XC3S50-5TQG144C - 50K Spartan-3 FPGA | AMD | 144-TQFP
부품 번호: XC3S50-5TQG144C ✗ 단종XC3S50-5TQG144C 개요
A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a semiconductor. The Spartan-3 family combines configurable logic blocks, programmable I/O, embedded block RAM, dedicated multipliers, and clock-management resources, allowing one device to implement control logic, data processing, interfaces, and small embedded systems.
The XC3S50-5TQG144C combines 50,000 system gates with 1,728 logic cells and 97 available I/O in a 144-lead TQFP package. Its 1.2 V core supply reduces core power requirements, while the -5 speed designation corresponds to the 725 MHz maximum figure reported in the supplied product data. The commercial temperature range shown by the verified listings is 0°C to 85°C.
This device is manufactured using 90 nm technology, positioning it as a cost-oriented, low-density FPGA rather than a high-performance FPGA with large on-chip memories. Configuration data programs the logic fabric and I/O standards, allowing hardware revisions and field updates without changing the printed circuit board. Because the package exposes many I/O in a relatively compact surface-mount format, PCB routing and power delivery remain central design constraints.
Typical uses include industrial control, consumer electronics, embedded systems, communications interfaces, instrumentation, and general-purpose digital logic. Its 97 I/O make it particularly useful where external memory, parallel buses, status indicators, sensors, or multiple digital interfaces must connect to programmable logic. The 144-pin package also offers more I/O than a small PLD while remaining manageable for multilayer board assembly.
Designers should verify the exact pinout, configuration interface, supported I/O standards, bank supply voltages, and decoupling requirements against the Spartan-3 manufacturer documentation before layout release. Because this is a legacy programmable-logic platform, toolchain availability, configuration-device compatibility, and long-term procurement should be confirmed during product planning.
This page consolidates the verified distributor specifications, practical design considerations, and carefully qualified same-footprint alternatives for XC3S50-5TQG144C. It also distinguishes documented production options from unavailable or unverified engineering data so engineers can make a defensible sourcing and design decision.
드롭인 대체품: XC3S50-5TQG144C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC3S50-5TQG144C (동일 폼 팩터 및 풋프린트) — 차이점: Core Supply Voltage, Device Type, Logic Cells, Maximum Clock Frequency, Package.
XC3S50-5TQ144C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S50-4TQ144C
✅ 드롭인가격 문의
데이터시트 보기 →XC3S50-4TQG144I
✅ 드롭인가격 문의
데이터시트 보기 →XC3S50A-5TQG144C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S50AN-5TQG144C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S50AN-4TQG144C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S50-5TQG144C 최대 정격 & 전기적 특성
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 50,000 gates |
| Logic Cells | 1,728 cells |
| Logic Blocks | 192 blocks |
| I/O Count | 97 I/O |
| 최대 클록 주파수 | 725 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm |
| 패키지 | 144-pin TQFP |
| Package Code | TQ144 |
| Lead-Free Status | Lead free |
| 동작 온도 | 0°C to 85°C |
| 실장 유형 | Surface mount |
| Terminal Count | 144 terminals |
| Terminal Form | Gull wing |
| Package Shape | Square |
XC3S50-5TQG144C square 핀 구성 가이드
XC3S50-5TQG144C(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC3S50-5TQG144C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC3S50-5TQG144C 적합 용도: 6 애플리케이션s: Industrial Control Logic, Embedded System Interface Hub, Communications Interface Consolidation, Data Acquisition Front End, Consumer Electronics Control, Programmable Test and Measurement.
Industrial Control Logic
The AMD XC3S50-5TQG144C fits industrial control systems that combine parallel digital I/O with programmable sequencing, monitoring, and communication logic. Its verified 97 I/O provide connections for sensors, actuators, status LEDs, counters, and bus transceivers, while 1,728 logic cells provide substantially more implementation capacity than a basic CPLD. The device can be placed between field-level sensors and a higher-level controller, performing debouncing, limit checks, pulse counting, and state-machine sequencing in parallel with the main processor. The 0°C to 85°C listing is relevant to many commercial industrial environments, although extended-temperature requirements must be checked separately. Exact I/O voltage standards and configuration security features should be confirmed from the manufacturer documentation before schematic release.
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Embedded System Interface Hub
XC3S50-5TQG144C is well suited to interface-hub designs that bridge external memories, parallel buses, and processor peripherals. Its 97 I/O can accommodate multiple data, address, control, and interrupt signals, while the programmable fabric can implement protocol state machines, asynchronous data capture, FIFO-like buffering, and timing constraints. The -5 variant is listed at a maximum 725 MHz, giving designers more timing margin than the 630 MHz XC3S50-4TQ144C option when external interfaces operate concurrently. Because this is a legacy 90 nm Spartan-3 FPGA, engineers should validate the exact synthesis tool version, supported configuration memory interface, and pin-level I/O standards for the installed design rather than relying only on family-level compatibility.
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Communications Interface Consolidation
The XC3S50-5TQG144C can consolidate several low-speed communications interfaces in a compact programmable-logic device. Its 97 I/O permit parallel data buses to connect with level-shifting or transceiver components, while the configurable fabric can implement UART, SPI, protocol conversion, command parsing, and buffer-management logic. The 1.2 V core supply is compatible with modern low-voltage digital design practice when suitable I/O-bank supplies are provided. For industrial networking, a transceiver such as the SN65HVD06D can handle the physical layer while the FPGA handles framing and control. Timing closure must be based on actual board-level trace lengths, transceiver delays, and the selected clocking architecture rather than solely on the verified 725 MHz maximum frequency.
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Data Acquisition Front End
XC3S50-5TQG144C can implement the digital control and acquisition layer for instrumentation, test equipment, and sensor-interface boards. The programmable fabric can coordinate sampling sequences, perform parallel-to-serial conversion, generate control strobes, timestamp events, and transfer captured data to a processor or communications PHY. Its 50,000 system gates and 1,728 logic cells are sufficient for moderate control pipelines, while 97 I/O provide practical connectivity to converters, memories, and status logic. Signal-integrity engineering remains essential because the supplied snippets do not establish differential I/O capabilities, input thresholds, output slew rates, or exact package pin assignments. Those parameters must be checked against the Spartan-3 datasheet before selecting termination, level shifting, and routing schemes.
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Consumer Electronics Control
The XC3S50-5TQG144C is applicable to cost-sensitive consumer products that require flexible control logic without a large system-on-chip. It can implement button matrices, LED sequencing, display timing, motor-step coordination, sensor fusion logic, and programmable I/O behavior. The 144-pin TQFP package offers 97 I/O while remaining compatible with conventional surface-mount assembly, and the 1.2 V core supply helps simplify power architecture. However, legacy-product designers must confirm whether the target product's production volume and longevity justify maintaining a Spartan-3 design. Configuration storage, programming interfaces, software support, and end-of-life procurement should be evaluated alongside the technical fit. A newer FPGA family may be preferable for a newly launched product even when the XC3S50 footprint could support a short-term migration.
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Programmable Test and Measurement
XC3S50-5TQG144C can serve as a pattern generator, sequencer, or timing controller in compact test and measurement equipment. Its 97 I/O allow it to drive multiple digital channels, capture responses, implement programmable delays, and coordinate peripheral stimulus. The 1,728-cell Spartan-3 fabric permits parallel test channels and state-machine-based sequencing, while the -5 grade's verified 725 MHz maximum offers better timing margin than the -4 grade's 630 MHz alternative. Engineers should still evaluate output jitter, I/O drive strength, input bandwidth, and clock accuracy, because those details were not present in the supplied distributor snippets. A dedicated clock generator and level-translation devices can support the FPGA when the selected board architecture requires deterministic timing or non-1.2-V peripheral interfaces.
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추천 제품 요약
엔지니어링 참조 데이터: XC3S50-5TQG144C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC3S50-5TQ144C | XC3S50-4TQ144C | XC3S50A-5TQG144C | XC3S50AN-5TQG144C |
|---|---|---|---|---|---|
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Package | TQFP-144 | TQFP-144 - same package format | TQFP-144 - same package format | 144-LQFP - same package format | 144-LQFP - same package format |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3A | Spartan-3AN |
| Logic Cells | 1,728 cells | 1,728 cells | 1,728 cells | 1,584 cells | 1,584 cells |
주요 차별점
- Higher verified speed grade (vs XC3S50-4TQ144C)
- Closer original-family identity (vs XC3S50A-5TQG144C)
- Original architecture with -5 grade (vs XC3S50AN-5TQG144C)
- Documented commercial-temperature listing (vs XC3S50-4TQG144I)
설계 노트
The verified core supply for XC3S50-5TQG144C is 1.2 V, but I/O-bank voltage and current limits were not included in the supplied data. Before layout, separate the core and I/O supplies according to the manufacturer pin table, place required bypass capacitance at the corresponding package pins, and provide a power source with adequate transient response. Estimated power cannot be calculated responsibly because the selected I/O state, switching activity, auxiliary voltage, and device-specific current tables were not supplied; use the manufacturer worst-case and typical current tables instead.
The 144-pin TQFP footprint requires a TQFP-144 land pattern with 0.5 mm pitch, but exact pad dimensions and courtyard values were not provided and must be taken from the AMD package drawing. Confirm pin-1 orientation and lead numbering against the mechanical drawing before releasing Gerber files. Route the configuration signals, clock inputs, and sensitive interfaces away from switching-node copper, and provide continuous ground-plane return paths to reduce crosstalk and supply-noise coupling.
Do not treat a matching TQFP-144 order code as proof of a drop-in replacement. Spartan-3, Spartan-3A, and Spartan-3AN devices use different architectures and tool/bitstream flows, and the I suffix may indicate a different temperature grade. Validate the exact orderable MPN, complete pinout, configuration interface, supported I/O standards, clocking resources, and timing against the manufacturer documentation. Also confirm that the legacy synthesis tool and programming hardware remain supported for the product's maintenance life.
Use a deliberate clocking plan rather than routing critical signals directly from general-purpose fabric pins. Any PLL or clock-management-resource use must be checked against the exact XC3S50 device resources and the selected speed grade. Keep the configuration interface away from high-current outputs, provide a stable configuration source, and review unused pins according to the manufacturer's termination recommendations. Because a complete pin map was unavailable in the supplied snippets, no pin-specific output-disable or biasing instruction should be assumed.
규정 준수 정보
The supplied search result describes the package as lead free. RoHS, REACH, halogen-free, and conflict-minerals evidence was not provided, so those fields remain unknown. AEC-Q100 status was not documented and is recorded as not applicable rather than inferred.
