STM32F765NGH7 - 216MHz Cortex-M7 1MB MCU | STMicroelectronics
부품 번호: STM32F765NGH7 ✓ 활성STM32F765NGH7 개요
A microcontroller is a programmable integrated circuit that combines a processor core, nonvolatile program memory, data memory, peripherals, and communication interfaces on one package. The STM32F7 family belongs to the broader Arm Cortex-M microcontroller category, with the Cortex-M7 core using a 32-bit RISC architecture. This places the STM32F765NGH7 within the semiconductor and embedded-control device hierarchy for industrial, communications, consumer, and real-time control systems.
Key features include a 216 MHz maximum clock, 1 MB of flash organized as 1M x 8, up to 462 DMIPS, a 16 KB L1 instruction cache, a 16 KB L1 data cache, an MPU, and DSP instructions. The 3 V operating supply identified in the verified product data is suitable for embedded systems designed around conventional 3.3 V rails. Its high-performance architecture supports computationally intensive control, communications, and signal-processing workloads.
The Cortex-M7 core combines a 32-bit Arm architecture with a double-precision FPU and ART Accelerator. According to the manufacturer datasheet, the 16 KB instruction and data caches allow zero-wait-state execution from embedded flash and external memory. The MPU supports memory-protection and isolation functions, while DSP instructions accelerate suitable arithmetic operations. These capabilities distinguish this device from simpler Cortex-M3 or Cortex-M4 microcontrollers.
Typical applications include industrial automation equipment, networked embedded controllers, communications infrastructure, audio and digital signal processing, and real-time control systems. Its 216 MHz performance and floating-point capability are useful when control loops or signal-processing tasks must execute without relying on a separate processor.
The principal design consideration is the 216-ball BGA footprint. A new PCB layout must provide the required escape routing, via structure, power distribution, and assembly process for a 13 x 13 mm TFBGA. Firmware and peripheral configurations should be validated against the manufacturer datasheet before production release.
This page consolidates verified manufacturer information, distributor pricing and availability, engineering selection guidance, and explicitly qualified replacement analysis. It distinguishes confirmed drop-in candidates from unavailable alternatives so procurement and design decisions can be made without treating general-purpose MCU alternatives as pin-compatible replacements.
드롭인 대체품: STM32F765NGH7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
STM32F765NGH6
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →STM32F765NGY6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F765NGH6TR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F765NGY6TR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F765NGH7 최대 정격 & 전기적 특성
| Product Type | 32-bit microcontroller with FPU |
| Processor Core | Arm Cortex-M7 |
| Maximum CPU Frequency | 216 MHz |
| Architecture | 32-bit RISC |
| Maximum Performance | 462 DMIPS |
| Performance per MHz | 2.14 DMIPS/MHz |
| Benchmark | Dhrystone 2.1 |
| Floating-Point Unit | Double-precision FPU |
| Flash Memory | 1 MB (1M x 8) |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Cache Execution | 0-wait-state execution from embedded flash and external memory |
| Memory Protection Unit | Yes |
| DSP Instructions | Yes |
| Accelerator | ART Accelerator |
| Operating Voltage | 3 V |
| 패키지 | 216-TFBGA (13 x 13 mm) |
| Package Height | 1.2 mm |
| Lead Count | 216 leads |
| 실장 유형 | Surface mount |
STM32F765NGH7 1.2 mm 핀 구성 가이드
STM32F765NGH7(1.2 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F765NGH7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F765NGH7 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Real-Time Motor and Motion Control, Networked Communications Gateway, Audio and Digital Signal Processing, Secure Embedded Data Acquisition, High-Performance Consumer Embedded Device.
Industrial Automation Controller
The STM32F765NGH7 fits high-speed industrial automation where the 216 MHz Cortex-M7 core, double-precision FPU, and DSP instructions can reduce the computational burden on a central controller. Its 1 MB flash provides room for protocol stacks, control algorithms, and field-upgrade code, while the MPU supports memory protection in systems running mixed criticality tasks. The 216-TFBGA package requires a carefully designed escape-routing layout and a capable BGA assembly process. Confirm the required industrial temperature grade and analog, communication, and timer peripheral set in the manufacturer datasheet before committing the part to a production design.
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Real-Time Motor and Motion Control
The STM32F765NGH7 is appropriate for real-time motor and motion control because its Cortex-M7 core operates at up to 216 MHz and provides up to 462 DMIPS. The double-precision FPU and DSP instructions support filtering, transforms, and other numeric workloads, while the MPU can isolate control code from communication tasks. A 1 MB flash capacity can accommodate field-oriented algorithms and diagnostics. The design must still verify timer channels, encoder interfaces, PWM outputs, ADC performance, and control-loop latency against the STM32F765-family datasheet. Its fine-pitch 216-TFBGA footprint also demands controlled BGA assembly and thermal verification.
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Networked Communications Gateway
The STM32F765NGH7 can serve as the host processor in an embedded communications gateway where protocol handling, packet processing, and control functions must coexist in real time. Its 216 MHz Arm Cortex-M7 core outperforms simpler Cortex-M devices, while 16 KB instruction and data caches help achieve zero-wait-state execution from embedded flash and suitable external memory. The 1 MB flash supports substantial firmware, and the MPU adds memory-protection options for isolated workloads. The board must provide high-quality decoupling, controlled clocking, and a 216-TFBGA-compatible stack-up. Ethernet PHY and transceiver choices must be confirmed against the MCU's actual peripheral and pin configuration.
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Audio and Digital Signal Processing
The STM32F765NGH7 suits audio and digital signal-processing modules that benefit from a Cortex-M7 core operating at up to 216 MHz. The double-precision FPU and DSP instructions can accelerate filtering, mixing, equalization, and other numerical operations, while the ART Accelerator and 16 KB instruction and data caches support efficient code execution. A 1 MB flash capacity provides room for algorithms and firmware. System-level performance still depends on the selected codec interface, sampling rate, memory configuration, and interrupt latency. Engineers should also assess analog codec power rails, clock jitter, and thermal performance because the MCU's arithmetic capability alone does not determine end-to-end audio quality.
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Secure Embedded Data Acquisition
The STM32F765NGH7 fits embedded data-acquisition equipment that must combine real-time sampling control with substantial local processing. Its 216 MHz core and DSP instructions support faster filtering and analysis, while 1 MB flash accommodates acquisition firmware, calibration tables, and communication stacks. The MPU can help partition memory and restrict access to critical routines. Developers should verify the device's ADC, DAC, timer, and DMA resources for the intended signal chain and confirm the exact package pin assignments before routing the board. The 216-TFBGA footprint also requires adequate thermal dissipation and a validated assembly process to avoid hidden yield or long-term reliability problems.
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High-Performance Consumer Embedded Device
The STM32F765NGH7 can support a high-performance consumer embedded device requiring responsive control, graphical or communications processing, and flash-resident application code. The Cortex-M7's 216 MHz operating speed and 462-DMIPS-class performance provide more headroom than entry-level 32-bit MCUs, while the double-precision FPU assists with user-interface, media, or sensor-processing workloads. Its 1 MB flash is useful for complex state machines and connectivity stacks. The implementation must account for the fine-pitch 216-TFBGA assembly requirements, thermal dissipation, and USB or display peripheral availability. A hardware bring-up should also validate boot configuration and production firmware-update procedures.
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추천 제품 요약
엔지니어링 참조 데이터: STM32F765NGH7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F765NGH6 | STM32F765NGY6 | STM32F765NGH6TR | STM32F765NGY6TR |
|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 216-TFBGA (13 x 13 mm) | 216-TFBGA (13 x 13 mm) | 216-TFBGA (13 x 13 mm) | 216-TFBGA (13 x 13 mm) | 216-TFBGA (13 x 13 mm) |
| Processor Core | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 |
| Maximum CPU Frequency | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz |
| Flash Memory | 1 MB (1M x 8) | 1 MB (1M x 8) | 1 MB (1M x 8) | 1 MB (1M x 8) | 1 MB (1M x 8) |
| Floating-Point Unit | Double-precision FPU | Double-precision FPU | Double-precision FPU | Double-precision FPU | Double-precision FPU |
| L1 Cache | 16 KB instruction cache and 16 KB data cache | 16 KB instruction cache and 16 KB data cache | 16 KB instruction cache and 16 KB data cache | 16 KB instruction cache and 16 KB data cache | 16 KB instruction cache and 16 KB data cache |
| Maximum Performance | 462 DMIPS at 216 MHz | 462 DMIPS at 216 MHz | 462 DMIPS at 216 MHz | 462 DMIPS at 216 MHz | 462 DMIPS at 216 MHz |
| Operating Voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
| Orderable Grade Difference | H7 code | H6 code; verify grade attributes | Y6 code; verify grade attributes | H6 tape-and-reel code; verify grade attributes | Y6 tape-and-reel code; verify grade attributes |
주요 차별점
- High-performance Cortex-M7 processing (vs STM32F765NGH6)
- Large onboard flash for embedded firmware (vs STM32F765NGY6)
- Signal-processing capability (vs STM32F765NGH6TR)
- Cache and memory-protection support (vs STM32F765NGY6TR)
설계 노트
Treat the 216-TFBGA land pattern as a complete manufacturing interface rather than a conventional perimeter package. Follow the STMicroelectronics package drawing and assembly guidelines for the 13 x 13 mm ball array, including pad geometry, solder-mask definition, paste stencil, via strategy, and escape routing. Validate the chosen stack-up with the PCB fabricator because the fine-pitch footprint can create solder-ball bridging, voiding, and hidden defects if the assembly process is not qualified.
Plan the 3 V power rail with low-impedance distribution and placement of decoupling capacitors close to the MCU supply and ground balls. The supplied evidence confirms a 3 V operating supply but does not provide the complete external-capacitor network, so capacitor values and ESR requirements must be copied from the manufacturer datasheet rather than inferred. Include measurement points and verify startup sequencing, voltage tolerance, and transient response on the assembled board.
Establish thermal performance during hardware bring-up rather than assuming the small BGA area guarantees adequate cooling. Estimate dissipation from the actual clock rate, enabled peripherals, I/O activity, and internal supply architecture, then confirm junction-temperature margin with board-level testing. The 216-ball package can couple heat into the PCB, so thermal performance depends on copper area, thermal vias, board construction, enclosure temperature, and the selected grade's temperature limits.
Do not substitute a generic Cortex-M7 or another STM32 family solely because the core and operating frequency match. A drop-in decision requires identical 216-ball pin functions, power domains, boot configuration, debug support, clock pins, peripheral mapping, and exposure of package balls. Likewise, do not populate the alternate H6 or Y6 order codes until the manufacturer ordering table confirms the intended grade, temperature range, qualification status, and lifecycle commitments.
규정 준수 정보
The supplied verified product data does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred.