TPA3255DDVR - 315W Stereo Class-D Amplifier | Texas Instruments
부품 번호: TPA3255DDVR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $10.6756 | $10.68 |
| 10 | $10.6756 | $106.76 |
| 100 | $10.6756 | $1,067.56 |
| 500 | $10.6756 | $5,337.80 |
| 1,000 | $10.6756 | $10,675.60 |
TPA3255DDVR 개요
A Class-D audio amplifier is a switching power amplifier that uses transistor switching to deliver audio energy efficiently. In the broader hierarchy, a Class-D amplifier belongs to audio amplifiers, linear and nonlinear power amplifiers, and power-management semiconductor systems. Compared with a conventional linear audio amplifier, its switching architecture can reduce wasted power and heat while maintaining high output capability.
The verified product information identifies 315 W stereo output, 600 W mono output, analog input, an 18 V to 53.5 V supply range, and a 44-pin HTSSOP package. The distributor listing also identifies the amplifier as a two-channel stereo Class-D device. These ratings make it suitable for professional audio, home-theater, public-address, multimedia, and other high-power sound systems where load capability and efficiency are important.
Thermal design is central to using this amplifier because Class-D power stages can dissipate substantial heat at high output power. The DDV package provides a large thermal pad for board-level heat spreading, but the exact thermal resistance, output configuration details, protection thresholds, and application-specific limits must be taken from the manufacturer datasheet. The verified distributor information reports a 44-pin PowerTSSOP package and an operating-temperature range of 0 to 70 °C for the listed orderable part.
Typical implementation uses analog audio inputs into the Class-D power stage, with speaker outputs driving stereo or bridged mono configurations. The amplifier is appropriate when the system supply is in the verified 18 V to 53.5 V range and the load is compatible with the manufacturer-defined output power conditions. Board layout, speaker wiring, grounding, thermal management, and protection circuitry should follow the TI datasheet and evaluation-board guidance.
This product page combines verified Texas Instruments specifications, distributor package and sourcing information, application guidance, and verified cross-reference results. It distinguishes the high-power TPA3255DDVR from lower-power or functionally similar parts that may use different packages or pin configurations.
드롭인 대체품: TPA3255DDVR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TPA3255DDV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPA3255TDDVRQ1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPA3255DDVR 최대 정격 & 전기적 특성
| Product Type | Analog-input Class-D audio power amplifier |
| Channel Configuration | 2-channel stereo |
| Stereo Output Power | 315 W |
| Mono Output Power | 600 W |
| Supply Voltage Range | 18 V to 53.5 V |
| Input Type | Analog input |
| 패키지 | 44-pin HTSSOP (DDV) |
| PowerTSSOP Width | 6.10 mm |
| 실장 유형 | Surface mount |
| 핀 수 | 44 pins |
| 동작 온도 | 0 °C to 70 °C |
| Technology | Class-D switching audio amplification |
| Power Management Classification | Audio power amplifier IC |
| Thermal Pad | Exposed thermal pad on PowerTSSOP package |
| Distributor Package Description | 44-PowerTSSOP (0.240 inch, 6.10 mm width) |
| Manufacturer | Texas Instruments |
TPA3255DDVR 44-powertssop (0.240 inch, 6.10 mm width) 핀 구성 가이드
TPA3255DDVR(44-powertssop (0.240 inch, 6.10 mm width) 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: TPA3255DDVR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
TPA3255DDVR 적합 용도: 6 애플리케이션s: Professional Power Amplifier, Home Theater Stereo Amplification, Public Address and Venue Sound, Multimedia Speaker Amplifier, Subwoofer Amplifier, Conference and Installation Audio.
Professional Power Amplifier
The TPA3255DDVR suits professional power-amplifier stages where verified 315 W stereo and 600 W mono ratings are useful for driving substantial loudspeaker loads. Its Class-D architecture supports efficient power conversion, while the 18 V to 53.5 V supply range accommodates high-voltage audio systems. The 44-pin HTSSOP package requires careful PCB layout, exposed-pad heat spreading, thermal vias, and a heat sink sized from the manufacturer’s thermal data. Speaker impedance, output configuration, cooling, and protection settings must be validated against TI documentation.
추천
Home Theater Stereo Amplification
For home-theater and multi-channel audio systems, the TPA3255DDVR can serve as a high-power stereo stage with verified 315 W stereo capability. The analog input architecture allows connection to preamplifiers and surround-audio processing systems, while the Class-D topology targets efficient amplification. In a real installation, thermal dissipation, speaker impedance, channel-to-channel matching, and clean power-supply design are critical. Use the DDV land pattern and thermal recommendations from TI rather than estimating copper requirements from nominal power alone.
추천
Public Address and Venue Sound
The TPA3255DDVR is applicable to public-address and installed-sound systems that require high stereo output or bridged mono capability. Its verified 600 W mono rating can support appropriately designed high-power channels, while the 18 V to 53.5 V supply range supports higher-voltage amplifier architectures. Deployment should include speaker protection, current-limited supply wiring, chassis or rack thermal management, and verified grounding. The exact output power depends on load, supply, channel mode, and the TI test conditions.
추천
Multimedia Speaker Amplifier
The TPA3255DDVR can be used in multimedia speaker platforms that need more output than a conventional low-power audio amplifier. The verified 315 W stereo rating provides substantial amplification capability, while Class-D efficiency can reduce heat relative to inefficient linear approaches in suitable implementations. Analog input signals can originate from preamplifier, mixer, or line-level stages. Designers should preserve signal integrity, keep high-current outputs separated from sensitive inputs, and use the manufacturer’s recommended bypass and output-network values.
추천
Subwoofer Amplifier
A TPA3255DDVR can be considered for a high-power subwoofer power stage when the speaker load, supply, and thermal design are compatible with the device’s verified ratings. The 600 W mono configuration is relevant for single-channel high-power use, but the amplifier is not automatically appropriate for every subwoofer impedance. Low-frequency stability, speaker protection, output filtering, and power-supply current capability require engineering review. The DDV package and exposed pad should be thermally coupled to the board or heat sink.
추천
Conference and Installation Audio
The TPA3255DDVR can support conference-room, hospitality, and fixed-installation audio systems that require high-power, efficient amplification. Its analog input allows connection to mixers and distribution amplifiers, and its stereo or mono modes provide flexibility for different speaker arrangements. The primary engineering concerns are thermal reliability, output protection, EMI control, and safe high-voltage wiring. Confirm the exact load, enclosure temperature, grounding arrangement, and thermal margin using the official datasheet before production deployment.
추천
추천 제품 요약
엔지니어링 참조 데이터: TPA3255DDVR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TPA3255DDV | TPA3255TDDVRQ1 |
|---|---|---|---|
| Package | 44-pin HTSSOP (DDV) | 44-pin HTSSOP (DDV) | 44-pin HTSSOP (DDV) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments |
| Stereo Output Power | 315 W | 315 W | 315 W |
| Supply Voltage Range | 18 V to 53.5 V | 18 V to 53.5 V | 18 V to 53.5 V |
| Channel Configuration | 2-channel stereo | 2-channel stereo | 2-channel stereo |
| Input Type | Analog input | Analog input | Analog input |
주요 차별점
- High verified power capability (vs TPA3255DDV)
- Mono headroom (vs TPA3255TDDVRQ1)
- Automotive-oriented alternative for harsher qualification (vs TPA3255DDVR)
설계 노트
Estimated thermal planning should begin with the actual dissipation in the selected stereo, bridged-mono, supply, load, and output-power condition. At high output power, the DDV exposed thermal pad must be connected to a carefully sized copper area and thermal-via field. Do not use the 2.5 W figure reported by a third-party comparison search as a universal design limit; verify the manufacturer’s power-dissipation and thermal-resistance data before selecting a heat sink or enclosure airflow.
Use the official TI DDV land pattern and keep the high-current supply and speaker-output paths short, wide, and physically separated from analog input traces. Place the required input, supply, and output capacitors close to their associated pins, and provide multiple thermal vias beneath the exposed pad where the package and board process permit. Confirm via current capability and copper thickness against the maximum channel current required by the chosen operating mode.
The verified 18 V to 53.5 V supply range must include startup, audio-transient, ripple, and droop conditions at the amplifier terminals. Use a supply capable of delivering the current demanded by the configured output power, and follow TI’s recommended bulk and bypass capacitance. Avoid relying on nominal supply voltage alone: inadequate low-frequency energy can cause clipping, current limiting, or unstable operation even when the average supply reading is within range.
Treat the amplifier as a high-current switching power stage rather than a generic audio IC. Keep speaker outputs away from microphone, preamp, and control circuitry, use a continuous ground reference where appropriate, and route thermal and output-current paths to minimize loop area. Validate EMI and output stability using the manufacturer’s evaluation board before copying the layout into a dense consumer or industrial product.
규정 준수 정보
The supplied verified search results do not provide direct RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements for TPA3255DDVR. Obtain current Texas Instruments compliance documentation before making a regulatory claim.
