XC5VLX30-2FF676I - 30,720-Cell Virtex-5 LX FPGA | AMD
부품 번호: XC5VLX30-2FF676I ✓ 활성XC5VLX30-2FF676I 개요
A field-programmable gate array is a programmable digital integrated circuit whose interconnect and logic resources are configured after manufacture. An FPGA belongs to the broader hierarchy of programmable logic devices, semiconductor integrated circuits, and digital electronics. Unlike a fixed-function application-specific integrated circuit, a Virtex-5 LX FPGA can implement parallel processing, control, protocol, and interface logic in one device, allowing hardware behavior to be revised without changing the printed circuit board.
The XC5VLX30 provides 2,400 logic blocks according to the device overview, together with 30,720 logic cells for constructing datapaths, state machines, controllers, and arithmetic pipelines. Its 1,179,648 bits of block RAM allow substantial data buffering and dual-port storage without external memories. The 400 user I/O provide high connectivity for parallel buses, clocking, control signals, and high-speed interfaces. The 676-ball FCBGA measures 27 mm by 27 mm and supports dense PCB routing required by large Virtex-5 designs.
The -2 designation identifies the device performance grade within the Virtex-5 LX family, while I identifies the industrial temperature option. Device configuration and bitstream loading are central to using an FPGA because the interconnect, logic resources, block RAM, and I/O behavior are established through programmable configuration data. In multi-rail systems, power sequencing, configuration access, and ancillary voltage rails must be coordinated with the device's system power-management design.
Typical uses include telecommunications line-card control, industrial automation, high-throughput signal processing, network-interface data planes, instrumentation, and ASIC prototyping. The large I/O count is particularly useful when a design combines multiple bus widths, memory interfaces, clock domains, and high-speed serial links. The device can consolidate programmable control and datapath functions that might otherwise occupy several fixed-function devices, although implementation complexity and FPGA resource planning remain important considerations.
PCB design requires careful treatment of the FCBGA escape routing, power delivery, decoupling, and thermal path. Keep core and auxiliary supply planes stable across the device, place decoupling structures near the relevant balls, and follow the manufacturer's package and pinout documentation when assigning power, ground, configuration, clock, and differential pairs. Validate signal integrity and power integrity with the complete configuration and system load before production release.
This product record combines the identified device architecture, package, logic and memory resources, temperature range, alternative-device analysis, and implementation guidance. It supports direct comparison of the industrial -2 grade with compatible same-family Virtex-5 LX variants while preserving the requirement that a proposed replacement use the same 676-ball footprint and remain suitable for the intended temperature and performance requirements.
드롭인 대체품: XC5VLX30-2FF676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
XC5VLX30-1FF676I
✅ 드롭인가격 문의
데이터시트 보기 →XC5VLX30-3FF676I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC5VLX30-2FF676C
✅ 드롭인가격 문의
데이터시트 보기 →XC5VLX30-2FFG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC5VLX30-2FFG676C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC5VLX30-2FF676I 최대 정격 & 전기적 특성
| Device Type | Virtex-5 LX field-programmable gate array |
| Logic Cells | 30,720 cells |
| Logic Blocks | 2,400 blocks |
| User I/O | 400 I/O |
| Block RAM | 1,179,648 bits |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Performance Grade | -2 speed grade |
| Temperature Grade | Industrial |
| Junction Temperature Range | -40°C to 100°C |
| 패키지 | 676-ball FCBGA |
| Package Dimensions | 27 mm × 27 mm |
| Terminal Count | 676 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| Package Family | FCBGA |
| AEC-Q100 Qualification | not_applicable |
XC5VLX30-2FF676I fcbga 핀 구성 가이드
XC5VLX30-2FF676I(fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC5VLX30-2FF676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC5VLX30-2FF676I 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Telecommunications Line-Card Control, High-Throughput Signal Processing, Network Interface Data Plane, ASIC Prototyping and Test Instrumentation, Aerospace and Defense Test Equipment.
Industrial Automation and Control
The XC5VLX30-2FF676I fits industrial automation controllers that combine machine logic, diagnostics, communications, and safety-related monitoring in one programmable platform. Its 30,720 logic cells and 2,400 logic blocks provide substantial parallel processing capacity, while 400 user I/O support encoder inputs, discrete sensors, actuator outputs, and multiple industrial buses. The -40°C to 100°C junction range supports equipment operating outside consumer-temperature environments. Use the -2 grade when timing closure depends on its performance characteristics and implement redundant power and communication paths where system availability requirements demand them.
추천
Telecommunications Line-Card Control
The XC5VLX30-2FF676I is suitable for telecommunications line-card control, traffic management, and packet-processing assistance where parallel datapaths and broad I/O connectivity are valuable. Its 1,179,648 RAM bits provide local buffering for traffic queues and protocol state, while 30,720 logic cells support control-plane parsing, scheduling, and statistics functions. The industrial temperature designation supports deployment in managed network equipment. Engineers should partition clock domains carefully, budget block RAM for simultaneous traffic profiles, and validate timing against the worst-case -40°C to 100°C junction range.
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High-Throughput Signal Processing
The XC5VLX30-2FF676I can implement parallel filters, correlation, modulation, spectral analysis, and fixed-point arithmetic pipelines because its 30,720 logic cells and 2,400 logic blocks provide a large parallel fabric. The 1,179,648 bits of RAM support sample buffers, coefficient storage, and dual-port data paths, reducing pressure on external memory in suitable architectures. Its 400 user I/O allow multiple converters and clock domains to be connected directly. Confirm converter interface timing, required sample rates, DSP resource allocation, and power consumption before assigning the FPGA to a signal-processing chain.
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Network Interface Data Plane
The XC5VLX30-2FF676I suits network-interface and protocol-bridging designs that need flexible packet classification, queue management, header processing, and hardware-assisted control. Its high I/O count enables simultaneous access to multiple buses and reduces the need for external glue logic, while block RAM supports flow-control tables and packet buffering. The device can accommodate evolving protocol revisions through configuration updates, although every released bitstream must undergo regression and timing verification. Engineers should use the complete pinout and package documentation when assigning clock-capable, serial, and fixed I/O resources.
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ASIC Prototyping and Test Instrumentation
The XC5VLX30-2FF676I is useful for ASIC prototyping, hardware-in-the-loop testing, and programmable instrumentation because its logic, RAM, and I/O resources can emulate multiple fixed functions in one device. Designers can implement control algorithms, interfaces, data acquisition pipelines, and diagnostic logic while retaining the ability to modify the design through bitstream updates. The -2 grade supports timing-oriented laboratory and industrial prototypes, but the 676-ball FCBGA demands careful escape routing and power planning. Prototype boards should preserve access to configuration, clocks, JTAG, and representative system interfaces for debugging.
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Aerospace and Defense Test Equipment
The XC5VLX30-2FF676I can support programmable acquisition, simulation, and analysis equipment for aerospace and defense systems when the deployment environment falls within its industrial junction range. Its 400 user I/O and large RAM complement enable multi-channel test orchestration, while programmable logic permits field updates to test sequences and signal-processing algorithms. The package itself is not identified as AEC-Q100 qualified, so it must not be selected solely on the basis of that automotive-style qualification expectation. Actual environmental suitability should be established through system-level thermal, vibration, radiation, and reliability requirements.
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추천 제품 요약
엔지니어링 참조 데이터: XC5VLX30-2FF676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC5VLX30-1FF676I | XC5VLX30-3FF676I | XC5VLX30-2FF676C | XC5VLX30-2FFG676I | XC5VLX30-2FFG676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FCBGA | 676-ball FCBGA - same | 676-ball FCBGA - same | 676-ball FCBGA - same | 676-ball FCBGA - same | 676-ball FCBGA - same |
| Device Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Logic Cells | 30,720 cells | 30,720 cells | 30,720 cells | 30,720 cells | 30,720 cells | 30,720 cells |
| User I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O |
| Block RAM | 1,179,648 bits | 1,179,648 bits | 1,179,648 bits | 1,179,648 bits | 1,179,648 bits | 1,179,648 bits |
| Core Supply Voltage | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V |
| Performance Grade | -2 | -1 | -3 | -2 - same | -2 - same | -2 - same |
| Temperature Grade | Industrial, -40°C to 100°C junction | Industrial, -40°C to 100°C junction | Industrial, -40°C to 100°C junction | Commercial | Industrial, -40°C to 100°C junction | Commercial |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
주요 차별점
- Maintains the -2 performance grade while offering lower-speed and higher-speed family options (vs XC5VLX30-1FF676I)
- Industrial-temperature operation instead of commercial qualification (vs XC5VLX30-2FF676C)
- Industrial -2 device with an alternative 676-ball ordering code (vs XC5VLX30-2FFG676I)
설계 노트
Treat the 676-ball FCBGA as a high-pin-count routing problem. Assign power and ground balls directly from the AMD package pinout, preserve the recommended ball and via assignments, and route clocks and high-speed differential pairs with continuous reference planes and minimized stubs. Escape-routing density must be validated against the selected board stack-up because changing layer count or microvia construction can materially affect return-path continuity and assembly yield.
Use a controlled multi-rail supply arrangement for the 0.95 V to 1.05 V core and the applicable auxiliary and I/O rails. Place local bulk and high-frequency decoupling according to the manufacturer's power-distribution guidance, and keep sensitive power routes short and wide. Estimated: core power equals 1.00 V multiplied by measured core current; calculate margin from that measured maximum plus transient current rather than using average activity alone.
Provide a continuous thermal path through the package balls and PCB copper, and avoid thermal discontinuities beneath the FCBGA. Estimated: junction-temperature rise depends on total device dissipation multiplied by the effective board-and-ambient thermal resistance. Validate the assembly with the highest expected configuration activity, I/O load, and ambient temperature because a logic-heavy design can consume materially more power than a lightly loaded benchmark.
Do not assume that same-package suffix variants are unconditional replacements. Speed-grade changes can alter timing margin, while the C suffix changes environmental qualification. Before substituting a device, compare the complete ordering code, configuration memory behavior, auxiliary supplies, pinout, and bitstream compatibility, then rerun static timing and environmental validation. Also distinguish a 676-ball package from smaller FF323 or FF324 packages, which are not board-compatible.
규정 준수 정보
The device is an industrial-temperature FPGA and is not identified as AEC-Q100 qualified. Exact RoHS, REACH, lead-free, halogen-free, and conflict-minerals status requires confirmation for the specific AMD ordering code and manufacturing lot.