XA7A75T-1FGG484I - Automotive Artix-7 FPGA | AMD
부품 번호: XA7A75T-1FGG484I ✗ 단종XA7A75T-1FGG484I 개요
An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike fixed-function logic, an FPGA allows engineers to configure parallel processing, serial interfaces, memory controllers, and custom digital functions after manufacturing. The Artix-7 family balances programmable logic density with low-power operation and is suitable for industrial, communications, automotive, and embedded-control systems.
The XA7A75T-1FGG484I identifies the A75T Artix-7 device, -1 speed grade, FGG484 package, and industrial temperature designation. Available device information identifies 5,900 configurable logic blocks, 75,520 logic cells, 38,707,200 flip-flops, and 285 I/O pins. Its 484-BBGA construction supports dense board-level integration and high-speed routing between programmable logic and external circuitry.
Artix-7 devices use configurable logic blocks, block RAM, digital signal processing resources, programmable I/O, and dedicated clocking and configuration resources. This architecture supports parallel image processing, sensor fusion, industrial control, vehicle information systems, communications gateways, and embedded instrumentation. Automotive qualification makes the XA7A75T family particularly relevant to systems where component qualification and long-term product consistency are important design constraints.
Typical automotive uses include camera and radar signal processing, vehicle networking, body-electronics control, driver-assistance electronics, and centralized compute nodes. The device can also support industrial automation, communications infrastructure, test equipment, and embedded control applications when its I/O count and logic capacity match the design requirements. A complete design must include the appropriate configuration memory, clocking, decoupling, power sequencing, and signal-integrity implementation.
For PCB implementation, follow AMD’s Artix-7 package pinout files and device guidance when assigning the 484 balls. The BGA footprint requires dense escape routing and careful layer planning, while power and ground distribution must provide low-impedance paths across the device. Configuration pins, speed-grade-dependent timing limits, and automotive qualification requirements should be checked against the manufacturer documentation before release.
This product record combines the manufacturer-family specifications, exact package identification, source pricing links, qualified cross-reference candidates, application guidance, and practical PCB considerations needed to evaluate the XA7A75T-1FGG484I for an automotive FPGA design.
드롭인 대체품: XA7A75T-1FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XA7A75T-1FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Core Supply Voltage, Device Type, Logic Cells, Mounting Type, Automotive Qualification.
XC7A75T-1FGG484I
✅ 드롭인가격 문의
데이터시트 보기 →XC7A75T-1FGG484Q
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XA7A75T-1FGG484Q
✅ 드롭인가격 문의
데이터시트 보기 →XC7A75T-1FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XA7A75T-1FGG484I 최대 정격 & 전기적 특성
| Device Type | Artix-7 FPGA |
| Automotive Qualification | AEC-Q100 |
| Logic Cells | 75,520 |
| Flip-Flops | 38,707,200 |
| Configurable Logic Blocks | 5,900 |
| Programmable I/O | 285 |
| Inputs | 285 |
| Outputs | 285 |
| 패키지 | 484-BBGA |
| Package Dimensions | 23 mm x 23 mm |
| Terminal Count | 484 balls |
| Terminal Form | Ball |
| Package Shape | Square |
| Speed Grade | -1 |
| Temperature Designation | Industrial |
| Core Supply Voltage | 0.95 V to 1.05 V |
| 최대 클록 주파수 | 1,098 MHz |
| 실장 유형 | Surface Mount |
XA7A75T-1FGG484I square 핀 구성 가이드
XA7A75T-1FGG484I(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XA7A75T-1FGG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XA7A75T-1FGG484I 적합 용도: 6 애플리케이션s: Automotive Camera Vision Processing, Vehicle Networking and Gateway Control, Radar and Sensor Fusion Front End, Industrial Automation and Motor Control, Communications and Protocol Conversion, Test, Measurement, and Instrumentation.
Automotive Camera Vision Processing
The XA7A75T-1FGG484I fits automotive image-processing pipelines that require deterministic parallel logic, programmable I/O, and automotive-qualified FPGA selection. Its 75,520 logic cells and 38,707,200 flip-flops can support image pre-processing, pixel classification, color conversion, exposure-control interfaces, and sensor-format adaptation. The 285 programmable I/O pins are particularly useful when connecting camera sensors, serializers, and deserializers. Compared with a software processor implementation, an FPGA can process fixed-format pixel streams concurrently with low predictable latency. The primary trade-off is a substantial BGA layout and the need for high-speed memory routing, so the design must use AMD’s official FGG484 pinout files and carefully budget external memory bandwidth.
추천
Vehicle Networking and Gateway Control
The XA7A75T-1FGG484I is suitable for vehicle gateway and network-control modules that combine several serial links with local protocol conversion or traffic prioritization. Its 285 I/O pins allow parallel sensor and control connections alongside high-speed transceiver interfaces, while 5,900 configurable logic blocks can host protocol logic, buffering, and monitoring functions. The automotive XA designation supports use in vehicle electronic platforms where qualified component sourcing is required. In implementation, engineers should partition high-speed and low-speed routing, provide controlled clocking, and isolate noisy communication lines from sensitive control signals. The -1 speed grade should be checked against every timing-critical interface before schematic and PCB signoff.
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Radar and Sensor Fusion Front End
The XA7A75T-1FGG484I can implement front-end conditioning for automotive radar or multi-sensor systems where parallel data reduction, filtering, and timestamp handling must be deterministic. The A75T fabric provides 75,520 logic cells and 38,707,200 flip-flops for parallel pipelines, while its 285 I/O pins support sensor inputs, synchronization, and test interfaces. An FPGA implementation can place filtering and feature extraction close to the acquisition stage, reducing the amount of raw data sent to a higher-level processor. Designers must still manage memory bandwidth, clock-domain crossings, and thermal conditions in the enclosure. For safety-related functions, system-level qualification and safety mechanisms remain necessary even when the FPGA itself is AEC-Q100 qualified.
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Industrial Automation and Motor Control
The XA7A75T-1FGG484I can serve as a deterministic control and signal-conditioning engine for factory automation, including encoder processing, timing, interlocks, and multi-axis sequencing. Its large programmable logic fabric allows multiple control paths to run concurrently, while 285 I/O pins reduce the need for external glue logic on moderately complex machines. The 484-BBGA package also provides enough physical connectivity for high-speed data and control interfaces. In a motor-control design, place protection and isolation boundaries correctly, route high-current switching nodes away from sensitive logic, and validate timing against the selected -1 grade. The device offers more parallelism than a small microcontroller, but development and thermal verification are correspondingly more involved.
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Communications and Protocol Conversion
The XA7A75T-1FGG484I is suitable for communications equipment that converts among serial formats, performs packet filtering, or bridges incompatible interfaces. The 5,900 configurable logic blocks can support parallel-to-serial conversion, clock-domain isolation, CRC generation, buffering, and protocol state machines, while the 285 I/O pins simplify external connectivity. For high-speed links, implement source-synchronous interfaces on appropriate I/O banks and verify bank-specific voltage and timing constraints. Automotive-qualified systems can use the XA designation, but the FPGA does not replace RF design, line-driver selection, or electromagnetic-compatibility testing. Keeping external memory and high-speed interfaces on controlled routing layers is essential for predictable performance.
추천
Test, Measurement, and Instrumentation
The XA7A75T-1FGG484I can implement high-throughput acquisition, pattern generation, timing analysis, or protocol testing in specialized instrumentation. Its large flip-flop count supports parallel datapaths, and 285 programmable I/O pins provide flexible connections to converters, memories, and test fixtures. The architecture can execute acquisition and processing concurrently, reducing the latency that a sequential processor might introduce. For laboratory equipment, use the available I/O banks within their specified voltage and timing limits, provide terminated clock networks, and isolate analog sections from the BGA device. A multilayer PCB is normally necessary for breakout routing and power distribution. The principal trade-off versus a smaller FPGA is higher board complexity and a larger BGA assembly.
추천
추천 제품 요약
엔지니어링 참조 데이터: XA7A75T-1FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A75T-1FGG484I | XC7A75T-1FGG484Q | XA7A75T-1FGG484Q | XC7A75T-1FGG484C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Device Family | Artix-7 A75T | Artix-7 A75T | Artix-7 A75T | Artix-7 XA A75T | Artix-7 A75T |
| Speed Grade | -1 | -1 | -1 | -1 | -1 |
| Temperature Grade | Industrial | Industrial | Extended | Extended | Commercial |
| Automotive AEC-Q100 Qualification | Qualified | Not qualified as an XA automotive variant | Not qualified as an XA automotive variant | Qualified | Not qualified as an XA automotive variant |
| Logic Cells | 75,520 | 75,520 | 75,520 | 75,520 | 75,520 |
| Flip-Flops | 38,707,200 | 38,707,200 | 38,707,200 | 38,707,200 | 38,707,200 |
| Programmable I/O | 285 | 285 | 285 | 285 | 285 |
주요 차별점
- Automotive qualification distinguishes the target from the same-footprint XC device (vs XC7A75T-1FGG484I)
- Industrial temperature range matches the documented I suffix (vs XC7A75T-1FGG484Q)
- Automotive qualification is retained in the Q-temperature family variant (vs XC7A75T-1FGG484C)
설계 노트
Construct the 484-BBGA footprint directly from AMD’s official Artix-7 package pinout files rather than relying on visual comparison with another FPGA. Assign every ball, including power, ground, configuration, clock, and unused locations, and verify the package drawing against the selected FGG484 device. The package is 23 mm by 23 mm, so escape routing should be planned by layer with uninterrupted reference planes, symmetric power distribution, and controlled-length routes for memory and high-speed interfaces.
Separate core and I/O supply planning because both operate near the 0.95 V to 1.05 V core range while I/O and auxiliary rails may require different voltages. Follow the manufacturer’s recommended decoupling and power-sequence requirements, place bulk and local capacitors close to their assigned power balls, and provide a low-impedance return path beneath every high-speed layer transition. Validate voltage at the device pins under maximum clock activity and worst-case I/O loading rather than relying only on supply-rail measurements.
Use AMD’s pinout files to identify bank membership and check each high-speed interface against the voltage, drive-strength, and timing limits of the selected -1 speed grade. Route clocks as controlled-length networks, provide defined termination for external interfaces, and keep external-memory traces away from switching nodes and noisy power regions. Because the device offers 285 programmable I/O pins, pin swapping should be used deliberately to simplify routing without violating bank and configuration restrictions.
Estimate total FPGA power at the -1 speed grade before finalizing the PCB and enclosure. Estimated: if the assembled device dissipates 4 W and the board-level thermal resistance from the device to ambient is 15 C/W, the estimated temperature rise is 60 C. These values are design inputs rather than a manufacturer maximum. Validate the result through board thermal analysis and chamber measurements, with particular attention to automotive ambient requirements and neighboring heat sources around the 23 mm square BGA.
규정 준수 정보
The XA7A75T-1FGG484I is identified as an automotive AEC-Q100-qualified device. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations were not stated in the cited product records.