STM32F765IGK6 - 216MHz Cortex-M7 MCU, 1MB Flash | STMicroelectronics
부품 번호: STM32F765IGK6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.45 | $18.45 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.4 | $10,400.00 |
| 2,500 | $9.1 | $22,750.00 |
STM32F765IGK6 개요
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, data memory, and programmable peripherals. The STM32F765IGK6 belongs to the high-performance Cortex-M7 class of MCUs, which sits above Cortex-M4 devices in the Arm Cortex-M taxonomy and below Cortex-A application processors. Within STMicroelectronics' portfolio, the STM32F7 family is positioned as the high-performance mainstream line between the STM32F4 mainstream line and the STM32H7 very-high-performance line, and is widely used as the controller host for graphics, motor control, audio, and connectivity-rich embedded systems.
Key differentiating features include a 16-bit Chrom-ART Accelerator for graphics workloads, dual-mode Quad-SPI flash interface, USB 2.0 OTG full-speed and high-speed with on-chip PHY, two CAN 2.0B interfaces, SDMMC, FMC for external memory, Ethernet MAC, three 12-bit ADCs (2.4 MSPS), two 12-bit DACs, and a crypto/hash hardware accelerator supporting AES, SHA, and 3DES. The integrated L1 cache plus ART Accelerator effectively eliminates the flash wait-state penalty even at 216 MHz.
Architecturally the device uses an M7 core with branch prediction, tightly-coupled memory, and a dedicated DMA engine cluster (two DMA controllers with FIFOs). An on-chip DSI host controller and parallel TFT LCD interface give the STM32F765IGK6 strong graphics capability for display-driven HMI designs without an external graphics controller. The wide peripheral set (UART/USART, SPI, I2C, SAI, SPDIF, HDMI-CEC, timers, RTC) covers most industrial, audio, and connectivity bridges.
Typical applications include industrial motor drives and frequency inverters, building automation HVAC controllers, medical imaging interfaces, audio processing and consumer audio equipment, DSI-equipped HMI panels, USB-based industrial bridges, and graphics-rich IoT gateways. The 176-ball UFBGA package footprint is shared across the STM32F7 family, enabling drop-in scalability between STM32F765, STM32F767, and STM32F769 density variants.
When designing with this part, verify that the 216 MHz core supply (typically 1.7-1.9 V from the internal LDO or external SMPS) is decoupled with low-impedance ceramic caps near each VDD/VSS pair. For high-EMI environments, gate the 25 MHz HSE crystal traces with a guard ring and use the on-chip PLL spread-spectrum option to relax radiated emissions.
This page synthesizes real-time distributor pricing, drop-in pin-compatible alternatives, application notes, and design considerations beyond the manufacturer datasheet summary, helping engineers evaluate the STM32F765IGK6 for new designs and as a second-source-qualified replacement.
드롭인 대체품: STM32F765IGK6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32F765IGK6 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Analog, Cryptography, DMIPS Performance.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
STM32F767IGK6
✅ 드롭인✓ 재고 있음
$14.05 / 개
데이터시트 보기 →STM32F769IGK6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F756IGK6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F768IGY6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F750Z8T6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F765IGK6 최대 정격 & 전기적 특성
| Core Architecture | Arm 32-bit Cortex-M7 with single/double-precision FPU |
| Maximum CPU Frequency | 216 MHz |
| DMIPS Performance | 462 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) |
| Program Memory (Flash) | 1 Mbyte |
| RAM Memory | 512 Kbytes SRAM |
| L1 Cache | 16 Kbytes I-cache + 16 Kbytes D-cache |
| ART Accelerator | Yes (0-wait-state flash execution) |
| Instruction Set Extensions | DSP instructions, MPU |
| 패키지 | 176+25 UFBGA (10x10 mm) |
| 실장 유형 | Surface Mount |
| Operating Voltage (Core) | 1.7 V to 1.9 V |
| Operating Voltage (I/O) | 1.7 V to 3.6 V |
| 동작 온도 | -40 °C to +85 °C |
| External Memory Bus | FMC (Flexible Memory Controller) + Dual-mode Quad-SPI |
| Communications | USB OTG FS/HS, 2x CAN 2.0B, Ethernet MAC, SDMMC, USART/UART, SPI, I2C, SAI, SPDIF, HDMI-CEC |
| Analog | 3x 12-bit ADC (2.4 MSPS), 2x 12-bit DAC |
| Graphics | Chrom-ART Accelerator, parallel TFT-LCD, DSI host |
| Cryptography | AES-128/192/256, SHA-1/SHA-256, 3DES, True Random Number Generator |
| RoHS 상태 | Compliant |
| 데이터 버스 폭 | 32-bit |
STM32F765IGK6 176+25 ufbga (10x10 mm) 핀 구성 가이드
STM32F765IGK6(176+25 ufbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F765IGK6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F765IGK6 적합 용도: 6 애플리케이션s: Industrial Motor Drives and Variable-Frequency Inverters, Building Automation and HVAC Controllers, Audio Processing and Consumer Sound Bars, DSI-Based HMI Displays and Touch Panels, USB-Based Industrial Bridges and Test Instruments, Graphics-Rich IoT Gateways and Edge Devices.
Industrial Motor Drives and Variable-Frequency Inverters
The STM32F765IGK6's Cortex-M7 core at 216 MHz plus built-in DSP instructions and the HRTIM timer make it well-suited for field-oriented control (FOC) of three-phase PMSM and induction motors. Its 1 Mbyte Flash holds motor-control libraries, position-estimation firmware, and safety state machines, while the 512 Kbyte SRAM is enough to host four current/torque control loops at 20 kHz with room to spare. Designers benefit from dual 12-bit ADCs synchronized to the HRTIM events for sub-microsecond current sensing. Compared with the STM32F407 equivalent, the F7 executes the same FOC loop about 30% faster thanks to the M7 core's dual-issue pipeline and ART Accelerator. A typical reference design is the STM32F7 motor-control SDK kit, paired with external gate drivers and current-sense amplifiers.
추천
Building Automation and HVAC Controllers
Building-automation controllers demand deterministic communication (BACnet, Modbus, KNX, or Ethernet), graphical HMI capability, and long product lifecycles. The STM32F765IGK6 satisfies each need: an integrated Ethernet MAC and two CAN 2.0B interfaces simplify field-bus bridging, while the parallel TFT-LCD and Chrom-ART accelerator drive local color touchscreens without an external GPU. The device's wide operating temperature grade and 1 Mbyte Flash make firmware over-the-air updates feasible. Referenced in ST's STM32F7 reference designs for thermostat and access-panel products, the part typically runs FreeRTOS or Azure RTOS managing Modbus TCP servers plus a local LVGL UI stack. Compared with the STM32F4, the F7's 0-wait-state flash execution yields a snappier HMI at the same clock.
추천
Audio Processing and Consumer Sound Bars
Audio applications benefit from the Cortex-M7's DSP extensions (single-precision MAC and SIMD) and from dedicated audio peripherals: SAI, SPDIF RX/TX, and two 12-bit DACs. The STM32F765IGK6 at 216 MHz can decode compressed audio streams (MP3, AAC, Opus) and run a multi-band FIR/IIR equalizer in real time, with 512 Kbyte SRAM large enough to host two rings of 48 kHz stereo audio at 32 ms latency. Designers typically add an external audio DAC (e.g., PCM1794A or SGTL5000) on I2S/SAI to drive a class-D amplifier. The AES/SHA crypto engine secures DRM-protected streams. Compared with STM32F4, the F7's M7 core's SIMD MACs roughly double FIR-tap throughput.
추천
DSI-Based HMI Displays and Touch Panels
MIPI-DSI-equipped human-machine interface (HMI) panels need a controller capable of driving the DSI link while handling LVGL graphics primitives, capacitive touch scanning, and field-bus protocols concurrently. The STM32F765IGK6 brings an on-chip DSI host (up to 720p at 60 Hz) plus the parallel LTDC controller for TFT backup, the Chrom-ART accelerator for 2D image compositing, and three 12-bit ADCs for touch-sensing hardware. The same 176+25 UFBGA package accommodates both Display-Only DSI and high-resolution LVDS bridges. Designers typically pair the part with a WVGA DSI LCD and an external flash (via Quad-SPI) for asset images. Compared with the STM32F469, the F7 doubles the CPU headroom for LVGL renders and ADDS DSI capability.
추천
USB-Based Industrial Bridges and Test Instruments
Industrial bridges benefit from the STM32F765IGK6's USB 2.0 OTG full-speed and high-speed controllers with on-chip PHY, which eliminate external transceiver ICs. The part can present as a USB device (CDC, HID, vendor-class), a USB host, or a USB Type-C dual-role, while concurrently running Ethernet TCP/IP, CANopen, and RS-485 Modbus masters. The 1 Mbyte Flash accommodates USB stacks plus dual-field-bus logic, and 512 Kbyte SRAM lets USB OTG sustain 480 Mbps with internal DMA buffering. The M7 core's branch prediction improves protocol state-machine throughput vs the M4 family. Reference design: STM32F7 + LAN8742A PHY + USB Type-C connector as a multi-protocol test gateway.
추천
Graphics-Rich IoT Gateways and Edge Devices
IoT edge gateways need local UI plus network protocol stacks (MQTT, LwM2M, Matter) plus on-device ML or anomaly detection. The STM32F765IGK6 runs 216 MHz Cortex-M7 with DSP SIMD to perform keyword-spotting or vibration anomaly detection while maintaining a touchscreen UI and a TLS-secured MQTT link. The AES-256 crypto and True-RNG accelerate TLS handshake on Cortex-M7, keeping CPU headroom for MQTT throughput. Designers pair it with a Wi-Fi/BLE module over SDIO or SPI, and route Ethernet to an external PHY. Compared with STM32F4, the F7's 1 Mbyte Flash fits Matter + LCD UI + stack binaries in one part without external serial flash for code; data lives in Quad-SPI.
추천
추천 제품 요약
엔지니어링 참조 데이터: STM32F765IGK6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F767IGK6 | STM32F769IGK6 | STM32F756IGK6 | STM32F768IGY6 | STM32F750Z8T6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176+25 UFBGA (10x10 mm) | 176+25 UFBGA (10x10 mm) - same | 176+25 UFBGA (10x10 mm) - same | 176+25 UFBGA (10x10 mm) - same | 176+25 UFBGA (10x10 mm) - same | LQFP-176 (different footprint) |
| CPU Core | Arm Cortex-M7 with FPU | Arm Cortex-M7 with FPU | Arm Cortex-M7 with FPU | Arm Cortex-M7 with FPU | Arm Cortex-M7 with FPU | Arm Cortex-M7 with FPU |
| Max CPU Frequency | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz |
| Flash Memory | 1 Mbyte | 2 Mbyte | 2 Mbyte + crypto IP | 1 Mbyte | 2 Mbyte | 64 Kbyte |
| SRAM | 512 Kbyte | 512 Kbyte | 512 Kbyte | 256 Kbyte | 512 Kbyte | 256 Kbyte |
| USB OTG | FS + HS with on-chip PHY | FS + HS with on-chip PHY | FS + HS with on-chip PHY | FS + HS | FS + HS with on-chip PHY | FS + HS |
| DSI Host | Yes | Yes | Yes | No | Yes | No |
주요 차별점
- Single-die Cortex-M7 with double-precision FPU at 216 MHz (vs STM32F407IGT6)
- On-chip USB High-Speed PHY + dual-mode Quad-SPI (vs STM32F407IGT6)
- Larger 1 Mbyte Flash vs 64 Kbyte competitor (vs STM32F750Z8T6)
설계 노트
Estimated: at 216 MHz core activity with all peripherals enabled, the STM32F765IGK6 draws roughly 150-200 mA from VDD (1.7-1.9 V) plus another 30 mA from VDDA, depending on peripheral states. Use a ferrite bead plus 100 nF/4.7 µF decoupling on each supply pin, place the bulk cap within 5 mm of the ball, and select an LDO or SMPS capable of 300 mA peak (e.g., ST's LDO plus TPS737xx family) for USB-HS bus-powered designs.
Estimated: with a theta_JA of approximately 30 C/W for the 176+25 UFBGA on a 4-layer 2 oz copper JEDEC test board, the part will rise roughly 25 C above ambient at 0.5 W dissipation. Although the F7 silicon is robust, keep the case temperature below 85 C for industrial designs by providing copper pours directly beneath the 25 thermal balls and stitching via arrays to the inner layers.
Route the HSE crystal traces (X1/X2) over a continuous ground plane, length-matched to under 5 mm and surrounded by a guard ring. Place the USB DP/DM traces as a 90-ohm differential pair within 6 mm of the on-chip PHY balls, and keep the Ethernet MII/RMII traces short and impedance-controlled. The 176-ball BGA fanout should use 0.8 mm pitch micro-via-in-pad for optimal signal integrity at 216 MHz.
Common pitfalls on this part: (1) leaving BOOT0 floating - assert it correctly via 10 kohm pull-down for normal boot from flash; (2) bypassing the VCAP capacitors (4.7 µF plus 100 nF) on each VCAP ball - the internal LDO will not regulate without them; (3) using a 25 MHz crystal out of spec - the PLL defaults to a 216 MHz clock chain that requires a precise HSE; (4) failing to enable the external SMPS mode when high current is needed - configure the power controller at boot.
Best practice for the parallel TFT-LCD interface: keep all data lanes within a single layer, length-matched to ±2 mm, and route away from the SMPS switching nodes. Ground-reference the entire bus if you cannot get a continuous reference plane. Reference ST's AN4861 (LCD-TFT display on STM32 MCUs) for a complete layout checklist, and run BGA escape routing on layers 1-2 with 0.8 mm-pitch micro-vias.
규정 준수 정보
RoHS and REACH compliant per STMicroelectronics product page; AES-256 and 3DES IP may trigger export-control documentation at international shipment; not AEC-Q100 qualified - use STM32F765I** automotive variants for vehicle applications.
