XC6SLX100-2FGG676C - 101K LEs Spartan-6 LX FPGA | AMD Xilinx
부품 번호: XC6SLX100-2FGG676C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $58.29 | $58.29 |
| 10 | $54.5 | $545.00 |
| 100 | $49.95 | $4,995.00 |
| 500 | $45.2 | $22,600.00 |
| 1,000 | $41.8 | $41,800.00 |
XC6SLX100-2FGG676C 개요
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured by the designer after PCB assembly. The Spartan-6 LX position in the broader hierarchy is: programmable logic -> FPGA -> low-power FPGA family. Compared with ASICs, FPGAs trade raw unit cost for design flexibility, in-system reprogrammability, and rapid prototyping, and they sit in the same tier as CPLDs and complex PLDs for glue-logic and parallel DSP workloads.
Key features include 3.8 Mb of block RAM, 180 DSP48A1 slices, integrated Memory Controller Blocks (MCBs), and up to 108 Mb of embedded memory. The device supports common interfaces such as DDR, DDR2, DDR3, LVDS, LVCMOS, and PCI Express endpoint via the integrated GTP transceiver infrastructure in compatible LXT variants. The XC6SLX100 offers a balanced cost/performance ratio ideal for high-volume, cost-sensitive designs requiring substantial logic density.
The LX architecture uses a 6-input LUT fabric with dedicated carry logic, distributed RAM and shift-register resources, and a multi-clock tiles structure. The internal core can run up to approximately 667 MHz depending on speed grade, and high-speed SelectIO technology provides flexible I/O support for single-ended and differential standards at data rates into the hundreds of Mbps range.
Typical applications include industrial motor control, LED video walls and digital signage, surveillance IP cameras, automotive driver assistance (non-safety-critical domains), consumer video processing, and small-cell baseband processing. The Spartan-6 LX family is widely used as a bridge between CPLD and higher-density Virtex-class FPGAs.
When designing with this device, plan for a 1.2 V core rail and a 2.5 V/3.3 V auxiliary supply, with I/O voltages per bank. Use Xilinx ISE Design Suite (or Vivado with legacy project import) for bitstream generation; the FBGA-676 footprint demands careful PCB stack-up and via-in-pad escape routing.
This page synthesizes distributor pricing, drop-in alternatives within the Spartan-6 and competing Cyclone IV families, and practical PCB design guidance not found in a single source datasheet.
드롭인 대체품: XC6SLX100-2FGG676C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX100-3FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-2FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-3FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-L1FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-1FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75-3FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-2FGG676C 최대 정격 & 전기적 특성
| Family | Spartan-6 LX |
| Logic Cells | 101,261 |
| System Gates | 4,939,776 |
| Slices | 15,822 |
| Block RAM | 3.8 Mb (4824 Kbits) |
| DSP Slices | 180 DSP48A1 |
| Maximum User I/O | 480 |
| Maximum I/O Banks | 6 |
| Speed Grade | -2 |
| Temperature Grade | Commercial (0 C to +85 C) |
| 패키지 | FBGA-676 (FGG676) 27x27 mm |
| Ball Pitch | 0.8 mm |
| Core Voltage | 1.2 V |
| Process Technology | 45 nm CMOS |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
XC6SLX100-2FGG676C fbga-676 (fgg676) 27x27 mm 핀 구성 가이드
XC6SLX100-2FGG676C(fbga-676 (fgg676) 27x27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX100-2FGG676C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX100-2FGG676C 적합 용도: 6 애플리케이션s: Industrial Motor Control, LED Video Wall Processing, Surveillance IP Camera Image Processing, Automotive Infotainment Head Units, Small-Cell Baseband Processing, Consumer Multi-Function Printer Imaging.
Industrial Motor Control
The XC6SLX100-2FGG676C fits industrial motor control by delivering 180 DSP48A1 slices capable of 18x18 signed MAC operations at up to 250 MHz, which is sufficient for field-oriented control of three-phase AC induction and PMSM motors in real time. The 3.8 Mb block RAM keeps multiple PID state variables and observer estimators on-chip without external memory wait states, lowering closed-loop latency to microseconds. Its 480 SelectIO pins handle parallel ADC sampling from current shunts and resolvers, plus industrial bus bridging to EtherCAT or RS-485 transceivers. The commercial temperature grade suits factory-floor enclosures, and the LX100's logic density leaves headroom for safety extensions and adaptive filter upgrades.
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LED Video Wall Processing
The XC6SLX100-2FGG676C is well-matched to LED video wall controllers and scaling engines. The 480 SelectIO pins drive parallel RGB or Gigabit-Ethernet serial links to hub boards, while the 3.8 Mb block RAM buffers full video lines for color mapping and gamma correction. Its 180 DSP48A1 slices handle real-time brightness calibration, pixel-by-pixel color-space conversion (RGB to YCbCr), and per-panel brightness interpolation. Built-in SelectIO LVDS enables 24-bit video input with deterministic latency under 30 microseconds, well below scan-line budgets for 1080P content. The LX100's 101K logic cells also let a single chip drive multiple sub-panels, reducing system BOM and lowering per-pixel controller cost.
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Surveillance IP Camera Image Processing
For surveillance IP cameras, the XC6SLX100-2FGG676C offers the DSP throughput to perform 1080P H.264 encoding at 30 fps alongside local motion detection and privacy masking. The 3.8 Mb block RAM absorbs frame-buffer jitter and supports on-chip deinterlacing without DDR latency overhead. The 480 SelectIO pins accommodate parallel image sensor interfaces (HiSPi, subLVDS) plus Ethernet MAC and storage interfaces. Integrated PowerPC hard cores in some Spartan-6 variants allow Linux run-time alongside FPGA fabric acceleration. The LX100's wide temperature tolerance in industrial variants makes this FPGA also suited to outdoor IP camera enclosures in extreme climates.
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Automotive Infotainment Head Units
The XC6SLX100-2FGG676C and its industrial-temperature sibling (XC6SLX100-2FGG676I) suit automotive infotainment head units that need to drive dual WVGA displays while decoding audio streams. The 180 DSP48A1 slices accelerate audio DSP for hands-free echo cancellation and parametric equalization. The 480 SelectIO pins accept camera input for rear-view assist and parallel RGB to dual TFT panels with independent gamma tables. Block RAM holds graphic frame buffers and audio resampling tables. Designers pair it with automotive-grade regulators and CAN transceivers like TJA1057 to build cost-sensitive IVI systems that need moderate DSP and flexible I/O.
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Small-Cell Baseband Processing
In small-cell and picocell baseband processing, the XC6SLX100-2FGG676C provides enough logic and DSP for LTE PHY-layer implementation across 20 MHz channels. Its 180 DSP48A1 slices run FFT/iFFT and channel estimation while the 3.8 Mb block RAM stores timing and constellation look-up tables. SelectIO interfaces connect directly to radio front-end ADCs and DACs at sample rates into 200 Msps. With 101K logic cells, the LX100 has the headroom to integrate both PHY and a thin MAC layer, eliminating an extra DSP in cost-sensitive residential femtocell designs.
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Consumer Multi-Function Printer Imaging
The XC6SLX100-2FGG676C powers multifunction printer imaging pipelines, replacing dedicated ASICs that limit feature differentiation. Its DSP48A1 slices accelerate JPEG2000 compression and color-space conversion, while block RAM stages rasterized print bands up to 300 dpi at 50 ppm. The 480 SelectIO pins accept parallel scanner CCD outputs and drive laser diode drivers and stepper-motor controls for paper transport. Designers use the LX100's logic density to implement customized halftone screens that distinguish OEM products without resorting to high-NRE ASIC runs, giving mid-range printers competitive image quality at low cost.
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추천 제품 요약
엔지니어링 참조 데이터: XC6SLX100-2FGG676C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX100-3FGG676C | XC6SLX100-2FGG676I | XC6SLX100-3FGG676I | XC6SLX100-L1FGG676C | XC6SLX75-3FGG676C |
|---|---|---|---|---|---|---|
| Package | FBGA-676 (FGG676) 27x27 mm | FBGA-676 (FGG676) 27x27 mm | FBGA-676 (FGG676) 27x27 mm | FBGA-676 (FGG676) 27x27 mm | FBGA-676 (FGG676) 27x27 mm | FBGA-676 (FGG676) 27x27 mm |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 101,261 | 101,261 | 101,261 | 101,261 | 93,096 | |
| Speed Grade | -2 | -3 | -2 | -1L | ||
| Temperature Grade | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | ||
| Block RAM | 3.8 Mb | 3.8 Mb | 3.8 Mb | 3.0 Mb | ||
| DSP48A1 Slices | 180 | 180 | 180 | 150 | ||
| Maximum User I/O | 480 | 480 | 480 | 420 |
주요 차별점
- Largest-density Spartan-6 LX with access to nearly full 480 I/O (vs XC6SLX75-3FGG676C)
- Mid-tier speed grade balances Fmax and cost (vs XC6SLX100-3FGG676C)
- Commercial temperature range suited to indoor consumer and industrial (vs XC6SLX100-2FGG676I)
설계 노트
The FBGA-676 footprint at 0.8 mm pitch requires 0.4 mm drilled micro-vias on a high-density interconnect PCB stack-up. Use via-in-pad with epoxy-filled and capped plating to ensure reliable BGAs in production. Per AMD's packaging specification, the FGG676 land pad diameter is 0.4 mm with non-solder-mask-defined (NSMD) pads preferred for stronger solder joints. Plan for at least 4 PCB layers with one continuous ground plane below the BGA to provide low-impedance return paths for the 480 SelectIO signals switching simultaneously.
Estimated: At full resource utilization (101K logic cells toggling at 250 MHz at 100% toggle rate through internal logic), the XC6SLX100 draws approximately 1.0 to 1.5 A from the 1.2 V Vccint rail and additional current from 2.5 V Vccaux and per-bank Vcco. Designers should budget 2.5 A peak on Vccint with a 100 nF decoupling cap within 5 mm of every active supply pin. Sequence Vccint before Vccaux per datasheet requirements to avoid long-term reliability degradation of the configuration memory.
When routing LVDS pairs from the LX100 SelectIO, match differential pair impedance to 100 ohms with length matching to within 100 mils for speeds up to 1 Gbps. Separate high-speed LVDS from low-speed configuration pins by at least 3H (3 dielectric thicknesses) to avoid crosstalk. The FGG676 BGA periphery assignment supports a maximum of 232 LVDS pairs when configured for LVDS25 IOSTANDARD. Use IBIS simulation before layout commitment to validate the chosen termination scheme.
Do not omit the MODE pins and persistent configuration setting when migrating between -2 and -3 speed grades; bitstream timing constraints differ. Spartan-6 FPGA configuration requires a valid PROG_B sequence at power-up and a clean CCLK signal. A common mistake is loading a -2 bitstream onto a -3 device or vice versa without re-running Xilinx ISE timing analysis. Also verify that the FT2232H JTAG programmer has a 4-wire connection directly to TDI/TDO/TCK/TMS without level shifters if Vcco of bank 0 is not 2.5 V.
Estimated: Junction-to-ambient thermal resistance of the FGG676 package with a typical 4-layer PCB and no heatsink is approximately 18 C/W. At 1.5 W dissipation (typical mid-utilization use), this yields a 27 C temperature rise above ambient. The commercial grade LX100 is rated to 85 C ambient, providing ample margin in most consumer and industrial enclosures. For sealed enclosures with limited airflow, choose the industrial-grade LX100 I-variant and add 5 C of design margin to the thermal budget.
규정 준수 정보
RoHS compliant per AMD Xilinx Spartan-6 product family documentation. Lead-free FGG676 package. AEC-Q100 is not applicable as Spartan-6 does not carry automotive qualification; for AEC-Q100 capable FPGA work, consider Xilinx XA Zynq-7000 or newer XA7Z020 (in Site MPN list).
