SY89872UMG - 2 GHz 1:3 LVDS Clock Divider | Microchip
부품 번호: SY89872UMG ✓ 활성SY89872UMG 개요
A clock divider and fanout buffer is a clock and timing integrated circuit that controls the frequency relationship and distribution of a clock signal. In the broader hierarchy, it belongs to clock and timing ICs, a semiconductor category used to generate, divide, buffer, isolate, and distribute timing signals. Its two principal functions—programmable division and one-to-three fanout—help create multiple related clocks while preserving frequency alignment.
The SY89872U family supports AC-coupled or DC-coupled differential inputs in CML, LVPECL, HSTL, and LVDS formats. Its precision-edge architecture is designed for low-skew and low-jitter operation, while internal input termination simplifies high-speed clock connections. These characteristics make the device useful when several circuits must receive coherent clocks derived from one differential source.
The operating supply range is 2.375 V to 2.625 V around a nominal 2.5 V rail, and the specified temperature range is -40°C to +85°C. Maximum operating frequency is specified at more than 2 GHz. The device therefore supports demanding communication, networking, and digital-system clock trees while operating within a compact, low-voltage supply environment.
Typical uses include high-speed serial links, parallel data interfaces, network equipment, processor clock trees, test and measurement systems, and general-purpose LVDS clock distribution. In each case, the device can divide a source clock and fan it out to three outputs, reducing clock-generation circuitry while retaining deterministic timing relationships between destinations.
Designers should match differential input amplitude, coupling, termination, and output loading to the manufacturer’s recommended interface conditions. PCB routing must preserve controlled differential impedance, minimize skew between output pairs, and keep return paths continuous. The exposed thermal pad should be connected to the system ground plane using the manufacturer’s land-pattern and thermal-via guidance.
This page combines the manufacturer’s device description with package, interface, application, and sourcing guidance. It also distinguishes verified drop-in alternatives from related family members, helping engineers make a grounded compatibility decision before committing a clock-tree design to PCB fabrication.
드롭인 대체품: SY89872UMG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청SY89872UMG 사양
| Product Type | Precision LVDS clock divider and fanout buffer |
| Maximum Operating Frequency | >2 GHz |
| Fanout Ratio | 1:3 |
| Nominal Supply Voltage | 2.5 V |
| Operating Supply Voltage Range | 2.375 V to 2.625 V |
| 동작 온도 범위 | -40°C to +85°C |
| Output Logic | LVDS |
| Supported Differential Input Formats | CML, LVPECL, HSTL, or LVDS |
| Input Coupling | AC-coupled or DC-coupled |
| Input Termination | Internal termination |
| Divider Function | Programmable divide-down |
| Output Count | 3 LVDS outputs |
| 패키지 | 16-VFQFN exposed pad, 16-MLF |
| 실장 유형 | Surface mount |
SY89872UMG 16-vfqfn exposed pad, 16-mlf 핀 구성 가이드
SY89872UMG(16-vfqfn exposed pad, 16-mlf 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: SY89872UMG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SY89872UMG 적합 용도: 6 애플리케이션s: High-Speed Network Clock Distribution, Processor and FPGA Clock Trees, Serial Link Clock Fanout, Industrial Data Acquisition Systems, Test and Measurement Instrumentation, General-Purpose LVDS Clock Trees.
High-Speed Network Clock Distribution
The SY89872UMG fits network clock trees that require one high-speed differential source to feed three phase-related LVDS destinations. Its greater-than-2-GHz operating capability, 1:3 fanout, and support for CML, LVPECL, HSTL, and LVDS inputs make it useful after common serializer or transceiver clock sources. The programmable division function can create a lower, frequency-locked clock while preserving deterministic relationships between outputs. PCB implementation should use controlled-impedance differential routing, matched input and output pairs, and a continuous reference plane to minimize skew and reflections.
Processor and FPGA Clock Trees
The SY89872UMG can distribute a divided differential clock to processor, FPGA, or high-speed digital interface logic requiring up to three coordinated LVDS loads. Operating above 2 GHz and accepting both AC-coupled and DC-coupled differential inputs allow it to sit beneath a range of source-clock architectures. Low-skew and low-jitter operation are central benefits when maintaining timing relationship across parallel or serial domains. Designers should confirm the required divider setting, input amplitude, output termination, and target-device clock thresholds against the manufacturer guidance before layout release.
Serial Link Clock Fanout
The SY89872UMG is appropriate for serial-link clock trees that need multiple coherent LVDS outputs from a differential source. Its 1:3 distribution reduces the number of separate clock branches while the programmable divider can generate a lower speed related to the incoming signal. This arrangement is useful in communications equipment where parallel data paths, converters, or retimers must remain synchronized. Correct implementation depends on maintaining consistent differential impedance, avoiding excessive output loading, and verifying edge-rate and jitter requirements at the connected receivers.
Industrial Data Acquisition Systems
Industrial acquisition equipment can use the SY89872UMG to divide and fan out a common differential sampling or transfer clock across three subsystems. The 2.375 V to 2.625 V operating range, industrial temperature qualification of -40°C to +85°C, and support for several differential logic families suit compact embedded systems. Clock distribution helps each subsystem operate from a related phase reference, which is important when data must be transferred across multiple converters or digital engines. Layout review should include return-path continuity, pair-length control, and separation from switching power and high-current traces.
Test and Measurement Instrumentation
The SY89872UMG can provide programmable divide-down and 1:3 fanout functions inside high-speed test and measurement instruments. These systems often require coherent clocks for parallel converters, acquisition channels, and digital processing sections while limiting the number of clock-generation resources. The greater-than-2-GHz capability supports high-speed links, while LVDS output and flexible differential input support simplify interconnects. Engineers should evaluate jitter and skew against the complete acquisition budget and use the manufacturer’s recommended output termination and reference-plane geometry for repeatable measurements.
General-Purpose LVDS Clock Trees
The SY89872UMG serves general-purpose LVDS clock trees in systems requiring one programmable divider followed by three outputs. Differential inputs may be AC-coupled or DC-coupled and use CML, LVPECL, HSTL, or LVDS signaling, which simplifies integration with multiple clock-generating blocks. The compact 16-VFQFN exposed-pad package supports space-constrained designs when its land pattern and thermal connection are followed carefully. Because the package includes an exposed pad, assembly process capability and copper exposure must be considered alongside electrical fanout and routing requirements.
엔지니어링 참조 데이터: SY89872UMG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Package | 16-VFQFN exposed pad, 16-MLF |
| Brand | Microchip Technology |
| Product Type | Precision LVDS clock divider and fanout buffer |
| Maximum Operating Frequency | >2 GHz |
| Fanout Ratio | 1:3 |
| Nominal Supply Voltage | 2.5 V |
| Operating Supply Voltage Range | 2.375 V to 2.625 V |
| Output Logic | LVDS |
| Operating Temperature Range | -40°C to +85°C |
주요 차별점
- Programmable division and three-way distribution in one clock IC (vs SY89872UMG-TR)
- High-speed differential input flexibility (vs SY89833LMG)
- Low-power 2.5 V operating environment (vs SY89875UMG)
설계 노트
Route the differential input and all three LVDS output pairs as controlled-impedance transmission lines over a continuous reference plane. Keep pair geometry symmetric and match lengths where the timing architecture requires it. Avoid plane changes, split return paths, and nearby high-current switching traces because these discontinuities can create reflections and increase deterministic jitter. Use the manufacturer’s recommended layer stack and impedance target rather than estimating them from package geometry.
Use the official 16-VFQFN land pattern and follow the exposed-pad thermal-via recommendation in the manufacturer package documentation. The thermal pad is part of both heat transfer and, as specified by the package design, must be connected according to the datasheet. Confirm the PCB’s solder mask, paste, assembly, and via-in-pad capabilities before releasing the footprint. A mechanically similar footprint should not be accepted without dimensional comparison to the official drawing.
Confirm the input amplitude, coupling method, common-mode range, and termination arrangement for the selected CML, LVPECL, HSTL, or LVDS source before fabrication. Although internal termination is available, it may not be suitable for every external network. Validate the programmed divider setting and output loading at the target frequency, and use the manufacturer’s eye or waveform recommendations to verify output rise time, overshoot, and deterministic jitter on the assembled board.
규정 준수 정보
The product information identifies a -40°C to +85°C industrial temperature range but does not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable because the device is not identified as an automotive-qualified variant.
