XC2C64A-7CP56C - 64-Macrocells, 1.8V CPLD | AMD
부품 번호: XC2C64A-7CP56C ✗ 단종XC2C64A-7CP56C 개요
A complex programmable logic device, or CPLD, is a user-programmable semiconductor within the broader programmable-logic hierarchy. It combines multiple logic macrocells, programmable interconnect, and I/O blocks into a relatively small device. Compared with a field-programmable gate array, the XC2C64A is intended for designs with moderate logic density, simpler timing analysis, and rapid in-system reconfiguration. Its CoolRunner-II architecture combines configurable logic with low-power operation for 1.8 V systems.
The XC2C64A provides 64 macrocells, 45 user I/Os, a 333 MHz internal frequency, and a listed 5 ns propagation delay. Its optimized 1.8 V architecture, as fast as 4.6 ns pin-to-pin logic delays, and as low as 15 µA quiescent current make it useful in compact control, interface, and glue-logic designs. The CSBGA-56 package reduces board area but requires careful ball-layout and assembly planning.
The device uses a 0.18 µm CMOS process and belongs to the CoolRunner-II product family. The 64 macrocells provide substantially more logic capacity than basic switch-mode PAL devices while retaining a comparatively simple programmable architecture. The supplied source data identifies a 333 MHz internal frequency, 45 user I/Os, a 5 ns propagation-delay listing, and the 4.6 ns pin-to-pin performance figure, making this part suitable for deterministic control logic operating from a 1.8 V supply.
Typical applications include industrial control and automation, embedded interface logic, protocol conversion, bus arbitration, power sequencing, and compact communications equipment. It can also implement glue logic around processors, ASICs, or larger programmable devices. In these applications, the 64-macrocells provide enough logic capacity to consolidate small control functions, while the 45 I/Os support mixed digital connections within a space-constrained board area.
The principal design consideration is package and power planning. Because the part uses a 56-ball CSP rather than a leaded package, its footprint must match the exact CSBGA land pattern, and assembly must account for ball pitch, solder mask, paste stencil, and inspection requirements. Designers should also confirm the complete pin assignment and supported I/O standards against DS311 before schematic capture; complete pin names were not included in the supplied verified excerpts.
This page consolidates the supplied manufacturer and distributor information, separates documented specifications from missing data, compares same-family replacement options, and adds practical package-selection guidance. It is intended to complement, not replace, the official XC2C64A CoolRunner-II CPLD data sheet and the device configuration, timing, and package design files required for production implementation.
드롭인 대체품: XC2C64A-7CP56C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC2C64A-7CP56C (동일 폼 팩터 및 풋프린트) — 차이점: Package Type, Quiescent Current, Device Type, Number of Macrocells, Process Technology.
XC2C64A-7CPG56C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC2C64A-7CPG56I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC2C64A-7CP56I
✅ 드롭인가격 문의
데이터시트 보기 →XC2C64A-5CP56C
✅ 드롭인가격 문의
데이터시트 보기 →XC2C64-7CP56C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC2C64A-7CP56C 최대 정격 & 전기적 특성
| Device Type | CoolRunner-II complex programmable logic device |
| Macrocell Count | 64 macrocells |
| Equivalent Logic Capacity | 1.5K gates |
| Internal Frequency | 333 MHz |
| Propagation Delay | 5 ns |
| Pin-to-Pin Logic Delay | 4.6 ns |
| User I/O Count | 45 I/Os |
| Logic Family | CMOS |
| Process Technology | 0.18 µm CMOS |
| Core Supply Voltage | 1.8 V |
| 대기 전류 | 15 µA |
| Package Type | CSP-56, 6 x 6 mm, 0.50 mm pitch |
| 핀 수 | 56 pins |
| 실장 유형 | Chip-scale surface-mount package |
XC2C64A-7CP56C csp-56, 6 x 6 mm, 0.50 mm pitch 핀 구성 가이드
XC2C64A-7CP56C(csp-56, 6 x 6 mm, 0.50 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC2C64A-7CP56C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC2C64A-7CP56C 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Embedded Interface and Glue Logic, Communication Protocol Conversion, Power Sequencing and Control, Test, Measurement, and Instrumentation, Security, Access, and Surveillance Control.
Industrial Control and Automation
The XC2C64A-7CP56C fits compact industrial control logic where a 64-macrocells, 1.8 V programmable device can consolidate sequencing, interlocks, and signal conditioning. Its supplied specifications list 45 user I/Os, a 333 MHz internal frequency, and as fast as 4.6 ns pin-to-pin logic delays, providing useful timing performance for deterministic control paths. The device is placed beside controllers and field interfaces to implement state machines, latch logic, and protocol sequencing without a large FPGA. Because the supplied excerpts do not state the target’s operating-temperature range, an explicitly industrial-grade -CPG56I variant should be considered when environmental limits are decisive.
추천
Embedded Interface and Glue Logic
The XC2C64A-7CP56C is appropriate for interface and glue logic that bridges processors, ASICs, memory, or mixed peripheral devices. Its 64 macrocells and 45 user I/Os offer enough programmable connectivity to implement address decoding, data steering, interrupt handling, and bus arbitration in a compact 6 x 6 mm CSP. The listed 333 MHz internal frequency and 5 ns propagation-delay figure support short critical paths, although external device timing must be included in the system analysis. For a new design, the 56-ball footprint should be checked against assembly capability because its 0.50 mm pitch requires tighter process control than a leaded package.
추천
Communication Protocol Conversion
The XC2C64A-7CP56C can implement protocol conversion and framing logic for compact communications equipment when a moderate amount of deterministic logic is required. The 64 macrocells are suitable for parallel-to-serial formatting, state-machine sequencing, byte assembly, and error-handling branches, while 45 user I/Os provide practical connectivity for parallel data and control signals. Its supplied 4.6 ns pin-to-pin logic-delay figure can help minimize delay inside programmable data paths. System designers should still budget margin for routing, package effects, and external transceiver timing rather than treating the headline delay as the only timing constraint.
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Power Sequencing and Control
The XC2C64A-7CP56C is useful for centralized power sequencing, rail monitoring logic, and load-switch control in space-constrained systems. Its 64 macrocells can encode a multi-rail startup sequence, track enable acknowledgments, generate time delays, and supervise fault signals, while the 45 I/Os provide multiple control and status connections. The 1.8 V core aligns with the part’s stated system-optimization target. The 6 x 6 mm CSP saves board area compared with larger leaded packages, but power sequencing designs must ensure that every controlled rail remains within absolute maximum limits during startup and fault conditions.
추천
Test, Measurement, and Instrumentation
The XC2C64A-7CP56C can support compact instrumentation logic that coordinates test points, status indicators, acquisition sequencing, and data-path switching. A 64-macrocell CPLD provides a practical middle ground between simple logic gates and a high-capacity FPGA, while the listed 5 ns propagation delay and 333 MHz internal frequency suit short control paths. Its 45 user I/Os are useful for multiplexing multiple channels or generating coordinated enables. However, the supplied data does not identify specific supported I/O standards, so instrument designers must verify voltage compatibility, drive capability, and timing from the official DS311 tables before connecting external nodes.
추천
Security, Access, and Surveillance Control
The XC2C64A-7CP56C can implement access-control sequencing, alarm logic, debounce, and peripheral routing in compact security and surveillance equipment. The 64 macrocells are sufficient for coordinating inputs, latching events, driving indicators, and maintaining system state, while 45 I/Os support multiple sensors and actuators. Its compact CSBGA package helps reduce board area in space-constrained installations, and the listed 4.6 ns pin-to-pin delay allows short internal decision paths. Designers must validate external line protections, isolation requirements, and environmental suitability separately because those details are not included in the supplied component excerpts.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC2C64A-7CP56C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC2C64A-7CPG56C | XC2C64A-7CPG56I | XC2C64A-7CP56I | XC2C64A-5CP56C | XC2C64-7CP56C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | CSBGA-56, 6 x 6 mm, 0.50 mm pitch | CSBGA-56 | CSBGA-56 | CSBGA-56 | CSBGA-56 | CSBGA-56 |
| Macrocell Count | 64 macrocells | 64 macrocells | 64 macrocells | 64 macrocells | 64 macrocells | 64 macrocells |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User I/O Count | 45 I/Os | 45 I/Os | 45 I/Os | 45 I/Os | 45 I/Os | 45 I/Os |
| Temperature Ordering Option | Commercial-style CP ordering code; exact range unavailable | Commercial-style ordering code | Industrial-style -I ordering code | Industrial-style -I ordering code | Commercial-style ordering code | Exact temperature grade unavailable |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS |
주요 차별점
- Higher listed internal frequency than the non-A family option (vs XC2C64-7CP56C)
- Faster listed propagation delay than the 7.5 ns cross-reference candidate (vs XC2C64A-7CPG56C)
- Documented 45-user-I/O allocation in the compact CSBGA-56 footprint (vs XC2C64A-5CP56C)
설계 노트
Use the exact 56-ball, 6 x 6 mm, 0.50 mm-pitch CSP land pattern from the official package documentation rather than treating CSBGA-56 as a generic BGA. Confirm ball numbering, pad dimensions, solder-mask apertures, and paste volume against the assembly capability of the selected PCB process. The small ball pitch reduces board area but can increase bridging risk during reflow, so stencil design and assembly validation are as important as the electrical schematic.
Follow the DS311 power-supply, decoupling, and I/O-voltage requirements when assigning the 1.8 V core rail and any permitted auxiliary or I/O supplies. Place local high-frequency bypass capacitance at the appropriate supply balls with short return paths to ground-plane vias. Do not infer additional supply domains or permitted voltage combinations from the 1.8 V designation alone; validate every rail against the official absolute-maximum and operating-condition tables.
Do not treat a same-family ordering code as automatically interchangeable. Verify the target’s suffix, package drawing, temperature grade, speed grade, configuration method, and maximum operating conditions against the replacement MPN. A programmed design may also depend on timing, I/O standards, or device features absent from a distributor summary. Obtain the exact DS311 revision and device files used for the original implementation before approving a substitution.
Timing closure should use the complete path delay from the configuration and implementation results rather than only the advertised 4.6 ns pin-to-pin figure. Include external transceiver, processor, clock, and board-delay contributions in the system budget, and keep sensitive or high-speed routes short where practical. For mixed-signal interfaces, verify supported I/O standards and edge behavior in the official device tables because the supplied excerpts do not provide those specifications.
규정 준수 정보
The supplied excerpts do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred from the manufacturer or package.
