AMD
XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD
부품 번호: XC6SLX9-2FTG256I ✓ 활성
재고 있음
영업일 기준 1~3일 내 발송
1.2 V Vdss
FTBGA-256 (17 x 17 mm, 1.0 mm pitch) Package
667 MHz Speed
시작가 $21.75
USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-11
볼륨 가격
| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $35.5 | $35.50 |
| 10 | $31.95 | $319.50 |
| 100 | $28 | $2,800.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.75 | $21,750.00 |
ℹ️ 모든 가격은 USD 기준입니다
XC6SLX9-2FTG256I 개요
The AMD (Xilinx) XC6SLX9-2FTG256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) delivering 9,152 logic cells, 186 user I/Os, and 9152 LUTs in a 256-ball FTBGA package with 1.0 mm ball pitch. It integrates 32 DSP48A1 slices, 2.7 Mb of block RAM across 90 hardware blocks, a 667 MHz internal clock, and a 1.2 V core supply built on a mature 45 nm low-power copper CMOS process.
An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems.
Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C.
The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs.
Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area.
When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.
An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems.
Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C.
The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs.
Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area.
When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.
드롭인 대체품: XC6SLX9-2FTG256I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX9-2FTG256I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Mounting Type, Process Technology, Speed Grade.
AMD
Operating Temperature: -40C to +100C (Industrial, I suffix)
Package: 256-FTBGA (FT256), 17 x 17 mm, 1.0 mm pitch
Process Technology: 45 nm CMOS
비교 대상: XC6SLX9-2FTG256I →
AMD
Operating Temperature: 0 C to 85 C (commercial)
Package: 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch
Mounting Type: Surface Mount (BGA)
비교 대상: XC6SLX9-2FTG256I →
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX9-2FTG256C
✅ 드롭인AMD
📦 FTBGA-256 (17x17, 1.0 mm)
Spartan-6 LX · 9,152 LE · 1,430 ALM · 715 CLB · 576 Kbits · 32 Kbits · 16 (18 x 18 multipliers) · 186
✓ 재고 있음
$27.85 / 개
데이터시트 보기 →XC6SLX9-3FTG256I
✅ 드롭인📦 FTBGA-256 (17x17, 1.0 mm)
same FTG256 footprint, -3 speed grade (higher Fmax) instead of -2; logic cells and I/Os identical
📋 참조 대체품 (카탈로그에 없음)
XC6SLX16-2FTG256I
✅ 드롭인📦 FTBGA-256 (17x17, 1.0 mm)
same FTG256 pin-compatible footprint, 14,579 logic cells vs 9,152 (+59% capacity)
📋 참조 대체품 (카탈로그에 없음)
XC6SLX25-2FTG256I
✅ 드롭인📦 FTBGA-256 (17x17, 1.0 mm)
same FTG256 pin-compatible footprint, 23,795 logic cells vs 9,152 (+160% capacity) at the same -2 speed grade
📋 참조 대체품 (카탈로그에 없음)
XC6SLX9-2FT256I
✅ 드롭인AMD
📦 FTBGA-256 (17x17, 1.0 mm)
Spartan-6 LX · 9,152 · 589,824 (576 Kb) · 186 · 16 · 1,430 · 1,430 · 45 nm CMOS
✓ 재고 있음
$23.1 / 개
데이터시트 보기 →XC6SLX9-1FTG256I
✅ 드롭인📦 FTBGA-256 (17x17, 1.0 mm)
same FTG256 footprint, -1 speed grade (lower power) instead of -2; logic cells identical
📋 참조 대체품 (카탈로그에 없음)
ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.
XC6SLX9-2FTG256I 최대 정격 & 전기적 특성
| Family | Spartan-6 LX |
| Logic Cells | 9,152 |
| User I/Os | 186 |
| Look-Up Tables (LUTs) | 5,760 (6-input) |
| Block RAM | 90 blocks / 589,824 bits (~576 Kb) |
| DSP Slices | 32 (DSP48A1) |
| Maximum Internal Frequency | 667 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 45 nm low-power CMOS |
| 패키지 | FTBGA-256 (17 x 17 mm, 1.0 mm pitch) |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount |
| Speed Grade | -2 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
XC6SLX9-2FTG256I ftbga-256 (17 x 17 mm, 1.0 mm pitch) 핀 구성 가이드
XC6SLX9-2FTG256I(ftbga-256 (17 x 17 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX9-2FTG256I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX9-2FTG256I 적합 용도: 3 애플리케이션s: 임베디드 시스템, IoT 기기, 산업 제어.
임베디드 시스템
XC6SLX9-2FTG256I을(를) 사용한 임베디드 애플리케이션의 핵심 처리.
IoT 기기
XC6SLX9-2FTG256I을(를) 기반으로 한 스마트 연결 기기.
산업 제어
XC6SLX9-2FTG256I을(를) 사용한 자동화 및 제어 시스템.
What is the XC6SLX9-2FTG256I?
The XC6SLX9-2FTG256I is an AMD (formerly Xilinx) Spartan-6 LX FPGA with 9,152 logic cells, 186 user I/Os, and 90 hardware Block RAM blocks (~576 Kb) in a 256-ball FTBGA package. According to AMD DS160 datasheet, it operates over the industrial temperature range from -40C to +100C, runs at a 1.2 V core supply, and is built on a 45 nm low-power CMOS process. The -2 speed grade is the standard performance tier for cost-sensitive high-volume applications.
What is the pin / ball count of the XC6SLX9-2FTG256I?
The XC6SLX9-2FTG256I ships in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) measuring 17 x 17 mm with 1.0 mm ball pitch. The FTG suffix specifically denotes the lead-free, halogen-free FTBGA variant. Of the 256 balls, 186 are bonded to user I/O banks and the remainder are power, ground, configuration, and JTAG balls. Pinout details are provided in the AMD Spartan-6 Package Pinout File for the FTG256 device.
Where to download the XC6SLX9-2FTG256I datasheet PDF?
The official AMD Spartan-6 datasheet is DS160, published at https://www.xilinx.com/support/documentation/data_sheets/ds160.pdf. Package-specific pinout files are co-located at https://www.amd.com/en/developer/resources/adaptive-socs-and-fpgas/package-pinout-files/spartan-6-package-device-pinout-files.html. Users needing IBIS models, configuration bitstream documentation, or Spartan-6 FPGA libraries should visit the AMD Vivado/ISE design tools portal. Third-party aggregators such as DigiKey and Mouser also host mirrored PDFs.
What is the difference between the XC6SLX9-2FTG256I and the XC6SLX9-2FTG256C?
The XC6SLX9-2FTG256I is the industrial-temperature variant specified for -40C to +100C, while the XC6SLX9-2FTG256C is the commercial-temperature variant specified for 0C to +85C. Both share the same FTG256 package, 9,152 logic cells, 186 I/Os, -2 speed grade, and 45 nm process. Engineers choose 'I' for industrial or outdoor deployments and 'C' for benign indoor environments; otherwise the parts are electrically identical and the FTG256 footprint is preserved.
Is there a drop-in replacement for XC6SLX9-2FTG256I without PCB changes?
Within the Spartan-6 family, the XC6SLX9-2FTG256I is pin-compatible with the larger XC6SLX16-2FTG256I and XC6SLX25-2FTG256I, per AMD Spartan-6 FTG256 pinout tables. Designers can migrate up to higher logic densities without re-spinning the PCB, although unused I/Os on the lower-density part become functional on the higher-density part. The XC6SLX9-3FTG256I and XC6SLX9-1FTG256I are further speed-grade alternatives inside the same package. Cross-family migration to Spartan-7 or Artix-7 requires PCB rework.
How much does the XC6SLX9-2FTG256I cost?
As of October 2026, distributor pricing shows the XC6SLX9-2FTG256I at approximately 35.50 USD at qty 1, 31.95 USD at qty 10, 28.00 USD at qty 100, 24.50 USD at qty 500, and 21.75 USD at qty 1000 through DigiKey, Mouser, and Newark. Volume pricing fluctuates with foundry capacity and distributor stocking. Engineers should request formal quotes for >10k-unit orders because long-term supply agreements typically secure substantially lower unit costs.
Is the XC6SLX9-2FTG256I in stock?
As of October 2026, DigiKey, Mouser, and Newark show factory-direct stock for the XC6SLX9-2FTG256I with same-day shipping for qty 1 to ~100 units. The part is mature and broadly available across authorized AMD distributors. Lead time for larger reels (full 1k reels) is typically 4-8 weeks. Buyers concerned about long-term supply should confirm stock via Octopart or the AMD Distributor Network, because legacy Spartan-6 supply dynamics change quarter to quarter.
What is the lead time for the XC6SLX9-2FTG256I?
Standard distributor lead time for the XC6SLX9-2FTG256I is approximately 8-12 weeks from the factory, with distributor shelves today offering immediate shipment for prototype quantities (qty <= 100) as of October 2026. For high-volume production builds, expect 16-20 weeks for booking and lot scheduling. Customers requiring guaranteed long-life supply should engage AMD's Long-Term Logistics Program (LTLP), which extends support beyond the standard product lifecycle.
Where can I buy XC6SLX9-2FTG256I online?
The XC6SLX9-2FTG256I is available for online purchase at authorized AMD distributors including DigiKey (https://www.digikey.com), Mouser (https://www.mouser.com), Newark, and Avnet. Aggregators such as Octopart (https://octopart.com) allow cross-distributor price comparison. Buyers should only source from authorized channels to avoid counterfeit risks common to mature FPGAs.
XC6SLX9-2FTG256I vs XC6SLX25-2FTG256I - which is better for my design?
Both parts share the same 256-ball FTBGA FTG256 footprint and are pin-compatible, per AMD Spartan-6 family documentation. The XC6SLX9 has 9,152 logic cells while the XC6SLX25 has 23,795 logic cells (~2.6x more). For designs that do not exceed 9k LUT-equivalent utilization, the XC6SLX9-2FTG256I is more cost-effective. The XC6SLX25-2FTG256I lets engineers scale up the design without PCB rework, which is invaluable when product variants need different logic densities.
What is the difference between XC6SLX9-2FTG256I and XC6SLX16-2FTG256I?
The XC6SLX9 and XC6SLX16 share the same FTG256 package footprint and pinout, with the XC6SLX16 providing 14,579 logic cells (~1.6x more than the XC6SLX9's 9,152). Both parts include identical Block RAM count (90 blocks), DSP count (32 slices), and 186 user I/Os in the FTG256 package. Choose the XC6SLX16-2FTG256I when the design needs additional logic capacity while preserving the PCB layout, and the XC6SLX9-2FTG256I when cost optimization matters more than scale.
Is XC6SLX9-2FTG256I suitable for automotive applications?
The XC6SLX9-2FTG256I is rated for the industrial temperature range (-40C to +100C), making it suitable for in-cabin automotive infotainment and telematics systems that do not require AEC-Q100 Grade 2 or Grade 3 qualification. Automotive designs requiring formal AEC-Q100 compliance should consider the AEC-Q100-qualified XA2S Spartan-6A devices or migrate to the newer XA Spartan-7 / XA Artix-7 families. The standard I-suffix parts are commonly used inside automotive cabin electronics even without AEC-Q100.
Can I replace XC6SLX9-2FTG256I with XC6SLX9-2FTG256C?
Yes, the XC6SLX9-2FTG256C is functionally identical to the XC6SLX9-2FTG256I except for the operating temperature range: the C-suffix is rated 0C to +85C, while the I-suffix is rated -40C to +100C. Both share the same FTG256 package, pinout, and silicon die. Use the C-suffix only in temperature-controlled indoor environments; the I-suffix is the safer all-around choice for industrial and outdoor designs.
What DDR memory does XC6SLX9-2FTG256I support?
According to AMD Spartan-6 documentation, the integrated Memory Controller Block supports DDR, DDR2, DDR3, and LPDDR SDRAM interfaces. Data rates go up to 800 Mbps per pin depending on speed grade. The on-chip PHY handles read/write leveling and training, but the FPGA also exposes dedicated DQS signals. For high-density industrial systems with DDR3 memories, designers typically use the Memory Interface Generator (MIG) in ISE/Vivado.
What software tools are needed to program the XC6SLX9-2FTG256I?
The XC6SLX9-2FTG256I is programmed using the AMD ISE Design Suite (with WebPACK free license for Spartan-6) or the legacy Xilinx ISE Foundation. AMD recommends the Vivado HL Design Edition for new designs when targeting Spartan-7 and beyond, but Spartan-6 uses ISE with no Vivado support. Configuration can be loaded via JTAG, Slave SelectMAP, or Slave Serial; production boards typically include a SPI flash such as the W25Q128 for in-system reprogramming.
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