XC3S4000-5FG676C - 4M-Gate Spartan-3 FPGA | AMD Xilinx
부품 번호: XC3S4000-5FG676C ✗ 단종XC3S4000-5FG676C 개요
A field-programmable gate array is a semiconductor whose logic fabric, programmable interconnect, and input/output resources are configured after manufacture. The Spartan-3 FPGA family belongs to the broader FPGA and programmable-logic hierarchy, allowing engineers to implement parallel data processing, control logic, interface bridging, and embedded systems in one reconfigurable device instead of combining multiple fixed-function components.
The XC3S4000-5FG676C combines a 4-million-system-gate device with 489 I/O in a large 676-BGA package. Its 1.2 V core supply is characteristic of a high-density FPGA that separates core and I/O supply requirements. The -5 speed grade, commercial temperature marking, lead-free package designation, and legacy Spartan-3 architecture make the device most relevant to established designs that retain an existing board, bitstream, and software toolchain.
The large I/O count provides substantial connectivity for memory interfaces, high-speed parallel buses, data converters, and external control peripherals. Because the package exposes many balls, power delivery and signal-integrity design are especially important. Designers should follow the manufacturer's decoupling, printed-circuit-board layout, and thermal guidance while confirming that the selected board pattern matches the exact 676-ball package.
Typical uses include industrial automation, communications infrastructure, video and image processing, test equipment, embedded control, and legacy digital signal-processing platforms. The device is appropriate when existing Spartan-3 intellectual property, firmware, and tool-flow compatibility are more valuable than selecting a newer FPGA family.
Before migration, verify timing closure, I/O voltage compatibility, memory-interface behavior, configuration requirements, and thermal performance. A different speed grade or temperature grade may fit the same family, but it is not automatically a drop-in replacement for a production design without engineering review and timing revalidation.
This product page organizes the device identity, package characteristics, drop-in migration options, application guidance, comparison parameters, and design cautions. It also highlights where speed-grade and temperature-grade differences matter, helping engineering teams distinguish a mechanically compatible substitution from a functionally validated replacement.
드롭인 대체품: XC3S4000-5FG676C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC3S4000-5FG676C (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, I/O Count, Package Type, System Gates.
XC3S4000-4FG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S4000-5FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S4000-4FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S4000-5FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S4000-4FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S4000-5FG676C 최대 정격 & 전기적 특성
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 4,000,000 gates |
| I/O Count | 489 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -5 |
| Temperature Grade | Commercial, 0°C to 85°C |
| Package Type | 676-ball BGA |
| Ball Count | 676 balls |
| 실장 유형 | Surface Mount |
| Lead-Free Status | Lead Free |
| RoHS 상태 | unknown |
| REACH Status | unknown |
XC3S4000-5FG676C 676-ball bga 핀 구성 가이드
XC3S4000-5FG676C(676-ball bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC3S4000-5FG676C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC3S4000-5FG676C 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Communications and Network Interface Equipment, Video and Image Processing, Data Acquisition and Test Equipment, Embedded Control Platforms, Signal Processing and Parallel Filtering.
Industrial Automation and Control
The XC3S4000-5FG676C fits centralized industrial controllers that must combine sequencing, motion-command logic, communications, and peripheral control in one programmable device. Its 4,000,000 system gates provide substantial parallel-processing capacity, while 489 I/O leave room for encoders, discrete sensors, actuators, field buses, and operator interfaces. The 1.2 V core supply and -5 speed grade can improve timing margin in established control architectures. For factory equipment, the commercial 0°C to 85°C rating must remain inside the enclosure's measured temperature range; otherwise, select an industrial-temperature alternative and repeat the timing and qualification review.
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Communications and Network Interface Equipment
The XC3S4000-5FG676C is suitable for legacy communications equipment requiring parallel packet processing, buffering, protocol conversion, and multiple external interfaces. Its 489 I/O can accommodate high-speed parallel buses, status signals, memories, and network-physical-layer connections, while the FPGA fabric permits concurrent datapath and control functions. The -5 speed grade offers more timing margin than a -4 migration when existing constraints are tight. Implementation should preserve the established Spartan-3 pin assignments, confirm supported I/O voltage standards, and review clocking and termination with the manufacturer's board-design guidance before release.
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Video and Image Processing
The XC3S4000-5FG676C can support parallel video pipelines, pixel transformation, color processing, frame timing, and control logic because its large programmable fabric accommodates multiple parallel datapaths while 489 I/O provides extensive connectivity to image sensors, memories, and display interfaces. The -5 speed grade is valuable for pixel-clock timing and burst-transfer interfaces where a lower grade could reduce margin. Designers should use the manufacturer's I/O-standard and clocking tables, verify board-level signal integrity, and avoid assuming that generic BGA layout rules replace the device-specific decoupling and power-plane recommendations.
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Data Acquisition and Test Equipment
The XC3S4000-5FG676C fits data-acquisition and automated-test systems that must coordinate converters, memories, triggers, counters, and communication links. The 4,000,000-system-gate capacity permits parallel sampling paths and flexible control sequences, and the 489 I/O count reduces the need for external interface expanders. In instrumentation, the commercial temperature range of 0°C to 85°C should be checked against the calibrated operating environment. Migration to another suffix requires validation of configuration startup, supported I/O voltages, memory timing, and all pin-sensitive resources in the original 676-ball layout.
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Embedded Control Platforms
The XC3S4000-5FG676C is appropriate for legacy embedded-control platforms that combine state-machine control, memory management, serial communications, and specialized datapaths. Its extensive I/O allows the processor subsystem, external memories, and industrial peripherals to remain connected without splitting the design across several devices. A mature Spartan-3 platform also preserves the value of existing intellectual property and bitstream workflows. Engineers should nevertheless confirm tool-version compatibility, configuration memory requirements, and device identification before using a related -4, GGG, or I suffix as a production substitute.
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Signal Processing and Parallel Filtering
The XC3S4000-5FG676C can implement parallel digital filtering, correlation, modulation, error correction, and other fixed or adaptive signal-processing pipelines. Its 4,000,000 system gates provide substantial parallelism, and the -5 speed grade can support demanding clock and I/O timing without relying on a lower-grade part's constraints. The 676-ball package also enables wide memory and data-acquisition connectivity. For production use, evaluate pipeline latency, internal clock resources, memory interface limits, and I/O standards using the manufacturer datasheet, then repeat static timing analysis after any same-family replacement.
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추천 제품 요약
엔지니어링 참조 데이터: XC3S4000-5FG676C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC3S4000-4FG676C | XC3S4000-5FGG676C | XC3S4000-4FGG676C | XC3S4000-5FGG676I | XC3S4000-4FGG676I |
|---|---|---|---|---|---|---|
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Package | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| System Gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates |
| I/O Count | 489 I/O | 489 I/O | 489 I/O | 489 I/O | 489 I/O | 489 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -5 | -4, one speed-grade step slower | -5 | -4, one speed-grade step slower | -5 | -4, one speed-grade step slower |
| Temperature Grade | Commercial, 0°C to 85°C | Commercial, 0°C to 85°C | Commercial, 0°C to 85°C | Commercial, 0°C to 85°C | Industrial, -40°C to 85°C | Industrial, -40°C to 85°C |
주요 차별점
- Higher speed grade than the lower-speed 676-BGA migrations (vs XC3S4000-4FG676C)
- Commercial temperature specification for controlled operating environments (vs XC3S4000-5FGG676I)
- Direct retention of the target's -5 speed designation (vs XC3S4000-4FGG676C)
설계 노트
Use the manufacturer package drawing and device-specific 676-BGA land pattern as the authority for ball locations, ball pitch, solder-mask geometry, and assembly allowances. Route the 489 I/O signals according to their assigned voltage standards, keep sensitive clocks and high-speed interfaces away from noisy power-regulator areas, and maintain the documented power and ground-plane topology. Because this package has hundreds of balls, small routing errors can affect an entire interface or power domain even when the schematic is unchanged.
Confirm the complete 1.2 V core-supply tolerance, I/O supply requirements, sequencing rules, and current limits from the manufacturer datasheet before designing the power tree. Provide local high-frequency decoupling at the device supply balls and isolate the 1.2 V core domain from unrelated loads. Check startup current, configuration behavior, and rail sequencing against the chosen startup sequence. Do not power the BGA package before confirming that all required supplies and grounds are within their permitted conditions.
Evaluate junction temperature from total FPGA dissipation, package thermal characteristics, ambient temperature, PCB copper area, airflow, and neighboring heat sources. The large 676-ball package can distribute power across many balls, but board construction still controls heat removal from the center and lower-temperature regions. Use the manufacturer's recommended board and via patterns, avoid long uninterrupted thermal bottlenecks, and revalidate timing if elevated temperature reduces timing margin. A commercial-grade device should not be deployed outside its 0°C to 85°C rating.
Do not treat a shared Spartan-3 family and matching BGA outline as proof of an automatic drop-in substitution. Confirm the exact package suffix, ball map, speed grade, temperature grade, configuration pins, supported I/O voltages, and device identifiers. For -4 alternatives, rerun static timing analysis and external-interface timing at the intended clock. For GGG and I alternatives, confirm lead finish, package drawing, temperature behavior, and lifecycle constraints before releasing production quantities.
규정 준수 정보
The device listing identifies the XC3S4000-5FG676C package as lead free. RoHS, REACH, halogen-free, and conflict-minerals status were not stated, so they remain unknown. AEC-Q100 does not apply to this commercial FPGA.