302ZDT6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Package | 144-LQFP (20 mm x 20 mm) |
| Brand | STMicroelectronics |
| Core | ARM Cortex-M4 with FPU |
| Maximum Clock Frequency | 72 MHz |
| Flash Memory | 384 KB |
| SRAM | 64 KB |
| I/O Count | 115 I/O |
| Supply Voltage | 2.5 V / 3.3 V |
| ADC Resolution | 12-bit |
| Architecture | 32-bit RISC |
주요 차별점
- High-pin-count mixed-control package (vs STM32F103ZET7)
- Cortex-M4 with FPU (vs STM32F103ZET7)
- 72 MHz processing and 384 KB Flash (vs STM32F303ZET7)
- Large integrated I/O availability (vs STM32F407VGT6TR)
설계 노트
Use the verified 144-LQFP, 20 mm x 20 mm package as the mechanical starting point, but obtain the exact land pattern and pin map from the STMicroelectronics documentation before layout. Place the MCU where its many leads can fan out without forcing long routes between power, ground, analog, and high-speed signals. Preserve assembly clearance around the package and check the footprint against the final PCB library rather than relying on a generic LQFP drawing.
The verified supply-voltage listing is 2.5 V or 3.3 V, but the complete power-domain limits are not included. Confirm which pins belong to each supply domain, allowable voltage combinations, decoupling values, startup requirements, and maximum current before connecting external circuitry. Place required bypass capacitors close to the relevant package pins and provide return paths that minimize disturbance on sensitive measurement and communication nets.
The STM32F302ZDT6 combines 115 I/O with mixed embedded-control functions, so alternate-function selection and signal routing need early review. Keep high-speed communication and clock routes short, provide continuous reference planes where appropriate, and separate noisy switching returns from analog inputs. The supplied data does not include the complete pinout or timing tables, so validate edge rates, signal levels, and interface constraints against the exact STM32F302ZDT6 documentation.
Although the part is packaged in a large LQFP rather than a compact fine-pitch package, thermal performance still depends on the available board copper, airflow, and total switching and I/O load. The verified data does not provide junction-temperature or power-dissipation figures, so calculate thermal margins from the exact electrical operating conditions and manufacturer limits. Use a thermal review before applying the maximum GPIO activity, clock, or peripheral load in a sealed enclosure.
규정 준수 정보
The supplied verification does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields must be confirmed with current STMicroelectronics or authorized-distributor documentation.