XCZU3EG-1SFVA625E - Zynq UltraScale+ MPSoC EG | AMD
부품 번호: XCZU3EG-1SFVA625E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220 | $2,200.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $160 | $160,000.00 |
XCZU3EG-1SFVA625E 개요
A Zynq UltraScale+ MPSoC is a heterogeneous multiprocessor system-on-chip that combines a hardened processing system (PS) with programmable logic (PL) on a single die. The PS provides the software-defined processing capability with ARM cores, while the PL offers the hardware flexibility of an FPGA. This architecture sits at the top of the embedded processing hierarchy, bridging the gap between traditional microprocessors and FPGAs, enabling designers to optimize for both software flexibility and hardware acceleration.
Key features of the XCZU3EG-1SFVA625E include the quad-core ARM Cortex-A53 MPCore with CoreSight running at up to 1.2GHz, the dual-core ARM Cortex-R5 with CoreSight at up to 600MHz, and the ARM Mali-400 MP2 GPU. The FPGA fabric contains 154,350 logic cells, providing substantial programmable logic resources. The device supports a maximum operating temperature of 100°C and is available in a tray packaging format.
The XCZU3EG-1SFVA625E leverages the UltraScale+ architecture, which delivers high-performance serial I/O, advanced clocking, and robust power management. The integration of the ARM processing system with the FPGA fabric enables low-latency, high-bandwidth communication between software and hardware, making it ideal for applications requiring both complex algorithms and real-time processing.
Typical applications include software-defined radio, industrial motor control, medical imaging, and automotive driver assistance systems. The combination of the A53 application cores, R5 real-time cores, and FPGA fabric allows for a flexible partitioning of tasks between software and hardware.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The 0.85V core voltage requires a clean, well-regulated supply, and the multiple power rails must be sequenced according to the guidelines in the Zynq UltraScale+ device technical reference manual.
드롭인 대체품: XCZU3EG-1SFVA625E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XCZU3EG-1SFVA625E (동일 폼 팩터 및 풋프린트) — 차이점: Core Voltage, Logic Cells, Package, Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCZU3EG-L1SFVA625I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU3EG-2SFVA625E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU3EG-3SFVA625E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU2EG-1SFVA625E
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$390 / 개
데이터시트 보기 →XCZU3EG-1SFVA625E 최대 정격 & 전기적 특성
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Logic Cells | 154350 |
| 패키지 | 625-FCBGA (21x21) |
| 동작 온도 | 0 to 100 C |
| Core Voltage | 0.85V |
| Technology | 20nm |
| 실장 유형 | Surface Mount |
| Series | Zynq UltraScale+ MPSoC EG |
| Number of I/O | 180 |
| RoHS 상태 | Compliant |
| Packaging | Tray |
| FPGA Family | Zynq UltraScale+ |
| Processor Scalability | 64-bit |
| 공급 전압 | 0.85V |
XCZU3EG-1SFVA625E 핀 구성
| 핀 A1 | VCCINT — Internal core voltage 0.85V |
| 핀 A2 | GND — Ground |
| 핀 B1 | VCCAUX — Auxiliary voltage 1.8V |
| 핀 B2 | IO_L1P_T0 — User I/O bank 0 |
| 핀 C1 | IO_L1N_T0 — User I/O bank 0 |
| 핀 C2 | VCCBRAM — Block RAM voltage 0.85V |
| 핀 D1 | DDR_ACT_N — DDR4 command/address |
| 핀 D2 | DDR_A[0] — DDR4 address bus |
| 핀 E1 | DDR_A[1] — DDR4 address bus |
| 핀 E2 | DDR_BA[0] — DDR4 bank address |
| 핀 F1 | DDR_DQ[0] — DDR4 data bus |
| 핀 F2 | DDR_DQ[1] — DDR4 data bus |
일반적인 애플리케이션
XCZU3EG-1SFVA625E 적합 용도: 6 애플리케이션s: Software Defined Radio, Industrial Motor Control, Medical Imaging, Automotive Driver Assistance, Data Center Acceleration, Prototyping and Development.
Software Defined Radio
The XCZU3EG-1SFVA625E is ideal for software-defined radio (SDR) systems due to its combination of a quad-core ARM Cortex-A53 for protocol processing and FPGA fabric for high-speed digital signal processing. The 154K logic cells can implement complex DDC/DUC chains, FFT engines, and channelizers, while the A53 cores handle the upper protocol stack. The 1.2GHz A53 clock and 600MHz R5 clock provide ample processing headroom for real-time modulation and demodulation. The 625-FCBGA package with 180 I/O supports high-speed ADC/DAC interfaces, enabling direct RF sampling architectures. The Mali-400 GPU can offload spectrum visualization tasks, freeing CPU resources for signal processing.
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Industrial Motor Control
The XCZU3EG-1SFVA625E excels in industrial motor control applications by integrating the dual-core ARM Cortex-R5 real-time processor for deterministic control loops and the FPGA fabric for high-speed PWM generation and encoder interfacing. The R5 cores can execute field-oriented control (FOC) algorithms with low latency, while the FPGA implements multiple PWM channels with dead-time insertion and fault handling. The 154K logic cells provide ample resources for implementing multiple motor control channels on a single device. The 0.85V core voltage and 20nm process ensure low power consumption, critical for industrial environments. The commercial temperature grade (0-100°C) is suitable for most factory automation settings, and the 625-FCBGA package supports robust PCB mounting.
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Medical Imaging
The XCZU3EG-1SFVA625E is well-suited for medical imaging systems such as ultrasound and CT scanners, where the combination of ARM processing and FPGA fabric enables real-time image processing. The quad-core A53 processors can handle image reconstruction algorithms, while the FPGA fabric accelerates filtering, beamforming, and other compute-intensive tasks. The Mali-400 GPU supports 2D/3D rendering for visualization. The 154K logic cells provide sufficient resources for implementing multiple processing pipelines. The device's 0.85V core voltage and 20nm process contribute to low power dissipation, important for portable or fanless medical devices. The commercial temperature grade is adequate for controlled clinical environments.
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Automotive Driver Assistance
The XCZU3EG-1SFVA625E can be used in automotive driver assistance systems (ADAS) for sensor fusion and real-time processing. The FPGA fabric can implement multiple camera interfaces and pre-processing pipelines, while the ARM Cortex-A53 cores run perception algorithms. The dual-core R5 processors provide a safety island for ASIL-B compliant functions. The 154K logic cells allow for implementation of convolutional neural network (CNN) accelerators for object detection. The device's 0.85V core voltage and 20nm process help manage thermal constraints in automotive environments. However, for automotive-grade applications requiring -40°C operation, the XCZU3EG-L1SFVA625I variant is recommended.
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Data Center Acceleration
The XCZU3EG-1SFVA625E is suitable for data center acceleration applications such as network processing, storage offload, and AI inference. The quad-core A53 processors can handle control plane tasks, while the FPGA fabric accelerates data plane operations. The 154K logic cells can implement packet parsing, classification, and encryption engines. The Mali-400 GPU can assist with parallel processing tasks. The device's 0.85V core voltage and 20nm process enable high performance per watt, critical for data center efficiency. The 625-FCBGA package supports high-density PCB designs. The commercial temperature grade is suitable for controlled data center environments.
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Prototyping and Development
The XCZU3EG-1SFVA625E is an excellent choice for prototyping and development of embedded systems due to its comprehensive feature set and availability. The combination of ARM processors and FPGA fabric allows developers to experiment with hardware-software co-design. The 154K logic cells provide ample resources for implementing custom peripherals and accelerators. The device is supported by AMD's Vivado design suite and Vitis unified software platform, enabling rapid development. The 625-FCBGA package is compatible with standard PCB manufacturing processes. The commercial temperature grade is sufficient for lab environments, and the tray packaging is convenient for engineering samples.
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추천 제품 요약
엔지니어링 참조 데이터: XCZU3EG-1SFVA625E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCZU3EG-L1SFVA625I | XCZU3EG-2SFVA625E | XCZU3EG-3SFVA625E | XCZU3EG-1SFVC784E |
|---|---|---|---|---|---|
| Package | 625-FCBGA (21x21) | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same | 784-FCBGA (23x23) - different |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 154350 | 154350 | 154350 | 154350 | 154350 |
| Speed Grade | -1 | -1 | -2 | -3 | -1 |
| Operating Temperature | 0 to 100 C | -40 to 100 C | 0 to 100 C | 0 to 100 C | 0 to 100 C |
| Number of I/O | 180 | 180 | 180 | 180 | 256 |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V | 0.85V |
| Packaging | Tray | Tray | Tray | Tray | Tray |
주요 차별점
- Industrial temperature grade option (vs XCZU3EG-1SFVA625E)
- Higher speed grades available (vs XCZU3EG-1SFVA625E)
- Pin-compatible with lower-cost variants (vs XCZU2EG-1SFVA625E)
설계 노트
The XCZU3EG-1SFVA625E requires a clean 0.85V core supply (VCCINT) with tight regulation. Use a dedicated high-efficiency DC-DC converter with remote sensing to maintain voltage accuracy at the device pins. The 20nm process is sensitive to voltage droop, so place bulk decoupling capacitors (e.g., 100uF) near the VCCINT pins and multiple 0.1uF ceramic capacitors distributed across the package. Follow the power supply sequencing guidelines in UG1085 to avoid latch-up or damage.
The XCZU3EG-1SFVA625E can dissipate significant power, especially when the FPGA fabric is heavily utilized. The 625-FCBGA package has a thermal resistance that requires a heatsink or active cooling for high-performance applications. Ensure adequate airflow or attach a heatsink with thermal interface material. The maximum junction temperature is 100°C for the commercial grade, so thermal design must account for ambient temperature and power dissipation. Use thermal vias under the package to improve heat transfer to the PCB.
For the 625-FCBGA package, use a high-layer-count PCB (at least 8 layers) with dedicated power and ground planes. Route DDR4 signals with controlled impedance (typically 40-50 ohms) and match trace lengths to meet timing requirements. Place the device with sufficient clearance for the BGA fan-out. Follow the PCB design guidelines in UG583 for UltraScale+ devices, including decoupling capacitor placement and power plane partitioning.
규정 준수 정보
RoHS compliance is indicated by distributor listings. AEC-Q100 qualification is not applicable for this commercial-grade device; the industrial-grade variant may have different compliance.
