XC6SLX25-2CSG324C - 24,051-Cell Spartan-6 LX FPGA | AMD
부품 번호: XC6SLX25-2CSG324C ✓ 활성XC6SLX25-2CSG324C 개요
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor whose logic, memory, and I/O resources can be programmed after manufacture. Within the device hierarchy, an FPGA belongs to programmable logic rather than fixed-function logic or microcontrollers. The Spartan-6 LX family combines configurable logic, block RAM, digital clock managers, programmable I/O, and embedded MicroBlaze processor resources for systems requiring flexible hardware functions and efficient product customization.
The XC6SLX25 provides 1,879 configurable logic blocks, 24,051 logic cells, and 958,464 bits of block RAM according to the manufacturer device documentation. Its 226 user I/O support high-volume parallel interfaces, while integrated digital clock management and differential clock resources simplify clocking and high-speed interface designs. The -2 speed grade provides a 667 MHz maximum figure identified in the device documentation.
The 45 nm CMOS implementation is designed to balance programmable functionality, performance, and power in cost-sensitive embedded systems. This device combines considerably more logic and memory than a basic programmable logic device while retaining a high I/O count for control, data acquisition, communications, and signal-processing designs. The industrial design also supports the MicroBlaze soft-processor architecture where a programmable control core is useful.
Typical applications include industrial automation controllers, data-acquisition systems, embedded communications equipment, video and image-processing pipelines, instrument control, and low-power embedded processors. The 226-I/O count is especially useful when a board must connect multiple sensors, converters, memories, communications transceivers, and display or control peripherals without using a larger package.
PCB implementation requires careful attention to the CSPBGA escape routing and the manufacturer’s package pinout file. Confirm power sequencing, decoupling, clock, configuration, and I/O standards against the device datasheet. Review bitstream compatibility, temperature requirements, and any board-level interface changes before releasing a production design.
This page organizes the device’s core specifications, application guidance, package considerations, and same-footprint Spartan-6 options. It also highlights the parameters engineers should compare when determining whether another -grade or temperature-grade member can replace the XC6SLX25-2CSG324C without redesigning the PCB.
드롭인 대체품: XC6SLX25-2CSG324C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX25-2CSG324C (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Cells, RoHS Status, Clock Management.
XC6SLX25-2CSG324I
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XC6SLX25T-2CSG324C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX25-1CSG324C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX25-3CSG324C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XC6SLX25T-1CSG324C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX25-2CSG324C 최대 정격 & 전기적 특성
| Device Type | Spartan-6 LX FPGA |
| Logic Cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs |
| Block RAM | 958,464 bits |
| User I/O | 226 I/O |
| 최대 클록 주파수 | 667 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Performance Grade | -2 |
| 패키지 | 324-ball CSPBGA |
| Package Dimensions | 15 mm x 15 mm |
| Ball Pitch | 0.8 mm |
| 실장 유형 | Surface mount |
| Embedded Soft Processor | MicroBlaze |
| Lead-Free Status | Lead free |
| RoHS 상태 | RoHS compliant |
XC6SLX25-2CSG324C 15 mm x 15 mm 핀 구성 가이드
XC6SLX25-2CSG324C(15 mm x 15 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX25-2CSG324C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX25-2CSG324C 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Parallel Data Acquisition, Embedded Communications Equipment, Video and Image Processing, Instrument Control and Measurement, MicroBlaze Embedded Processing.
Industrial Automation and Control
The XC6SLX25-2CSG324C fits industrial control systems requiring deterministic parallel I/O, programmable logic, and local control processing. Its 226 user I/O can connect encoders, discrete sensors, actuator drivers, and communication transceivers, while 24,051 logic cells support state machines, interlocks, motion sequencing, and diagnostics. The 958,464 bits of block RAM provide on-chip buffering for repetitive control tasks. The -2 grade offers a documented 667 MHz device figure for supporting faster internal control paths, although the final operating limits must be validated against the exact temperature grade and manufacturer timing constraints.
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Parallel Data Acquisition
The XC6SLX25-2CSG324C is suited to parallel data-acquisition front ends that must combine many sensor channels with local filtering and buffering. Its 226 I/O provide substantial channel parallelism, and 1,879 CLBs can implement acquisition control, channel sequencing, digital filtering, and data formatting. The 958,464-bit block-RAM capacity allows local buffering before data is transferred to a processor, memory, or communications engine. Maximum signal bandwidth depends on the selected I/O standard, board-level timing, package escape routing, and whether the implemented interfaces close successfully at the -2 speed grade.
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Embedded Communications Equipment
The XC6SLX25-2CSG324C can implement protocol engines, packet processing, interfaces, and supervisory control in embedded communications equipment. Its 24,051 logic cells are appropriate for parallel datapaths and finite-state-machine logic, while 958,464 bits of block RAM support packet queues, lookup tables, and buffering. The large I/O count allows the FPGA to connect transceivers, backplanes, memory, and status peripherals directly. Designers should use the manufacturer-supported clocking and I/O resources, then validate signal integrity, timing closure, and protocol throughput rather than treating the device’s maximum clock value as a guaranteed interface rate.
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Video and Image Processing
The XC6SLX25-2CSG324C is appropriate for embedded video pipelines that combine parallel pixel input, line or frame processing, and control functions. The 226 I/O can support multiple parallel data buses when voltage standards and timing permit, while 1,879 CLBs implement pipelines, filters, color conversion, and synchronization logic. Its 958,464 bits of block RAM can support line buffering and pixel-storage stages, reducing dependence on external memory for modest frame sizes. Practical image throughput still depends on memory bandwidth, I/O standards, board routing, and timing closure, so the design should be partitioned and tested against the required frame rate.
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Instrument Control and Measurement
The XC6SLX25-2CSG324C supports instrument-control and measurement systems that combine precision sequencing with programmable acquisition and communication logic. Its 226 user I/O can connect signal sources, measurement converters, front-panel controls, and isolation or interface components. The programmable fabric can implement calibration tables, timing control, trigger logic, and data paths, while block RAM provides local storage for measurement sequences. Because the device is not specified here as a dedicated analog measurement IC, measurement accuracy remains governed by external analog and converter circuitry. Use the -2 grade only after confirming that all timing-critical paths meet their margins.
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MicroBlaze Embedded Processing
The XC6SLX25-2CSG324C can host a MicroBlaze soft processor for embedded control, message handling, and supervisory functions alongside dedicated hardware logic. Its 24,051 logic cells allow a useful division between processor resources, programmable pipelines, and I/O interfaces, while 958,464 bits of block RAM can support instruction storage, data buffers, and peripheral FIFOs. The 226-I/O count expands connectivity with external memories and communications devices. System partitioning must account for processor performance, memory resources, interrupt latency, and timing constraints, and the final design should use supported AMD implementation tools and device documentation.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX25-2CSG324C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX25-2CSG324I | XC6SLX25T-2CSG324C | XC6SLX25-1CSG324C | XC6SLX25-3CSG324C | XC6SLX25T-1CSG324C |
|---|---|---|---|---|---|---|
| Package | 324-ball CSPBGA (CSG324) | 324-ball CSPBGA (CSG324) - same | 324-ball CSPBGA (CSG324) - same | 324-ball CSPBGA (CSG324) - same | 324-ball CSPBGA (CSG324) - same | 324-ball CSPBGA (CSG324) - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs |
| Block RAM | 958,464 bits | 958,464 bits | 958,464 bits | 958,464 bits | 958,464 bits | 958,464 bits |
| User I/O | 226 I/O | 226 I/O | 226 I/O | 226 I/O | 226 I/O | 226 I/O |
| Speed Grade | -2 | -2 | -2 | -1 | -3 | -1 |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Provides a balanced combination of programmable logic, memory, and package I/O (vs XC6SLX16-2CSG324C)
- Uses the -2 speed grade for a stronger timing class than the -1 option (vs XC6SLX25-1CSG324C)
- Matches the same package density while avoiding the need for a higher-performance grade when timing is already adequate (vs XC6SLX25-3CSG324C)
- Combines extensive I/O connectivity with embedded programmable processing capability (vs XC6SLX25-2FTG256C)
설계 노트
Use the official AMD Spartan-6 CSG324 package-device pinout file as the source of truth for all 324 ball assignments, including power, ground, configuration, clock, and user I/O. Import the package stack-up, ball map, and recommended footprint into the PCB library rather than approximating the 0.8 mm pitch arrangement. Confirm that differential pairs and memory interfaces use their assigned dedicated balls, and perform a design-rule check for adjacent power and ground balls before fabrication release.
Follow the exact XC6SLX25 device guidance for 1.2 V core, auxiliary, and I/O supplies, including capacitor placement and power-up sequencing. Place each required bypass capacitor on the shortest path between its assigned package ball and the corresponding ground reference plane. Separate noisy supply-return currents from configuration and sensitive clock references, and validate the power tree at the package rather than only at the regulator output. These steps reduce simultaneous-switching noise and configuration instability.
Treat every high-speed interface as a complete signal-integrity problem involving package escape, PCB trace geometry, reference planes, connectors, and the receiving device. Match length and skew according to the selected I/O standard and clock topology, avoid splits across plane boundaries, and include suitable series termination where required. Simulate the actual stack-up and edge rates because the device’s 667 MHz figure describes a supported clock specification rather than guaranteeing every external interface at that rate.
Do not substitute a different FPGA solely because it uses a 324-ball package. Confirm the exact XC6SLX25 device, speed grade, temperature suffix, supported I/O standards, configuration method, and bitstream compatibility. A CSG324 footprint match does not make a different Spartan-6 density electrically interchangeable. After selecting an ordering-grade alternative, rerun timing analysis, pin constraints, power checks, and implementation with the production device identifier.
규정 준수 정보
The device is identified as RoHS compliant and lead free. No exact-ordering-code evidence was available for REACH, halogen-free, conflict-mineral, or automotive qualification status.
