TPS62355DRC - 1A 3MHz Sync Step-Down Converter | TI
부품 번호: TPS62355DRC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.42 | $24.20 |
| 100 | $1.95 | $195.00 |
| 500 | $1.62 | $810.00 |
| 1,000 | $1.38 | $1,380.00 |
TPS62355DRC 개요
A buck (step-down) converter is a switching regulator topology that uses an inductor and a control loop to deliver a lower output voltage from a higher input rail with high efficiency. The synchronous variant replaces the external rectifier diode with an internal low-side MOSFET, which reduces conduction loss and enables efficiencies above 88% at 3 MHz. Buck converters sit within the broader power-management IC family and are preferred over linear regulators when the input-to-output voltage difference is large, because dissipation scales with (VIN minus VOUT) times IOUT rather than VIN.
Key features of the TPS62355DRC include a 3 MHz fixed switching frequency, best-in-class load and line transient response, a complete 1 mm component profile solution that enables ultra-thin PCB designs, and ±2 percent PWM DC voltage accuracy. The I2C-compatible interface allows the system processor to reprogram VOUT on the fly for dynamic voltage scaling, a critical technique for extending battery life in smartphones, wearables, and other portable devices.
Architecturally, the device integrates high-side and low-side MOSFETs in a single die, eliminating the external rectifier and shrinking the overall solution to roughly 4 mm x 5 mm. The 3 MHz switching frequency allows the use of a 1 uH inductor and tiny ceramic output capacitors, and the exposed thermal pad keeps junction temperature low even under full 1 A load.
Typical applications include single-cell Li-ion powered portable electronics such as smartphones, tablet computers, and wearable devices, as well as USB-powered peripherals, Bluetooth headsets, and low-power FPGAs requiring small-footprint core rails. The I2C programmability makes it especially attractive in dynamic voltage scaling (DVS) schemes where the application processor reduces its supply voltage during idle periods to minimize battery drain.
When designing with this part, prioritize a tight, low-ESR ceramic output capacitor placed within 1 mm of the DRC pad and follow the recommended 1 uH chip inductor with less than 50 mohm DCR for peak efficiency. Designers should also budget the I2C pull-ups for 400 kHz Fast-Mode operation when system response time matters.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: TPS62355DRC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TPS62355DRCR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPS62350DRC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPS62351DRC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPS62352DRC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPS62354DRC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPS62355DRC 최대 정격 & 전기적 특성
| 토폴로지 | Synchronous Buck (Step-Down) |
| 입력 전압 범위 | 2.7 V to 6.0 V |
| 출력 전압 범위 | 0.75 V (default), 0.9 V and 1.15 V selectable via I2C; adjustable |
| 최대 출력 전류 | 1 A (1000 mA) / 800 mA specified |
| 스위칭 주파수 | 3 MHz fixed |
| 효율 | 88% at 3 MHz operation |
| Output Voltage Accuracy | ±2% PWM DC |
| 인터페이스 | I2C-compatible (dynamic voltage scaling) |
| 패키지 | 10-pin VSON/DFN (DRC) with exposed pad |
| Component Profile | 1 mm total solution height |
| 동작 온도 | -40C to +85C |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Internal Switches | High-side and low-side MOSFETs integrated |
TPS62355DRC 핀 구성
| 핀 1 | PGND — Power ground |
| 핀 2 | VIN — Input supply voltage |
| 핀 3 | AGND — Analog ground |
| 핀 4 | EN — Enable (active high) |
| 핀 5 | VSEL — Voltage select / I2C address line |
| 핀 6 | SDA — I2C data |
| 핀 7 | SCL — I2C clock |
| 핀 8 | FB — Feedback / output voltage sense |
| 핀 9 | VOUT — Power output to inductor |
| 핀 10 | EP — Exposed thermal pad (must be soldered to PCB ground) |
일반적인 애플리케이션
TPS62355DRC 적합 용도: 7 애플리케이션s: Smartphone Application Processor Core Rail, Wearable Device Power Supply, Portable Bluetooth Headset Power Management, Tablet Core Rail and Peripherals, USB-Powered Portable Device, Low-Power FPGA Core Supply, IoT Sensor Node and Edge Device.
Smartphone Application Processor Core Rail
The TPS62355DRC is widely used to power smartphone application processors (AP) and SoCs from a 3.7 V nominal single-cell Li-ion source. Its I2C-compatible interface allows the AP's power management firmware to dynamically reprogram VOUT between 0.75 V and 1.15 V during idle and active states, directly extending battery runtime by 15-30%. The 88% efficiency at 3 MHz means less wasted power and lower PCB thermal rise inside the phone's compact chassis. A typical bill-of-materials uses 1 uH chip inductor and 4.7 uF X5R ceramic output caps. Compared to a linear regulator, the buck converter avoids the (VIN-VOUT) x IOUT dissipation penalty when the AP is at 1 GHz.
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Wearable Device Power Supply
Wearable devices such as smartwatches and fitness bands rely on the TPS62355DRC to deliver sub-1.8 V rails to BLE radios, microcontrollers, and OLED display drivers. The DRC package's 1 mm total component height (per TI's datasheet) enables ultra-thin wearable enclosures. The I2C pin enables the host MCU to drop VOUT during deep-sleep to under 0.8 V, reducing quiescent drain. A 3 MHz switching frequency avoids audible noise through ceramic capacitors at the small form factor. Designers typically pair it with a coin-cell boost converter and a small 1 uH chip inductor to fit sub-50 mm² total footprint.
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Portable Bluetooth Headset Power Management
Bluetooth headsets require a small, efficient step-down to power the DSP, codec, and RF front-end from a single Li-ion cell. The TPS62355DRC delivers 1 A continuous output and supports I2C DVS so the SoC can lower VDD during stand-by pairing mode. Per TI's product page for the TPS62355, this device provides 'complete 1-mm component profile solution' while the 88% efficiency at 3 MHz minimizes thermal footprint inside the earpiece enclosure. The exposed thermal pad aids heat extraction. Recommended BOM: 1 uH inductor + 4.7 uF ceramic output.
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Tablet Core Rail and Peripherals
Tablets use the TPS62355DRC to power low-voltage I/O islands, DSP cores, and audio codec subsystems. The wide input range (2.7 V to 6.0 V) covers both Li-ion and 5 V USB direct supply, allowing operation during battery charging. The I2C programmability simplifies power state transitions coordinated by the OS. Best-in-class load and line transient response (per TI datasheet) protects sensitive analog and mixed-signal peripherals from ripple-induced performance loss. The board designer can route the DRC's exposed pad to an inner copper layer for 1 A continuous dissipation without external heatsink.
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USB-Powered Portable Device
The TPS62355DRC supports USB-powered portable devices where 5 V is supplied directly from the VBUS rail. The wide input accommodates the 2.7 V to 6.0 V range, covering both battery and bus power. The small DRC footprint and 1 mm profile allow integration into USB dongles, cameras, and miniature peripherals. The fixed 3 MHz switching frequency avoids interference with USB data rates above 12 MHz by ensuring the switching harmonics fall well away from sensitive bands. Designers should keep the DRC pad's return path short and use 4-layer PCB stackup.
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Low-Power FPGA Core Supply
Low-power FPGAs and CPLDs in industrial control and IoT applications can be powered by the TPS62355DRC for core voltage requirements below 1.0 V. The I2C DVS enables power-aware scaling to throttle the FPGA during low-duty operation, reducing total energy per task. The 88% efficiency at 3 MHz helps meet thermal budgets for fanless industrial designs. The DRC package's exposed pad grounds the high-frequency switching noise, which is critical when adjacent to FPGA's high-speed transceivers. Designers typically add input ferrite beads for conducted EMI compliance.
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IoT Sensor Node and Edge Device
The TPS62355DRC powers IoT sensor nodes, gateways, and edge AI devices that need a low-noise core rail with DVS-driven power saving. Wide input compatibility (2.7 V to 6.0 V) supports energy harvesting and rechargeable Li-Po cells. Per TI's datasheet, the I2C interface allows remote firmware updates to retune VOUT, important for over-the-air field tuning. The 3 MHz switching node minimizes AM-band interference. A typical bill-of-materials uses a shielded 1 uH chip inductor and 0402 ceramic capacitors for sub-15 mm² total footprint.
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추천 제품 요약
엔지니어링 참조 데이터: TPS62355DRC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TPS62355DRCR | TPS62350DRC | TPS62351DRC | TPS62352DRC | TPS62354DRC |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 10-pin VSON/DFN (DRC) | 10-pin VSON/DFN (DRC) - same | 10-pin VSON/DFN (DRC) - same | 10-pin VSON/DFN (DRC) - same | 10-pin VSON/DFN (DRC) - same | 10-pin VSON/DFN (DRC) - same |
| Maximum Output Current | 1 A | 1 A | 800 mA | 800 mA | 800 mA | 1 A |
| Switching Frequency | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz |
| Output Voltage | 0.75 V adj. (I2C-programmable) | 0.75 V adj. (I2C-programmable) | Pin-selectable | Fixed 1.5 V | Fixed 1.2 V | Fixed 1.5 V/1.8 V |
| I2C Interface | Yes | Yes | No | No | No | No |
| Efficiency at 3 MHz | 88% | 88% | 88% | 88% | 88% | 88% |
| Input Voltage Range | 2.7 V to 6.0 V | 2.7 V to 6.0 V | 2.7 V to 6.0 V | 2.7 V to 6.0 V | 2.7 V to 6.0 V | 2.7 V to 6.0 V |
주요 차별점
- I2C dynamic voltage scaling on the same DRC footprint (vs TPS62350DRC)
- 1 A peak vs 0.8 A in legacy variants (vs TPS62350DRC)
- Adjustable output for kernel voltage tuning (vs TPS62351DRC)
설계 노트
Place the 1 uH output inductor within 2-3 mm of the TPS62355DRC's SW/VOUT pin to minimize parasitic loop inductance. Use a ground return path directly under the inductor on the top or second layer. The exposed pad of the DRC package must be soldered to a continuous ground copper area with at least 4 thermal vias (12 mil / 0.3 mm drill) to a full ground plane for thermal sinking at 1 A loads.
Estimated: at VIN = 3.7 V, VOUT = 1.0 V, IOUT = 1 A, efficiency of 88% implies input current ~270 mA and power dissipation inside the part of roughly 0.4 W. The DRC package typically exhibits theta_JA around 50 C/W on a 2-layer 1-oz board, yielding a junction temperature rise of about 20 C above ambient. For sustained 1 A operation in sealed enclosures, verify thermal performance with a prototype measurement.
Do not operate the TPS62355DRC above 6.0 V input or below 2.7 V - the device integrates synchronous MOSFETs rated for these limits. When using I2C, ensure pull-up resistors (typically 4.7 kohm) are present on both SDA and SCL to the same logic rail as the host processor. Avoid long SDA/SCL traces parallel to the inductor; keep I2C lines physically separate from switching nodes to prevent coupled noise false-triggering DVS transitions.
The 3 MHz switching node of the TPS62355DRC can produce harmonics through the 200 MHz range that may affect nearby RF receivers. Place an LC pi-filter on the input and keep the SW-loop copper area as small as possible. A ferrite bead (e.g. 600 ohm at 100 MHz) on the input may be required for conducted EMI compliance in regions with strict FCC or CE limits. Shielded inductors are recommended over open-frame inductors for EMI-sensitive designs.
규정 준수 정보
RoHS compliance and lead-free per TI product page. AEC-Q100 qualification not applicable - this is a commercial-grade portable part, not a -Q1 automotive variant. For automotive applications consult TI's -Q1 catalog separately.
