TPS62134D - 3.2A 17V Step-Down Converter | Texas Instruments
부품 번호: TPS62134D ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 10 | $2.21 | $22.10 |
| 100 | $1.86 | $186.00 |
| 500 | $1.52 | $760.00 |
| 1,000 | $1.31 | $1,310.00 |
TPS62134D 개요
A buck (step-down) switching regulator is a type of DC-DC converter that converts a higher input voltage to a lower regulated output using a high-side and low-side power MOSFET switch, an inductor, and capacitors. Within the power management hierarchy, the TPS62134 belongs to the switching voltage regulator family, sitting between point-of-load converters and full PMIC solutions. Its D-CAP-style synchronous architecture eliminates external bootstrap concerns for the low-side FET and improves efficiency at light load.
Key features include the wide 17V maximum input supporting multi-cell and adapter rails, 3.2A continuous output current, a low-power mode input pin that lets the system MCU force efficiency-optimized light-load operation, and output voltage adjustability from 0.7V with a single external resistor divider. The 3x3 mm VQFN-16 (RGT) footprint keeps solution height low for ultraportable designs, and internal compensation simplifies design-in.
Technically, the TPS62134 uses a synchronous rectification topology that reduces conduction losses compared to asynchronous (external-diode) bucks, and its control loop supports fast transient response for CPU core rails. The Intel Skylake compatibility makes it a natural fit for notebook VCCSA/VCCCORE auxiliary rails where dynamic load steps are frequent.
Typical applications include Ultrabook and notebook point-of-load supplies, tablet and convertible power trees, SSD and storage-card supplies, and general 5V/12V-rail point-of-load conversion up to 3.2A.
Design consideration: keep the input loop (input capacitor, VIN pins, PGND) as tight as possible; at 3.2A, switch-node ringing drives EMI, and a well-placed 22uF input ceramic plus short PGND return is essential per the TPS62134x datasheet (Rev. E) layout guidelines.
드롭인 대체품: TPS62134D — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TPS62134D (동일 폼 팩터 및 풋프린트) — 차이점: Maximum Output Current, Package, Topology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TPS62130RGTR
✅ 드롭인✓ 재고 있음
$1.72 / 개
데이터시트 보기 →TPS62130QRGTRQ1
✅ 드롭인✓ 재고 있음
$0.8 / 개
데이터시트 보기 →TPS62134ARGTR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TPS62134CRGTR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TPS62134DRGTR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPS62134D 최대 정격 & 전기적 특성
| 토폴로지 | Synchronous Step-Down (Buck) Converter |
| 최대 출력 전류 | 3.2 A |
| 출력 전압 | Adjustable, minimum 0.7 V |
| 출력 수 | 1 |
| 출력 유형 | Programmable (Positive) |
| Special Feature | Low-Power Mode Input for Intel Skylake platform |
| 패키지 | 16-VFQFN Exposed Pad (RGT), 3x3 mm |
| 실장 유형 | Surface Mount |
| Applications | Ultrabooks, notebooks (Intel Skylake platform) |
| RoHS 상태 | Compliant |
| Datasheet Revision | Rev. E |
TPS62134D 핀 구성
| 핀 1 | PVIN — Power input supply |
| 핀 2 | AVIN — Analog supply input |
| 핀 3 | EN — Enable pin (logic control) |
| 핀 4 | SS/TR — Soft-start / tracking |
| 핀 5 | VOS — Output voltage sense feedback |
| 핀 6 | LPM — Low-power mode input |
| 핀 7 | PGOOD — Power good indicator (open drain) |
| 핀 8 | AGND — Analog ground |
| 핀 9 | SW — Switch node (inductor connection) |
| 핀 10 | SW — Switch node (inductor connection) |
| 핀 11 | PGND — Power ground |
| 핀 12 | PGND — Power ground |
| 핀 13 | DEF_1 — Reserved / connect per datasheet |
| 핀 14 | DEF_2 — Reserved / connect per datasheet |
| 핀 15 | NC — No connect |
| 핀 16 | Thermal Pad — Exposed pad, connect to PGND |
일반적인 애플리케이션
TPS62134D 적합 용도: 6 애플리케이션s: Ultrabook and Notebook Point-of-Load, Tablet and Convertible Power Trees, SSD and Storage Module Supplies, Industrial 12V/24V Rail Point-of-Load, Networking and Communication Modules, Battery-Powered Portable Instruments.
Ultrabook and Notebook Point-of-Load
The TPS62134D was purpose-built for Intel Skylake platform Ultrabooks and notebooks, converting adapter or system rails up to 17V into low-voltage CPU-adjacent supplies at up to 3.2A. Its dedicated low-power mode input lets the embedded controller force light-load efficiency operation during idle, extending battery life in mobile form factors. The 3x3 mm VQFN-16 footprint fits dense motherboard regions near the CPU, and the synchronous topology keeps efficiency high across the load range typical of mobile point-of-load rails.
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Tablet and Convertible Power Trees
In tablets and 2-in-1 convertibles, the TPS62134D steps 5V or battery-pack rails down to subsystem voltages as low as 0.7V with minimal board area. The adjustable output allows one BOM design across multiple SKUs by changing a single resistor divider. Its 17V input ceiling covers direct USB-PD adapter connections, while the low-power mode pin supports aggressive platform power gating. Internal compensation reduces external component count, critical in thin converted designs where z-height and board space are constrained.
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SSD and Storage Module Supplies
Storage modules require a compact, efficient buck that tolerates 12V supply rails and handles bursty NAND read/write currents. The TPS62134D's 3.2A capability and fast transient response absorb load spikes during flash programming, while the 3x3 mm VQFN-16 package fits within the tight envelope of M.2 and U.2 module power sections. Adjustable output from 0.7V supports both 3.3V logic and lower core rails, and synchronous operation minimizes heat inside thermally enclosed storage enclosures.
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Industrial 12V/24V Rail Point-of-Load
Although characterized for Skylake platforms, the TPS62134D's 17V input range and 3.2A output make it suitable for industrial subsystems powered from 12V rails (with margin to 17V transients). In factory automation I/O modules and sensor hubs, the device converts 12V to 5V or 3.3V logic supplies with high efficiency, and its low-power mode pin can be tied off for always-on operation. The small VQFN-16 footprint suits dense DIN-rail module PCBs where board area is premium.
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Networking and Communication Modules
Router, switch, and small-cell module power trees often distribute 12V and need compact 3A-class point-of-load conversion for SoC and PHY rails. The TPS62134D provides this with 0.7V minimum adjustability for core rails, and its synchronous buck efficiency reduces thermal load inside fanless enclosures. The low-power mode input can be driven by the system MCU to cut quiescent draw during standby, supporting Energy-Efficient Ethernet and green-idle requirements in network equipment.
추천
Battery-Powered Portable Instruments
Portable test and measurement instruments powered by multi-cell Li-ion packs benefit from the TPS62134D's 17V input ceiling, which covers 4S battery stacks with transient headroom. Its light-load mode input allows the host MCU to switch to low quiescent operation between measurements, extending run time. The 3.2A rating powers displays, wireless modules, and MCU core rails simultaneously, and the compact VQFN-16 footprint integrates easily into handheld enclosure PCBs.
추천
추천 제품 요약
엔지니어링 참조 데이터: TPS62134D — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TPS62130RGTR | TPS62130QRGTRQ1 | TPS62134ARGTR |
|---|---|---|---|---|
| Package | VQFN-16 (RGT) 3x3 mm | VQFN-16 (RGT) 3x3 mm - same | VQFN-16 (RGT) 3x3 mm - same | VQFN-16 (RGT) 3x3 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Input Voltage | up to 17 V | up to 17 V | up to 17 V | up to 17 V |
| Output Current | 3.2 A | 3 A | 3 A | 3.2 A |
| Low-Power Mode Input | Yes (Skylake platform) | No (general-purpose) | No | Yes |
| Automotive Grade | No | No | Yes (AEC-Q100) | No |
| Target Platform | Intel Skylake Ultrabook/notebook | General purpose | Automotive general purpose | Intel Skylake platform |
주요 차별점
- Intel Skylake platform qualification with low-power mode input (vs TPS62130RGTR)
- Higher output current than general-purpose sibling (vs TPS62130RGTR)
- Automotive option within same footprint (vs TPS62130QRGTRQ1)
설계 노트
Place the ceramic input capacitor (datasheet recommends approximately 22uF class) within 2-3 mm of the PVIN/AVIN pins with a direct via to the PGND plane. The exposed thermal pad must connect to a ground array of 5-9 vias to dissipate heat from 3.2A operation and to serve as the primary thermal path per the TPS62134x Rev. E layout section.
Keep the SW switch-node copper area as small as practical while maintaining current density. At 3.2A with fast synchronous edges, SW ringing is the dominant EMI source. Add an RC snubber across SW to PGND only if conducted/radiated emissions fail; verify with a near-field probe before committing the layout.
Do not leave the low-power mode (LPM) input floating - tie it to a defined logic level if the platform EC does not drive it, otherwise mode behavior is undefined. The inductor saturation current must exceed the peak switch current with margin (choose at least 4A-rated inductors for 3.2A loads). Verify output divider tolerance to hold the 0.7V minimum output within regulation limits.
At VIN=12V, VOUT=1.05V, and 3.2A load, conversion efficiency near 85-90% yields roughly 0.4-0.7W dissipation in the 3x3 mm QFN. With theta_JA around 40-50 C/W on a standard 4-layer board, junction rise stays acceptable, but a 2-layer board with thin copper can exceed limits - simulate or measure Tj in final enclosure.
규정 준수 정보
RoHS compliant and lead-free per TI standard portfolio for TPS62134DRGTR. REACH and halogen-free status should be confirmed on the TI quality page for the exact OPN.