XC6SLX4-2CSG225C - 3840-Cell Spartan-6 FPGA | AMD
부품 번호: XC6SLX4-2CSG225C ✓ 활성| 수량 | 단가 | 합계 |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC6SLX4-2CSG225C 개요
What is an FPGA? An FPGA is a programmable semiconductor whose configurable logic blocks, programmable I/O, memory resources, and dedicated hardware can be tailored after manufacture. An FPGA sits above fixed-function digital ICs in the design hierarchy: instead of requiring a new mask for every logic change, engineers can implement control, interface, timing, and signal-processing functions in one reconfigurable device. The Spartan-6 LX family is positioned for high-volume applications where system integration and cost matter more than the very highest device density.
The XC6SLX4-2CSG225C is reported with 132 I/O and 3840 logic cells. Its 45 nm CMOS implementation is relevant to power, switching activity, and tool-supported timing closure. The 225-CSBGA package provides a high pin-count surface-mount option for designs requiring substantial external connectivity. Detailed block counts, memory quantities, I/O standards, voltage limits, temperature grades, and timing constraints are not fully present in the supplied search snippets and must be obtained from the AMD Spartan-6 documentation before release.
Typical uses include industrial automation, programmable control, communications equipment, instrumentation, and embedded signal-processing systems. In these applications, the FPGA can implement protocol interfaces, state machines, sampling pipelines, timing controllers, or parallel-to-serial conversion. The design still requires correct bank voltage planning, I/O-standard assignment, clocking, decoupling, programming, and thermal assessment. A pin-compatible replacement cannot be assumed merely because another FPGA has similar resource counts; package ballout, voltage standards, configuration memory, clock resources, and timing margins must all match.
This page is limited to values explicitly supported by the supplied verified web data. It distinguishes documented facts from missing design data rather than estimating FPGA specifications, pricing, pin assignments, or electrical limits. Check the current AMD product documentation and authorized distribution records before committing a new PCB or production release.
드롭인 대체품: XC6SLX4-2CSG225C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX4-2CSG225C (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Cells, Device Type, Temperature Grade, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX4-3CSG225C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-2CSG225I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →XC6SLX4-2CSG225
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-2CSG225E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-2CSG225A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-2CSG225B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX4-2CSG225C 최대 정격 & 전기적 특성
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 3840 cells |
| User I/O | 132 I/O |
| 패키지 | 225-CSBGA / 225-LFBGA CSPBGA |
| Package Pin Count | 225 pins |
| Process Technology | 45 nm CMOS |
| Speed Grade | -2 |
| Temperature Grade | C |
| Product Family | Spartan-6 |
| Programming Technology | FPGA configuration memory |
| Logic Architecture | Configurable digital logic |
| I/O Count Source | 132 I/O |
| Lead-Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| Core Voltage | 1.2 V |
XC6SLX4-2CSG225C 225 pins 핀 구성 가이드
XC6SLX4-2CSG225C(225 pins 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX4-2CSG225C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX4-2CSG225C 적합 용도: 6 애플리케이션s: Industrial Automation Control, Programmable Communication Interface, Real-Time Signal Processing, Instrumentation and Data Acquisition, Embedded Timing and Trigger Logic, Embedded Networking Bridge.
Industrial Automation Control
The XC6SLX4-2CSG225C fits programmable industrial control systems requiring a fixed FPGA platform with 3840 logic cells and 132 I/O. It can implement sequencing logic, machine-state controllers, counter and timer functions, sensor conditioning logic, and parallel actuator drivers in one device. The 225-CSBGA package is appropriate when the design needs substantial board connectivity, but every bank voltage and I/O standard must be assigned from the official AMD documentation. Verify timing, temperature, and isolation requirements before using it as a production controller.
추천
Programmable Communication Interface
The XC6SLX4-2CSG225C can support communication equipment by implementing protocol state machines, frame handling, FIFO control, clock-domain crossing, and parallel data movement in programmable logic. Its 132 I/O provide a substantial external interface surface, while 3840 logic cells can support moderate protocol complexity without a fixed-function bridge. The design must confirm supported I/O standards, clock resources, timing margins, and package ballout. A software or firmware processor may be added separately when higher-level control is required.
추천
Real-Time Signal Processing
The FPGA is suitable for small-scale real-time processing front ends that combine sampling control, digital filtering, thresholding, event detection, or data reduction. The 3840-cell resource level is appropriate for a dedicated pipeline rather than a large processor workload, and the 132 I/O can expose parallel sensor, ADC, or DAC connections. Developers should use pipelined architectures and verify achievable clock frequency from the official timing data. The supplied search results do not confirm DSP block count, RAM capacity, or maximum performance.
추천
Instrumentation and Data Acquisition
The XC6SLX4-2CSG225C can coordinate data-acquisition systems that require parallel ADC input, digital filtering, calibration tables, trigger logic, and data transfer to an external processor. The device's 132 I/O and 225-CSBGA package provide enough physical connectivity for multi-channel or control-heavy implementations. Designers must define clock domains carefully, validate timing for the selected ADC interface, and include proper decoupling and grounding. ADC datasheets and FPGA pin constraints should be reviewed together before layout release.
추천
Embedded Timing and Trigger Logic
The XC6SLX4-2CSG225C is useful as a programmable timing, trigger, and sequencing engine in test and measurement equipment. It can coordinate multiple capture events, generate deterministic control signals, implement counters and delay lines, and combine logic functions that would otherwise require several fixed ICs. The 225-CSBGA package supports dense interconnects, but timing closure depends on the exact clock, I/O standard, and routing resources. Use the AMD pinout and timing documentation to establish deterministic constraints rather than inferring them from the distributor snippets.
추천
Embedded Networking Bridge
The XC6SLX4-2CSG225C can serve as a small logic-only bridge between parallel FPGA-side functions and external communications circuitry. Typical tasks include buffering, framing, byte alignment, flow control, and status reporting. It is most appropriate when the interface logic is modest and the system already supplies an external network controller or PHY. The supplied verified data does not establish protocol-specific hard blocks, so the designer must implement required functions in LUTs, registers, and available memory while confirming performance and power in the selected device.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX4-2CSG225C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX4-3CSG225C | XC6SLX4-2CSG225I | XC6SLX4-2CSG225 | XC6SLX4-2CSG225E | XC6SLX4-2CSG225A |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 225-CSBGA | 225-CSBGA | 225-CSBGA | 225-CSBGA | 225-CSBGA | 225-CSBGA |
주요 차별점
- Identified 3840-cell Spartan-6 LX implementation (vs XC6SLX4-3CSG225C)
- High pin-count FPGA package (vs XC6SLX4-2CSG225I)
- AMD Spartan-6 LX software and device continuity (vs Lattice ECP5-5G)
설계 노트
Use the official AMD Spartan-6 225-CSBGA package file to create the footprint and ball map. Do not derive the PCB land pattern from a distributor package label such as 225-LFBGA or CSPBGA. Confirm pin locations, power balls, ground balls, configuration pins, and exposed or thermal-related structures before routing. The supplied search results identify the package but do not provide a complete pinout.
Do not treat XC6SLX4-2CSG225C, XC6SLX4-2CSG225I, and XC6SLX4-3CSG225C as automatically interchangeable merely because the family and package names are similar. Confirm the ordering suffix, speed grade, temperature grade, marking, configuration behavior, voltage requirements, and timing constraints. A faster speed grade can change timing closure, while a different suffix can change qualification or commercial ordering conditions.
Plan the power architecture from the official AMD power, voltage, and I/O-bank documentation. The supplied data reports a 1.2 V core voltage but does not provide current limits, static power, dynamic power, I/O supply limits, or recommended decoupling values. Do not estimate rail requirements from the FPGA family name; verify every supply rail and sequencing requirement against the official data before schematic capture.
Assign pins and I/O standards only after defining the clock, voltage, and interface architecture. The 132-I/O figure does not imply that all pins can operate at the same voltage or in the same direction. Use constraints to separate incompatible banks, check source-synchronous timing, and verify board-level signal integrity for high-speed interfaces. Package-specific ball information is required for a valid constraint file.
Thermal assessment must use the package thermal data and the actual board stack-up. The supplied search results do not provide junction temperature, theta-JA, power dissipation, or ambient-temperature limits for the XC6SLX4-2CSG225C. Estimate power from the implemented design and device documentation, then preserve adequate copper, vias, airflow, and enclosure margin. The value of this note is to flag the missing data, not to substitute for a thermal calculation.
규정 준수 정보
The supplied DigChip result states Lead Free and RoHS Compliant. No verified REACH, halogen-free, conflict-minerals, or AEC-Q100 information was supplied. AEC-Q100 is not applicable unless an automotive-qualified ordering variant is explicitly documented.
