XC7A15T-1CSG324I - 16,640-LC Artix-7 FPGA | AMD
부품 번호: XC7A15T-1CSG324I ✓ 활성XC7A15T-1CSG324I 개요
An FPGA is a semiconductor whose digital logic, interconnect and signal-processing resources are configured after manufacture. Within the product hierarchy, an FPGA is a programmable-logic semiconductor and a reconfigurable digital IC. The XC7A15T belongs to AMD's Artix-7 family, combining general-purpose programmable logic with block RAM, DSP48 processing and high-performance I/O in a relatively small package.
The verified specifications identify 16,640 logic cells, 210 I/Os, 921,600 internal configuration bits and 45 DSP slices. Its 324-CSPBGA package is identified in distributor records as a 324-LFBGA/CSPBGA, while an independent market listing specifies a 15 mm × 15 mm body. The -1 suffix denotes the device speed grade, the CSG324 suffix identifies the package, and the I suffix identifies industrial-temperature production.
The Artix-7 architecture supports parallel processing, programmable I/O and dedicated DSP resources rather than implementing the complete design in fixed-function logic. This allows the same board design to be reused across multiple product variants through bitstream changes. The 45 DSP slices are especially relevant to filtering, fixed-point arithmetic, signal conditioning and control-loop workloads, while 210 I/Os support parallel buses, sensor acquisition and external memory interfaces.
Typical applications include industrial automation, test and measurement, embedded control, communications, camera and image-processing interfaces, and compact instrumentation. The device is appropriate when deterministic parallel I/O and field-updatable logic are more valuable than the very high performance or very high logic density available from larger FPGA families. A complete design still requires suitable memory, clocking, power rails and high-speed PCB layout.
Designers should use the AMD package pinout files and UG475 package guidance to map every CSG324 ball. Power, decoupling, configuration access, clocking and high-speed routing must follow the manufacturer's Artix-7 guidance. The industrial temperature rating applies to junction temperature and must be considered together with actual enclosure temperature, board heating and the device's power dissipation.
This page consolidates verified distributor specifications, package details, temperature and speed-grade information into an engineering-focused selection reference. It also distinguishes documented drop-in options from unverified equivalents, provides comparison parameters, and identifies the application constraints that require datasheet and board-level review before procurement.
드롭인 대체품: XC7A15T-1CSG324I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A15T-1CSG324I (동일 폼 팩터 및 풋프린트) — 차이점: Logic Cells, Mounting Type, Operating Temperature Range, Package.
XC7A15T-1CSG324C
✅ 드롭인가격 문의
데이터시트 보기 →XC7A15T-2CSG324I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7A15T-3CSG324I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7A15T-1CSG324E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XA7A15T-1CSG324I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A15T-1CSG324I 최대 정격 & 전기적 특성
| Device Type | Artix-7 Field-Programmable Gate Array (FPGA) |
| Logic Cells | 16,640 logic cells |
| Number of I/O | 210 I/Os |
| Configuration Bits | 921,600 bits |
| DSP Slices | 45 DSP slices |
| Block RAM | 900 Kb |
| Process Technology | 28 nm |
| Core Supply Voltage | 1 V |
| Device Family | Artix-7 |
| Speed Grade | -1 |
| Temperature Grade | Industrial |
| 동작 온도 범위 | -40 °C to +100 °C junction temperature |
| 패키지 | 324-CSPBGA, 15 mm × 15 mm |
| Package Designation | CSG324 |
| Package Type | 324-LFBGA, CSPBGA |
| 실장 유형 | Surface Mount |
| Clocking and Timing Resources | MMCM and PLL resources |
XC7A15T-1CSG324I 324-lfbga, cspbga 핀 구성 가이드
XC7A15T-1CSG324I(324-lfbga, cspbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7A15T-1CSG324I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7A15T-1CSG324I 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Test and Measurement Instrumentation, Communications and Protocol Bridging, Audio and DSP Processing, Camera and Image Processing, Embedded Data Acquisition.
Industrial Automation and Control
The XC7A15T-1CSG324I fits compact industrial controllers that require deterministic parallel I/O, programmable sequencing and field-updatable logic. Its 210 I/Os can connect sensors, actuators, counters and discrete control signals, while the -40 °C to +100 °C industrial junction-temperature rating supports equipment expected to operate below room temperature. The 45 DSP slices can accelerate filtering or feedback calculations without shifting every operation to an external processor. Engineers should budget margin between calculated junction temperature and the 100 °C limit, then apply isolation, surge protection and grounding techniques required by the installation environment.
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Test and Measurement Instrumentation
The XC7A15T-1CSG324I is suitable for parallel acquisition, timing, trigger and protocol-processing instruments because its 210 I/Os provide broad connectivity and its programmable logic permits reusable instrument architectures. The 16,640 logic cells and 45 DSP slices allow multiple channels to be sampled, filtered and processed concurrently without relying solely on a sequential CPU. According to the verified AMD specifications, the device also includes MMCM and PLL resources for clock management. A practical instrument design must still constrain timing skew, use proper clocking, provide clean analog front ends and verify every interface voltage against the manufacturer data sheet.
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Communications and Protocol Bridging
The XC7A15T-1CSG324I can implement parallel-to-serial protocol conversion, framing, buffering and interface bridging where deterministic hardware handling is advantageous. Its 210 I/Os accommodate multiple buses and control signals, while programmable logic can support protocol changes through configuration updates. The verified device data identifies 921,600 configuration bits and modern MMCM/PLL timing resources, allowing one FPGA platform to serve several related communication functions. Deployment decisions must account for supported transceiver standards, signal integrity, clock jitter, termination and the fact that the supplied excerpts do not identify a dedicated high-speed serial transceiver specification.
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Audio and DSP Processing
The XC7A15T-1CSG324I is appropriate for audio filtering, mixing, modulation and real-time signal processing because it provides 45 dedicated DSP slices alongside 16,640 logic cells. These resources can execute multiply-accumulate operations and parallel control logic in hardware, reducing reliance on a processor for time-critical sample processing. The 210 I/Os provide access to audio-control signals and external memory, although high-speed memory interfaces must follow the manufacturer's timing and layout guidance. Good audio performance also depends on analog-to-digital and digital-to-analog converters, clean supplies, short return paths and clock synchronization, none of which can be inferred from the FPGA MPN alone.
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Camera and Image Processing
The XC7A15T-1CSG324I can support camera interface bridging, pixel formatting, thresholding and real-time preprocessing when the required data rate fits the device and selected external memory interface. The 45 DSP slices are useful for filtering and arithmetic pipelines, while the 210 I/Os provide parallel sensor and control connectivity. According to the verified product information, the device provides 900 Kb of block RAM, which can buffer limited image sections or line data but is not sufficient for unrestricted full-frame storage. Designers must verify camera timing, LVDS or parallel signal integrity, memory bandwidth and FPGA resource utilization after synthesis.
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Embedded Data Acquisition
The XC7A15T-1CSG324I suits embedded data-acquisition systems that must combine many digital inputs with local filtering, buffering and control. Its 210 I/Os can serve multiplexed sensor channels, status signals and storage interfaces, while the programmable architecture allows sampling sequences to be changed without redesigning the PCB. The industrial temperature classification supports applications outside typical room-temperature conditions, provided actual junction temperature remains below the verified 100 °C maximum. Engineering evaluation should include input threshold compatibility, timing closure, memory-map partitioning, watchdog behavior and recovery after configuration or power faults.
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추천 제품 요약
엔지니어링 참조 데이터: XC7A15T-1CSG324I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A15T-1CSG324C | XC7A15T-2CSG324I | XC7A15T-3CSG324I | XC7A15T-1CSG324E | XA7A15T-1CSG324I |
|---|---|---|---|---|---|---|
| Package | 324-CSPBGA (CSG324), 15 mm × 15 mm | 324-CSPBGA (CSG324) | 324-CSPBGA (CSG324) | 324-CSPBGA (CSG324) | 324-CSPBGA (CSG324) | 324-CSPBGA (CSG324) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells |
| I/O Count | 210 I/Os | 210 I/Os | 210 I/Os | 210 I/Os | 210 I/Os | 210 I/Os |
| Speed Grade | -1 | -1 | -2 | -3 | -1 | -1 |
| Temperature Classification | Industrial, -40 °C to +100 °C junction | Commercial | Industrial | Industrial | E temperature classification | XA classification |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
주요 차별점
- Verified industrial temperature capability (vs XC7A15T-1CSG324C)
- Identical verified logic and connectivity resources (vs XA7A15T-1CSG324I)
- Direct -1 speed-grade source for timing-sensitive designs (vs XC7A15T-2CSG324I)
설계 노트
Use the official AMD CSG324 package file and UG475 before assigning power, ground, configuration and user I/O balls. The verified package is a 324-CSPBGA in a 15 mm × 15 mm body, leaving little routing space between fine-pitch balls. Escape signals through the shortest practical paths, place decoupling close to its corresponding supply ball and preserve the manufacturer's layer stack guidance. Do not substitute an SOIC or QFN footprint: those packages are not pin-compatible with this BGA device.
Implement the complete power tree from the AMD data sheet rather than assuming that the verified 1 V core value is the only supply requirement. Separate core and I/O rails according to the manufacturer's permitted supply combinations, verify bank voltage compatibility and account for configuration pins during power sequencing. Place bulk and local decoupling on the same PCB layers as the associated balls where practical. De-energizing or brownout conditions can damage configuration memories, so validate sequencing against the device's absolute-maximum and recommended operating conditions.
Estimated thermal design must use total FPGA power, the board-specific junction-to-ambient thermal resistance and the local ambient temperature; those inputs were not supplied, so no numerical junction temperature is asserted. The verified industrial maximum is +100 °C junction temperature. Leave margin for enclosure heating, adjacent regulators and worst-case process activity rather than designing directly against the limit. A dense CSG324 layout requires deliberate via arrays and copper distribution so heat can leave the device instead of concentrating beneath the package.
Apply AMD's clocking and board-design guidance to every high-speed interface, particularly clocks, memory and external buses. Use controlled-impedance routing, appropriate source and termination networks, and route clocks as short as practical. The verified excerpts identify MMCM and PLL resources but do not specify supported transceiver standards or maximum interface rates, so those limits must be read from the Artix-7 data sheet for the selected bank voltage. Do not infer I/O performance from the 210-I/O count alone.
규정 준수 정보
The supplied verified data confirms an industrial temperature grade but does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free or conflict-minerals statements. These fields remain unknown rather than being inferred from manufacturer identity.
