XCKU3P-2FFVD900I - 355,950 LEs Kintex UltraScale+ FPGA | AMD
부품 번호: XCKU3P-2FFVD900I ✓ 활성XCKU3P-2FFVD900I 개요
A field-programmable gate array, or FPGA, is a programmable semiconductor in which digital logic, interfaces, and parallel processing functions are configured through programmable bitstreams. FPGAs occupy the semiconductor hierarchy above fixed-function logic devices and provide hardware parallelism, reconfigurability, and deterministic real-time operation. The Kintex UltraScale+ family combines FPGA fabric with programmable logic, embedded memory, DSP resources, and high-speed serial connectivity for demanding signal-processing and data-center systems.
The XCKU3P device provides 355,950 logic cells for implementing control logic, protocol bridges, packet processors, and parallel algorithms. Its 12,960 Kb of block RAM supports buffering, lookup tables, packet storage, and data-plane scratchpad requirements. The 1,368 DSP slices accelerate fixed-point and floating-point operations associated with filtering, modulation, error correction, and other digital signal-processing workloads. The listing identifies 304 I/O, while the FFVD900 package supports a high-density board layout that requires careful power, thermal, and signal-integrity engineering.
The -2 designation identifies the device speed grade, allowing engineers to plan for the timing performance associated with this device within complete FPGA designs. The industrial temperature indication makes the part appropriate for equipment expected to operate across extended industrial temperature conditions, subject to the complete AMD device specifications and board-level thermal design. This device is programmed through the AMD adaptive-computing toolchain and requires a compatible FPGA configuration architecture, clocking, memory interface, and power-delivery system.
Typical applications include high-throughput data processing, network packet handling, accelerator control, high-performance signal processing, video infrastructure, and communications equipment. The large logic and DSP resources allow multiple parallel pipelines to operate simultaneously, while block RAM reduces reliance on external memory for short-latency buffering. System clocking and power sequencing remain central because performance depends on the complete board and design implementation rather than on logic-cell counts alone.
For a new design, place all power and ground connections directly under their assigned BGA balls, preserve the AMD reference-design layer stack, and keep high-speed routing short. Check junction temperature under the worst-case activity and ambient conditions, provide suitable power-decoupling networks, and validate signal integrity with the package and board models published for the FFVD900 device. Confirm bitstream compatibility and pin assignments in the current package files before releasing PCB artwork.
This page combines the verified device specifications, source references, replacement analysis, comparison data, and practical integration guidance needed to evaluate the XCKU3P-2FFVD900I for industrial FPGA and adaptive-computing systems.
드롭인 대체품: XCKU3P-2FFVD900I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XCKU3P-2FFVD900I (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package, Speed Grade.
XCKU3P-1FFVD900I
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XCKU3P-2FFVD900E
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XCKU3P-1FFVD900E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCKU3P-3FFVD900I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCKU3P-2FFVD900I 최대 정격 & 전기적 특성
| Device Type | Kintex UltraScale+ field-programmable gate array |
| Logic Cells | 355,950 cells |
| Block RAM | 12,960 Kb |
| DSP Slices | 1,368 slices |
| User I/O | 304 I/O |
| Speed Grade | -2 |
| Temperature Grade | Industrial |
| Junction Temperature Range | -40°C to 100°C |
| 패키지 | 900-FCBGA |
| Package Dimensions | 31 x 31 mm |
| 실장 유형 | Surface mount |
| Programmable Logic | Kintex UltraScale+ FPGA fabric |
| On-Chip Memory | Block RAM |
| Digital Signal Processing Resources | DSP slices |
XCKU3P-2FFVD900I 31 x 31 mm 핀 구성 가이드
XCKU3P-2FFVD900I(31 x 31 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XCKU3P-2FFVD900I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XCKU3P-2FFVD900I 적합 용도: 6 애플리케이션s: Network Packet Processing, Fixed-Point DSP Acceleration, Video Processing Infrastructure, Industrial Control and Acquisition, Data-Center Storage and Compression, Communications and Modulation.
Network Packet Processing
The XCKU3P-2FFVD900I fits high-throughput packet-processing and network-function designs because its 355,950 logic cells can implement parallel header parsing, classification, filtering, and traffic-control pipelines. The 12,960 Kb of block RAM provides substantial on-chip buffering for packet buffers, lookup structures, and latency-tolerant data planes. Its 1,368 DSP slices can also accelerate filtering, correlation, and other arithmetic-heavy stages without relying exclusively on external processors. Designers commonly place the FPGA between network interfaces and a host processor, allowing packets to be filtered or transformed in parallel. The -2 speed grade supports performance-oriented timing plans, while the industrial temperature range fits equipment with demanding environmental requirements. Power, clock jitter, memory bandwidth, and board-level signal integrity must be evaluated with the final interface architecture.
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Fixed-Point DSP Acceleration
The XCKU3P-2FFVD900I is well suited to fixed-point filtering, modulation, correlation, and error-correction pipelines because it provides 1,368 dedicated DSP slices alongside 355,950 logic cells. Parallel slices allow several sample paths or channels to be processed concurrently, while block RAM can hold coefficients, sample histories, and intermediate results close to the arithmetic engines. In an accelerator architecture, the FPGA receives batches from a host or data source, executes the DSP pipeline, and returns reduced or transformed data. The -2 speed grade is valuable when timing closure requires the higher performance option, and the industrial temperature specification supports controlled industrial equipment. Designers should map operations carefully to DSP48 resources, monitor pipeline latency, and account for memory-port contention when multiple channels access shared block RAM.
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Video Processing Infrastructure
The XCKU3P-2FFVD900I can serve as the central programmable element in video infrastructure when a design requires parallel pixel processing, frame buffering, scaling, color conversion, or image feature extraction. Its 355,950 logic cells accommodate control logic and interface adapters, while 12,960 Kb of block RAM provides meaningful local storage for line buffers and working frames. The 1,368 DSP slices support arithmetic-heavy pixel operations and filter kernels in parallel. A typical implementation receives video through high-speed serial or parallel interfaces, performs the required transformations, and forwards output to memory, network, or display infrastructure. The -2 speed grade and industrial temperature range are appropriate for performance-oriented industrial video equipment, but output timing, lane equalization, and thermal behavior must be confirmed during system integration.
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Industrial Control and Acquisition
The XCKU3P-2FFVD900I fits industrial control, test, and data-acquisition systems that combine deterministic parallel logic with substantial local processing. Logic cells can implement sensor interfaces, timing controllers, state machines, and communication protocols, while block RAM supports sample capture and DSP-style filtering. The 1,368 DSP slices enable real-time transforms without relying on a separate accelerator, allowing sampled data to be conditioned before transmission or control decisions. Its -40°C to 100°C industrial junction-temperature specification supports harsh industrial environments when the complete system is thermally qualified. Engineers should partition time-critical acquisition from less critical control functions, constrain clocks carefully, and use the AMD timing and power tools to verify that resource utilization, routing, and thermal rise remain within the system budget.
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Data-Center Storage and Compression
The XCKU3P-2FFVD900I can accelerate storage, compression, and data-reduction functions that benefit from parallel logic and configurable DSP resources. The 355,950 logic cells support control paths, protocol checks, and data movement, while 12,960 Kb of block RAM can serve as local working memory for block processing. Its 1,368 DSP slices are useful for checksums, transforms, filtering, and other numeric operations in a pipelined accelerator. Such a design can sit between a host processor or storage interface and downstream data infrastructure, reducing the amount of data transferred by performing selected operations before aggregation. The -2 speed grade is appropriate when throughput is central to the architecture. Designers must evaluate external-memory bandwidth, queue depth, ECC requirements, and sustained power because logical capacity alone does not determine application performance.
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Communications and Modulation
The XCKU3P-2FFVD900I is suitable for communications equipment requiring parallel modulation, demodulation, filtering, and protocol-processing functions. Its 1,368 DSP slices can implement multiply-accumulate-heavy signal chains, while 355,950 logic cells accommodate symbol detection, framing, control, and interface logic. Block RAM provides coefficient and packet storage close to the processing pipelines, helping reduce dependence on slower external memory for repeatable operations. In a radio or test-equipment design, the FPGA can combine a programmable datapath with high-speed serial links and deterministic timing. The -2 speed grade supports higher clock and pipeline targets, and the industrial temperature range is relevant to communication infrastructure outside controlled office environments. Final designs still require careful clock-jitter analysis, I/O calibration, and power budgeting for sustained transmit or receive activity.
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추천 제품 요약
엔지니어링 참조 데이터: XCKU3P-2FFVD900I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCKU3P-1FFVD900I | XCKU3P-2FFVD900E | XCKU3P-1FFVD900E | XCKU3P-3FFVD900I |
|---|---|---|---|---|---|
| Package | 900-FCBGA, 31 x 31 mm | 900-FCBGA, 31 x 31 mm | 900-FCBGA, 31 x 31 mm | 900-FCBGA, 31 x 31 mm | 900-FCBGA, 31 x 31 mm |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Device Family | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P |
| Speed Grade | -2 | -1 | -2 | -1 | -3 |
| Temperature Suffix | I - Industrial | I - Industrial | E - Extended | E - Extended | I - Industrial |
| Logic Cells | 355,950 | 355,950 | 355,950 | 355,950 | 355,950 |
| Block RAM | 12,960 Kb | 12,960 Kb | 12,960 Kb | 12,960 Kb | 12,960 Kb |
| DSP Slices | 1,368 | 1,368 | 1,368 | 1,368 | 1,368 |
| User I/O | 304 | 304 | 304 | 304 | 304 |
주요 차별점
- Higher speed grade within the same FFVD900 footprint (vs XCKU3P-1FFVD900I)
- Industrial-grade operating option (vs XCKU3P-2FFVD900E)
- High parallel-processing capacity for adaptive workloads (vs XCKU3P-3FFVD900I)
설계 노트
Plan the FFVD900 power tree from the AMD device power guidance rather than from generic BGA practice. Place every power and ground ball directly on the board, minimize loop area between supply and ground connections, and distribute high-current paths evenly beneath the package. Use the AMD power-estimation flow with the final clock plan, I/O activity, memory utilization, and environmental conditions. Decoupling networks should follow the reference design because incorrect capacitor placement can increase supply-noise margin degradation even when nominal rail capacitance appears adequate.
Treat the 900-FCBGA as a major heat source with a nonlinear relationship between activity, ambient temperature, airflow, and junction temperature. Run the complete design at realistic switching activity and evaluate the PCB stack-up, copper around the device, heat-spreader options, enclosure airflow, and neighboring heat sources. Validate thermal performance at the highest expected ambient temperature. A board that meets room-temperature functionality can still fail production requirements when junction temperature and adjacent components rise under sustained full-load operation.
Preserve the AMD reference-design stack-up and keep high-speed interface routing short and symmetric. Provide continuous reference planes below package escape routes, avoid plane splits beneath high-speed links, and control impedance through the actual fabrication stack-up. Run field solver extraction and post-route signal-integrity analysis for the highest-speed interfaces. Include the FFVD900 package model in simulation and verify assembly rules, via transitions, and BGA land geometry with the selected board manufacturer.
Do not infer pin compatibility from the XCKU3P family name alone. Confirm that the complete MPN retains the FFVD900 package and then review changes in speed grade and temperature suffix. Replacing XCKU3P-2FFVD900I with a -1 or -3 speed option can alter timing closure, while a different temperature suffix can change environmental qualification. Also verify configuration compatibility, clock requirements, power sequencing, and the current package-pinout file before committing a replacement to production.
규정 준수 정보
Compliance status is not stated in the product information for this exact MPN. Review the current AMD environmental and material-declaration documentation before making a compliance claim.
