VSC7389XHO - 16-Port GbE Switch with 8 PHYs | Microchip
부품 번호: VSC7389XHO ✓ 활성VSC7389XHO 개요
An Ethernet switch is a network-semiconductor device that receives Ethernet frames at multiple physical ports, examines frame destination information, and forwards traffic toward the appropriate output port. In the networking hierarchy, this VSC7389XHO belongs to Ethernet switch ICs, interface ICs, and ultimately integrated semiconductors. Its eight integrated PHYs connect copper Ethernet links to the switching fabric, while the remaining switch ports support network-facing connections configured through the broader telecommunications switching system.
The three headline characteristics of the VSC7389XHO are its 16 Gigabit Ethernet ports, eight integrated PHYs, and 596-ball BGA package. Integrating eight PHYs can reduce the number of external physical-layer devices required in a multiport design. The large BGA also provides the pin density needed for a complex switching solution, although its 596 balls and 35 mm by 35 mm outline make PCB layout, assembly, inspection, and thermal management substantially more demanding than those for a small leaded or low-pin-count package.
Because the supplied search results do not expose the complete Microchip datasheet, switching throughput, latency, supported media types, clocking, management interfaces, power specifications, or operating-temperature limits, those values should not be inferred from the distributor category. The 596-ball package should be treated as a land-grid-array device with a dense peripheral fanout. Component classification as a “special purpose” analog switch reflects distributor taxonomy and does not establish that the device is a simple analog multiplexer; the manufacturer description identifies it as a 16-port Gigabit Ethernet switch with eight PHYs.
Typical design uses include industrial Ethernet aggregation, telecommunications access equipment, embedded network infrastructure, and multiport copper-network systems. In such systems, the eight integrated PHYs can serve direct copper links, while a larger switch configuration may use additional external interfaces. Final suitability depends on protocol support, media capability, management features, timing, power, and thermal requirements that are not exposed in the verified distributor snippets.
The primary engineering consideration is the 596-ball BGA assembly. A valid replacement must match the land pattern, ball assignment, electrical performance, firmware expectations, and thermal requirements; merely using the same 35 mm by 35 mm outline is insufficient. Before layout release, engineers should obtain the manufacturer datasheet, pinout, reference design, recommended decoupling network, PCB stack-up, and assembly process information, then validate the complete Ethernet design for signal integrity and thermal performance.
This page consolidates the verified distributor identity, package information, port and PHY counts, sourcing links, comparison parameters, and practical replacement criteria for VSC7389XHO. Because no verified pin-compatible substitutes or numeric price tiers were provided, the record explicitly preserves those uncertainties instead of presenting generic same-category parts as drop-in replacements.
드롭인 대체품: VSC7389XHO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청VSC7389XHO 최대 정격 & 전기적 특성
| Manufacturer | Microchip Technology |
| Product Type | Ethernet switch IC |
| Distributor Category | Telecommunications Switch IC |
| Number of Ports | 16 ports |
| Port Speed | Gigabit Ethernet |
| Integrated PHY Count | 8 PHYs |
| Package Type | 596-ball BGA |
| Package Dimensions | 35 mm x 35 mm |
| 실장 유형 | Surface Mount |
| Interface Classification | Interface IC |
| Device Category | Special Purpose Switch |
VSC7389XHO 35 mm x 35 mm 핀 구성 가이드
VSC7389XHO(35 mm x 35 mm 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: VSC7389XHO.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
VSC7389XHO 적합 용도: 6 애플리케이션s: Industrial Ethernet Aggregation, Telecommunications Access Equipment, Embedded Network Infrastructure, Multiport Copper Network Switch, Network Interface Expansion, Networked Test and Control System.
Industrial Ethernet Aggregation
The VSC7389XHO fits industrial Ethernet aggregation equipment that requires a concentrated 16-port Gigabit Ethernet switching function. Its eight integrated PHYs can support direct copper links while the wider switch architecture consolidates traffic toward uplinks, control equipment, or supervisory networks. The verified 596-ball BGA provides the connection density expected of a complex multiport design, but industrial deployment also requires careful review of operating temperature, isolation, surge protection, and power specifications not shown in the distributor records. PCB designers should preserve the manufacturer-recommended stack-up and high-speed layer transitions because a 35 mm by 35 mm BGA can introduce loss and crosstalk unless the return path and reference-plane strategy are controlled.
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Telecommunications Access Equipment
The VSC7389XHO is applicable to telecommunications access and aggregation systems requiring a 16-port Gigabit Ethernet switch with eight integrated PHYs. Consolidating physical-layer interfaces into the switching device can reduce board-level component count where those interfaces share the required electrical characteristics. The verified distributor classification as a telecommunications switch IC supports this use category, although exact line-rate performance, QoS, management, synchronization, and thermal limits remain unavailable. Before committing to a carrier-grade design, obtain the manufacturer datasheet and validate frame throughput, latency, clocking, jitter, and reset behavior under the expected line-card loading.
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Embedded Network Infrastructure
The VSC7389XHO can support embedded network infrastructure that needs several Gigabit Ethernet links and centralized frame forwarding. Its 16 switch ports provide a higher integration level than a collection of independent interface devices, while the eight integrated PHYs simplify copper connectivity in suitable portions of the design. Because the 596-ball package is mechanically dense, the implementation depends on advanced PCB assembly, X-ray or other package inspection, and a controlled supply-chain plan. Firmware, VLAN, management, and security requirements should be assessed with Microchip documentation rather than inferred from the distributor category, and the complete design should be tested across sustained traffic and worst-case thermal conditions.
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Multiport Copper Network Switch
The VSC7389XHO is suited to a dedicated multiport copper-network switching product built around 16 Gigabit Ethernet ports and eight on-chip PHYs. Integrating eight PHYs can lower chassis component count and simplify board routing when the design does not require all 16 ports to be physical media interfaces. The high-density 596-ball BGA remains the principal implementation constraint because it demands fine-pitch assembly and carefully engineered power delivery. Engineers should verify port-media support, auto-negotiation behavior, cable reach, isolation requirements, and thermal performance before layout. Prototype validation should include link-up behavior, packet-loss measurement, error counters, and stress testing with realistic cable lengths.
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Network Interface Expansion
The VSC7389XHO can expand the Ethernet connectivity of a processor-based or controller-based embedded system where a single controller interface would otherwise limit port count. Its 16-port switching capability can provide multiple links behind one upstream connection, and the eight integrated PHYs allow local copper-facing ports. The design remains dependent on unverified specifications for frame rate, latency, host interface, and software support, so those details must be obtained from Microchip before selecting the device. The BGA footprint also requires a redesign if the existing board uses a smaller package, meaning the VSC7389XHO is primarily appropriate for new high-density boards rather than simple board-level upgrades.
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Networked Test and Control System
The VSC7389XHO may fit centralized test, measurement, or industrial-control systems that need multiple deterministic Ethernet connections rather than isolated point-to-point interfaces. A 16-port Gigabit Ethernet switch can consolidate equipment links, supervisory traffic, and service connections while eight integrated PHYs handle suitable physical links directly. Verification must include throughput, latency, packet-error behavior, and recovery from cable and link faults, none of which can be quantified from the supplied snippets. Because assembly complexity and package thermal load can exceed those of simpler network controllers, evaluate whether the switching density justifies a 596-ball BGA and advanced manufacturing process for the intended volume.
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추천 제품 요약
엔지니어링 참조 데이터: VSC7389XHO — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Manufacturer | Microchip Technology |
| Brand | Microchip Technology |
| Package | 596-ball BGA (35 mm x 35 mm) |
| Device Type | 16-port Gigabit Ethernet switch |
| Integrated PHY Count | 8 PHYs |
| Port Count | 16 Gigabit Ethernet ports |
| Mounting Type | Surface Mount |
| Distributor Classification | Telecommunications Switch IC |
주요 차별점
- High switching and physical-layer integration (vs VSC7395XYV)
- High-density networking in one land-grid-array package (vs Generic Ethernet switch IC)
- Telecommunications-oriented distributor classification (vs General-purpose Ethernet controller)
설계 노트
Treat the 596-ball BGA as a demanding high-speed layout rather than a conventional leaded package. Obtain the manufacturer land pattern, stack-up, ball-map, and escape-routing guidance before PCB schematic release. Use a continuous reference plane beneath the device where the pinout permits, minimize layer transitions for Ethernet pairs, and route each differential pair as a coupled pair with controlled impedance. Confirm connector and magnetics placement from the Microchip reference design so that PHY traces are not unnecessarily lengthened.
The verified records provide no operating-voltage or power-consumption values, so supply rails and regulator sizing must not be estimated from general Ethernet-switch assumptions. Download the current manufacturer datasheet, identify every power ball and voltage tolerance, and design the power-distribution network from the specified decoupling and layout requirements. Use multiple power and ground connections as directed by the package data, and validate steady-state and startup behavior on hardware because integrated eight-PHY designs can create significant switching-related load transients.
A 596-ball package offers substantial electrical connectivity but does not by itself establish adequate thermal performance. After obtaining the manufacturer junction-temperature limits, dissipation estimates, and package thermal data, calculate worst-case dissipation from the actual rail voltages and PHY activity. Ensure the PCB has adequate copper area and thermal-via density, and account for adjacent heat sources. Validate with board-level thermal measurements because airflow, enclosure construction, and multilayer-board construction can materially change junction temperature.
Do not treat VSC7395XYV or another Ethernet switch with a similar category as a drop-in replacement without a verified ball-map comparison. Check the complete 596-ball land pattern, power rails, reset, clocks, PHY differential pairs, management ports, and exposed thermal connections, then compare firmware and software-support requirements. Also avoid relying on distributor category labels as proof of protocol compliance, RoHS status, or exact operating conditions; request the manufacturer documents for the specific ordering code and revision.
규정 준수 정보
The supplied verified distributor snippets do not explicitly state compliance status for the VSC7389XHO. Compliance must be confirmed against current Microchip documentation for the exact ordering code.
