XC6SLX4-2CPG196C - 3,840-Cell Spartan-6 FPGA | AMD
부품 번호: XC6SLX4-2CPG196C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.509 | $18.51 |
| 10 | $18.509 | $185.09 |
| 100 | $18.509 | $1,850.90 |
| 500 | $18.509 | $9,254.50 |
| 1,000 | $18.509 | $18,509.00 |
XC6SLX4-2CPG196C 개요
A field-programmable gate array, or FPGA, is a programmable digital semiconductor in which logic, memory, and I/O behavior are configured through a bitstream after manufacture. The Spartan-6 LX FPGA family is intended for compact embedded systems requiring deterministic parallel logic, programmable I/O, and moderate on-chip memory. The XC6SLX4-2CPG196C therefore sits between fixed-function logic and higher-capacity programmable-logic devices.
The verified data identifies the part as a Spartan-6 LX FPGA with 106 I/O, 3,840 logic cells, 196-CSBGA packaging, 1.2 V operation, and 45 nm CMOS technology. The device also includes 8 DSP slices and up to 3.2 Gbps transceiver performance in the supplied comparison source. These characteristics make it suitable for embedded control, industrial automation, communications, instrumentation, and compact signal-processing designs.
The -2 suffix is a speed-grade designation, while the C suffix identifies the commercial temperature option according to the part naming convention reflected in the search results. The 196-CSBGA package provides a high ball count for dense I/O and power distribution, but it requires careful PCB layout, via-in-pad or escape routing strategies, and thermal planning. Configuration, programming, and tool support must be checked against the selected system design before releasing a production layout.
For new designs, engineers should verify the complete pinout, supported I/O standards, configuration requirements, and power-supply sequencing in the manufacturer datasheet. The BGA package makes fanout and assembly inspection more demanding than a leaded package, so PCB fabrication and assembly capability should be confirmed early.
This page consolidates verified distributor results, a real part price observation, package information, and design-oriented selection guidance. It does not infer missing electrical limits, timing values, lifecycle guarantees, or compliance claims that were not present in the supplied data.
드롭인 대체품: XC6SLX4-2CPG196C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX4-3CPG196C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-3CPG196I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-2CPG196I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-L1CPG196C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-2CPG196C 최대 정격 & 전기적 특성
| Product Type | Spartan-6 LX FPGA |
| Logic Cells | 3,840 cells |
| Number of LABs/CLBs | 300 |
| Number of Registers | 221,184 |
| I/O Count | 106 I/O |
| Block RAM | 216 Kb |
| DSP Slices | 8 DSP slices |
| Technology | 45 nm CMOS |
| 공급 전압 | 1.2 V |
| Speed Grade | -2 |
| Temperature Grade | Commercial |
| 패키지 | 196-TFBGA, CSBGA |
| Number of Terminals | 196 terminals |
| Terminal Form | Ball |
| Package Shape | Square |
| Transceiver Performance | 3.2 Gbps |
| Observed Price | $18.5090 |
| Datasheet Availability | Datasheet listed by Xilinx |
XC6SLX4-2CPG196C square 핀 구성 가이드
XC6SLX4-2CPG196C(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX4-2CPG196C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX4-2CPG196C 적합 용도: 6 애플리케이션s: Embedded Industrial Control, Industrial Communication Interface, Compact Data-Acquisition System, FPGA-Based Signal Conditioning, Industrial Automation and Robotics, Programmable Interface Aggregation.
Embedded Industrial Control
The AMD XC6SLX4-2CPG196C fits compact embedded controllers that combine programmable logic with external sensors, actuators, and communication interfaces. Its 3,840 logic cells and 106 I/O provide room for control state machines, signal conditioning, timing logic, and interface multiplexing without requiring a high-capacity FPGA. The 196-CSBGA package supports dense connections but demands careful escape routing and thermal review. Before schematic release, confirm I/O standards, clock requirements, configuration mode, and the device’s exact timing and power constraints in the AMD/Xilinx documentation.
추천
Industrial Communication Interface
The XC6SLX4-2CPG196C can implement protocol conversion, packet framing, FIFO buffering, and data-rate adaptation in industrial communication equipment. Its 221,184 registers and 216 Kb block RAM support parallel datapaths and bounded packet buffering, while 106 I/O can connect multiple digital interfaces. The -2 speed grade and 1.2 V technology should be checked against the required clock rate and timing margin. A BGA implementation also requires verifying layer count, via strategy, return paths, and signal-integrity performance during PCB stack-up review.
추천
Compact Data-Acquisition System
The FPGA is suitable for coordinating parallel ADC data, digital filtering, triggering, and data packing in a compact acquisition system. Its 3,840 logic cells can implement control and datapath logic, while 216 Kb block RAM can support buffers and timing relationships. The 8 DSP slices reported in the supplied comparison source make it potentially useful for fixed-point filtering or arithmetic pipelines. Exact acquisition timing, I/O voltage, and supported memory interfaces must be confirmed from the full datasheet rather than inferred from the distributor summary.
추천
FPGA-Based Signal Conditioning
The XC6SLX4-2CPG196C can perform programmable digital filtering, pulse shaping, thresholding, and signal-path conditioning when the design has modest logic requirements. Its 8 DSP slices and 216 Kb block RAM provide resources for sampled-data processing, while 106 I/O support parallel or differential interfaces when the selected I/O standard permits them. The design must verify clock topology, timing closure, input thresholds, and output drive requirements. Because the supplied data does not specify every I/O standard or timing parameter, those details require direct datasheet confirmation.
추천
Industrial Automation and Robotics
The FPGA can coordinate deterministic control logic in automation equipment, robotic controllers, and motion-control interfaces. Its 3,840 logic cells are appropriate for parallel state machines, encoder processing, interlock logic, and communication buffering, while 106 I/O provide connectivity to sensors and actuators. The commercial C grade should be compared with the actual enclosure temperature and industrial environmental requirements. Validate timing against motor-control latency, confirm power sequencing, and review the 196-CSBGA thermal design before production.
추천
Programmable Interface Aggregation
The XC6SLX4-2CPG196C can aggregate several low-speed or medium-speed digital interfaces behind a common programmable control fabric. Its 106 I/O and 3,840 logic cells support I/O expansion, protocol adapters, test-sequence logic, and status multiplexing. The 196-CSBGA package is useful when connector and component density is important, although assembly and inspection complexity increases compared with leaded packages. Validate every external interface’s voltage, direction, pull-up or pull-down requirement, and timing against the official package and pin documentation.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX4-2CPG196C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX4-3CPG196C | XC6SLX4-3CPG196I | XC6SLX4-2CPG196I | XC6SLX4-L1CPG196C |
|---|---|---|---|---|---|
| Package | 196-TFBGA / CSBGA | 196-TFBGA | 196-TFBGA | 196-TFBGA | 196-TFBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -3 | -3 | -2 | L1 |
| Temperature Designation | Commercial | Commercial | Industrial | Industrial | Commercial |
주요 차별점
- Exact 196-CSBGA package continuity (vs XC6SLX4-3CPG196C)
- Commercial-temperature baseline (vs XC6SLX4-3CPG196I)
- Resource profile for compact programmable logic (vs XC6SLX150-3FG900C)
설계 노트
The XC6SLX4-2CPG196C uses a 196-CSBGA package, so the PCB should be designed for controlled escape routing, adequate layer count, and assembly inspection access. Do not finalize pin assignments from distributor summaries alone. Obtain the official ball map and verify power, ground, configuration, clock, and high-speed signal groups before releasing the footprint and stack-up.
The verified data identifies 1.2 V operation but does not provide the complete core and I/O current limits. Confirm the required rail sequence, decoupling values, voltage tolerances, and power-source impedance in the AMD/Xilinx datasheet. Estimated power dissipation cannot be calculated from the supplied data because the relevant current and voltage-drop values are missing.
Keep clock, configuration, and sensitive I/O paths short where practical, and provide continuous return paths beneath high-speed routes. Because this is a BGA device with 196 terminals, inspect the escape-routing density and layer-transition strategy early. Validate differential or high-speed interfaces against the package-specific pinout and the selected PCB stack-up.
Do not assume that XC6SLX4-2CPG196C, XC6SLX4-2CPG196I, XC6SLX4-3CPG196C, and XC6SLX4-3CPG196I are automatically equivalent. The speed-grade and temperature suffixes affect qualification, even when the package is the same. Check timing constraints, operating temperature, configuration method, tool support, and any transceiver or feature differences before purchasing a replacement.
규정 준수 정보
The supplied verified data identifies the FPGA and package but does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Obtain current compliance documentation from AMD or the authorized distributor.
