TPD2EUSB30 - 2-Ch 0.7pF USB 3.0 ESD Protector | Texas Instruments
부품 번호: TPD2EUSB30 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0.62 | $0.62 |
| 10 | $0.52 | $5.20 |
| 100 | $0.38 | $38.00 |
| 500 | $0.29 | $145.00 |
| 1,000 | $0.24 | $240.00 |
| 3,000 | $0.19 | $570.00 |
TPD2EUSB30 개요
A Transient Voltage Suppressor (TVS) diode array is a passive protection device that clamps transient over-voltages (such as ESD strikes, cable discharge events, and lightning-induced surges) to a safe level, protecting downstream ICs. TVS arrays sit at the boundary of the ESD-sensitive analog/digital subsystem hierarchy: TVS diode -> ESD protector -> interface protection IC -> power management IC -> semiconductor. Their capacitance and leakage directly affect signal integrity on high-speed lines, making ultra-low capacitance (sub-1 pF) critical for USB 3.0, HDMI, and DisplayPort links.
The TPD2EUSB30's key features include 0.7 pF typical line capacitance (compatible with 6 Gbps SuperSpeed signaling), 0.05 µA maximum leakage current, and an 8 V working voltage. Each channel integrates a TVS steering diode plus a TVS clamp, allowing a single 3-pin SOT-23 package to protect two data lines (D+/D-) without requiring an external bias supply. The TPD2EUSB30A variant (pin-compatible) adds integrated VBUS protection.
Typical applications include USB 3.0 host and device port protection, USB Type-A and Type-B connectors, USB 3.0 hubs, docking stations, smartphones, tablets, and laptops. Designers select this part when signal-integrity preservation at 5 Gbps and beyond is mandatory and board area is constrained.
When designing with this device, place the TPD2EUSB30 within 3 mm of the USB connector and route protected traces directly to the protected IC. Avoid routing protected and unprotected traces in parallel to prevent ESD coupling.
This page synthesizes distributor stock data, drop-in alternatives (TPD2EUSB30A, TPD4EUSB30, etc.), and practical PCB layout guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: TPD2EUSB30 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TPD2EUSB30A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPD2EUSB30DRTR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPD4EUSB30
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPD2EUSB30 사양
| Number of Channels | 2 |
| ESD Contact Rating | ±8 kV (IEC 61000-4-2) |
| ESD Air-Gap Rating | ±15 kV (IEC 61000-4-2) |
| Surge Rating | 5 A (8/20 µs) |
| Working Voltage (Vrwm) | 5.5 V |
| Clamping Voltage | 8 V |
| Line Capacitance (Cd) | 0.7 pF typical |
| Leakage Current (Ir) | 0.05 µA max |
| 데이터 속도 | Up to 6 Gbps (USB 3.0 SuperSpeed) |
| Diode Structure | TVS array, 2 channels |
| 패키지 | SOT-23-3 (DRT) 2.9 x 1.6 mm |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C |
| MSL 레벨 | 1 (unlimited) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
TPD2EUSB30 핀 구성
| 핀 1 | CH1 — Channel 1 protected line (D+ or TX1+) |
| 핀 2 | CH2 — Channel 2 protected line (D- or TX1-) |
| 핀 3 | GND — Ground reference for TVS clamps |
일반적인 애플리케이션
TPD2EUSB30 적합 용도: 6 애플리케이션s: USB 3.0 Host/Device Port Protection, Smartphone and Tablet USB Port, USB 3.0 Hub Protection, Laptop and Notebook USB Port, Docking Station USB 3.0 Ports, External Storage SSD/HDD Enclosure.
USB 3.0 Host/Device Port Protection
The TPD2EUSB30 is purpose-built for USB 3.0 SuperSpeed (5 Gbps) host and device port protection. Its 0.7 pF typical line capacitance is well below the loading budget for 6 Gbps signal integrity, preserving eye-diagram margin across the D+/D- or TX/RX differential pairs. The ±8 kV IEC 61000-4-2 contact rating exceeds USB-IF compliance testing requirements, and the 5 A (8/20 µs) surge rating handles cable discharge events that occur during hot-plug of USB 3.0 cables. Placed within 3 mm of the USB Type-A or Type-B receptacle, it provides a low-impedance path to ground for ESD transients. Unlike discrete zener clamps, the integrated TVS steering diode design requires no external bias supply, simplifying BOM.
추천
Smartphone and Tablet USB Port
Mobile devices require robust USB Type-C or Micro-B port protection while operating under severe ESD exposure from user handling. The TPD2EUSB30's 0.7 pF capacitance preserves high-speed signal integrity on USB 3.0 mobile data lines, and its 3-pin SOT-23-3 (DRT) package fits within the tight PCB real estate of a phone motherboard. The ±15 kV air-gap rating exceeds IEC 61000-4-2 Level 4, the standard mobile-device ESD qualification level. Low 0.05 µA leakage current minimizes battery drain in always-on protection paths. The exposed pad provides a low-thermal-resistance ground bond, important for sustaining repeated surge events during the device's operational lifetime.
추천
USB 3.0 Hub Protection
USB 3.0 hubs require per-port ESD protection while maintaining 5 Gbps signal integrity across all downstream ports. The TPD2EUSB30 protects each downstream D+/D- pair with its 0.7 pF capacitance, ensuring that hub-to-device signal paths meet USB 3.0 compliance eye-diagram masks. Hubs typically use one TPD2EUSB30 per two downstream ports (one part protects both data lines of a single port), allowing 4-port hubs to deploy two parts for full coverage. The 5 A surge rating protects against cable discharge events during hot-plug of downstream peripherals, and the small SOT-23-3 footprint enables dense hub PCB layouts. The 5.5 V working voltage safely covers VBUS rail transients.
추천
Laptop and Notebook USB Port
Laptop USB 3.0 ports are exposed to frequent ESD events from peripheral cable mating and user contact. The TPD2EUSB30's ±8 kV contact and ±15 kV air-gap ratings handle direct human-body discharge scenarios encountered when plugging USB devices. Its 0.7 pF capacitance preserves USB 3.0 SuperSpeed signal integrity, which is critical for external SSD and high-resolution webcam applications that depend on full 5 Gbps throughput. The SOT-23-3 (DRT) package allows placement adjacent to side-edge USB connectors where PCB area is constrained. Low 0.05 µA leakage supports always-on operation without measurable battery drain.
추천
Docking Station USB 3.0 Ports
Docking stations aggregate multiple USB 3.0 downstream ports and are typically connected to upstream hosts via longer cables that pick up ESD transients. The TPD2EUSB30 placed near each downstream port absorbs IEC 61000-4-2 strikes before they propagate to the host or downstream devices. Its 5 A (8/20 µs) surge rating handles cable discharge events on the longer cables characteristic of docking-station installations. The 0.7 pF capacitance maintains signal integrity for USB 3.0 SuperSpeed throughput across multiple simultaneous ports. The compact SOT-23-3 package supports the high port density typical of docking station designs.
추천
External Storage SSD/HDD Enclosure
External USB 3.0 SSD and HDD enclosures present exposed USB Type-B or Micro-B connectors to user environments, requiring robust ESD protection. The TPD2EUSB30's 0.7 pF capacitance preserves USB 3.0 SuperSpeed throughput that SSD enclosures depend on for maximum sequential read/write performance (typically 400+ MB/s). The ±8 kV contact and ±15 kV air-gap ratings protect the internal storage controller and bridge IC from ESD strikes during cable mating. Its 5.5 V working voltage tolerates VBUS transients common in USB power delivery scenarios. The SOT-23-3 footprint fits easily within the small enclosure PCB of portable storage products.
추천
추천 제품 요약
엔지니어링 참조 데이터: TPD2EUSB30 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TPD2EUSB30A | TPD2EUSB30DRTR | TPD4EUSB30 |
|---|---|---|---|---|
| Package | SOT-23-3 (DRT) | SOT-23-3 (DRT) - same | SOT-23-3 (DRT) - same | SOT-23-3 (DRT) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Number of Channels | 2 | 2 (+ VBUS) | 2 | 4 |
| ESD Contact Rating | ±8 kV | ±8 kV | ±8 kV | ±8 kV |
| Line Capacitance | 0.7 pF | 0.7 pF | 0.7 pF | 0.7 pF |
| Working Voltage | 5.5 V | 5.5 V (with VBUS clamp) | 5.5 V | 5.5 V |
| Surge Rating | 5 A (8/20 µs) | 5 A (8/20 µs) | 5 A (8/20 µs) | 5 A (8/20 µs) |
| VBUS Protection | No | Yes (integrated) | No | No |
| Approx. Unit Price (qty-1) | $0.62 | $0.68 | $0.62 | $0.85 |
주요 차별점
- Industry-standard USB 3.0 ESD reference design (vs TPD4EUSB30)
- VBUS protection upgrade path (vs TPD2EUSB30A)
- Sub-1 pF capacitance for 5 Gbps signal integrity (vs Discrete zener TVS clamps)
설계 노트
Place the TPD2EUSB30 within 3 mm of the USB connector signal pins to minimize the inductance of the ground-return path. The protected (connector-side) and protected (IC-side) traces must not run in parallel for more than a few millimeters, as this allows ESD energy to couple through parasitic capacitance. Use a solid ground plane on the layer directly beneath the device to provide a low-impedance discharge path. The exposed thermal pad (where present on DRT package) MUST be soldered to the ground plane to maximize surge current handling.
The 0.7 pF typical line capacitance loads the USB 3.0 differential pairs. Estimated: at 5 GHz, this presents an impedance of approximately 45 ohms to ground per line, well within the USB 3.0 TX/RX pair impedance budget. For USB 2.0-only designs, the TPD2EUSB30's capacitance has negligible impact on the 480 Mbps signal. Avoid adding multiple TPD2EUSB30 in parallel on the same line, as cumulative capacitance will degrade USB 3.0 eye-diagram margin.
Do not use the TPD2EUSB30 on lines with continuous DC voltage exceeding 5.5 V - the working voltage (Vrwm) rating of 5.5 V must not be exceeded or the TVS clamps will conduct continuously, leading to thermal failure. For USB PD (Power Delivery) lines that can carry 20 V, use a higher-Vrwm TVS such as TPD4E05U06 instead. Do not omit the device's ground connection - an ungrounded TVS cannot dissipate ESD energy and may itself be destroyed by the first ESD strike.
규정 준수 정보
RoHS and lead-free compliance per TI product page. IEC 61000-4-2 ESD rating ±8 kV contact / ±15 kV air-gap. Not AEC-Q100 qualified - for automotive USB protection, use TPD2EUSB30A-Q1 or TPD4EUSB30-Q1.
