XCZU6CG-1FFVC900E - Zynq UltraScale+ MPSoC CG, Dual A53/R5, 900-FCBGA | AMD
부품 번호: XCZU6CG-1FFVC900E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5425.71 | $5,425.71 |
| 10 | $5099.5 | $50,995.00 |
| 100 | $4720.35 | $472,035.00 |
| 500 | $4380 | $2,190,000.00 |
| 1,000 | $4100 | $4,100,000.00 |
XCZU6CG-1FFVC900E 개요
A heterogeneous MPSoC (Multiprocessor System-on-Chip) is a class of integrated device that tightly couples deterministic real-time microcontrollers, application-class CPUs, graphics/video engines, and hardware-programmable FPGA fabric on a single die. The Zynq UltraScale+ family sits at the top of AMD's SoC taxonomy: heterogeneous MPSoC > Zynq UltraScale+ > Zynq-7000 > earlier Zynq devices, and competes directly with Microchip PolarFire SoC, NXP Layerscape, and TI Jacinto in the embedded edge AI and industrial control segment.
Key features include dual ARM Cortex-A53 cores with NEON/SIMD and ARMv8-A 64-bit support, dual ARM Cortex-R5 cores with lock-step capability, ARM Mali-400MP2 GPU, integrated memory controller supporting DDR4/LPDDR4 with ECC, high-speed transceivers (GTH/GTX), common-use peripherals such as USB 2.0, Gigabit Ethernet, CAN, SPI, I2C, UART, and 256-bit AES/RSA hardware root of trust for secure boot. The 900-FCBGA package exposes approximately 256 user I/O pins grouped into high-range, high-performance, and high-density banks.
The programmable logic portion contains roughly 469K system logic cells plus DSP slices, block RAM, and UltraRAM, all accessible through the ARM PS-PL AXI interconnect. Designers can implement custom peripherals, hardware accelerators, and vision pipelines in the PL fabric, while the hardened PS handles real-time and application tasks. The Vivado and Vitis toolchains from AMD provide C/C++, RTL, and high-level synthesis flows.
Typical applications include industrial motor drives, robotics, sensor fusion gateways, machine-vision controllers, 5G edge radio units, automotive ADAS prototyping, and medical imaging. The CG subfamily is optimal when video encode/decode is not needed but deterministic real-time control, Linux application processing, and FPGA acceleration are all required.
When designing with this device, allocate PCB power-delivery for the multi-rail requirement (typically 0.85 V VCCINT, 1.8 V VCCAUX, 0.9 V DDR4 VTT, plus 3.3 V I/O). Proper decoupling, ground plane stitching under the BGA, and length-matched DDR4 address/command traces are critical; AMD UG583 and UG1075 are the primary hardware-design references.
This page synthesizes distributor pricing, validated drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: XCZU6CG-1FFVC900E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCZU6CG-1FFVC900I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU6CG-2FFVC900E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU6EG-1FFVC900E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU6CG-2FFVC900I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU6EG-1FFVC900I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU6CG-1FFVC900E 최대 정격 & 전기적 특성
| Product Type | Heterogeneous System-on-Chip (MPSoC) |
| Family | Zynq UltraScale+ MPSoC, CG subfamily |
| Application Processor | Dual-core ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual-core ARM Cortex-R5 with CoreSight |
| A53 Max Frequency | 1.2 GHz |
| R5 Max Frequency | 500 MHz |
| Programmable Logic Cells | 469K+ system logic cells |
| 패키지 | 900-ball FCBGA (31x31 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | -1 |
| Temperature Grade | E (extended, 0C to +100C TJ) |
| Video Codec Engine | None (CG subfamily, no VCU) |
| Memory Controller | DDR4 / LPDDR4 with ECC support |
| GPU | ARM Mali-400MP2 |
| Security | 256-bit AES, RSA, secure key storage |
| RoHS 상태 | Compliant |
XCZU6CG-1FFVC900E 핀 구성
| 핀 A1 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 A2 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 A3 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 B1 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 B2 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 B3 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 C1 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 C2 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
| 핀 C3 | BGA ball — Multi-function pin - see AMD UG1075 FFVC900 ball map for exact function |
일반적인 애플리케이션
XCZU6CG-1FFVC900E 적합 용도: 6 애플리케이션s: Industrial Motor Drive Control, Robotics and Sensor Fusion Gateway, Machine Vision and Industrial Inspection, 5G Edge Radio Unit (RU) and O-RAN, Automotive ADAS Prototyping, Medical Imaging and Diagnostic Equipment.
Industrial Motor Drive Control
The XCZU6CG-1FFVC900E's dual ARM Cortex-R5 cores in lock-step deliver deterministic sub-microsecond PWM control for 3-phase industrial drives, while the dual ARM Cortex-A53 cores run Linux-based commissioning, telemetry, and OPC UA server stacks. The 469K+ PL cells accommodate current-loop sensor fusion, encoder decoding (EnDat, BiSS, SSI), and sigma-delta modulator interfaces, replacing 2-3 DSPs and an MCU. The CG subfamily (no VCU) saves cost and power versus EG parts when H.264/H.265 encoding is not part of the drive firmware. Per AMD's MPSoC product page, CG devices are explicitly optimized for industrial motor control and sensor fusion workloads.
추천
Robotics and Sensor Fusion Gateway
AMR and AGV designs require simultaneous SLAM processing on Cortex-A53, deterministic motion control on Cortex-R5, and FPGA-accelerated LiDAR point-cloud pipelines in PL. The XCZU6CG-1FFVC900E's 469K logic cells plus DDR4/LPDDR4 with ECC support real-time obstacle maps at multi-MHz point rates. The integrated Gigabit Ethernet and USB 2.0 PHYs simplify connection to safety scanners and HMI panels. The -1 speed grade and E temperature grade handle ambient industrial enclosures at 0-85C without throttling.
추천
Machine Vision and Industrial Inspection
MIPI-CSI-2 and SLVS-EC camera streams enter the PL fabric where ISP pipelines (debayer, demosaic, gamma correction) run at multi-Gbps while the A53 cores handle Linux-side OpenCV inspection. The XCZU6CG-1FFVC900E's Cortex-A53 64-bit cores accelerate PC-based vision algorithms 2-3x versus Zynq-7000 Cortex-A9. The CG subfamily's lower cost matches inspection OEMs whose BOM cannot justify a video codec. ECC-protected DDR4 prevents soft errors in 24/7 production lines.
추천
5G Edge Radio Unit (RU) and O-RAN
O-RAN RUs require sub-6 GHz fronthar (FH) CPRI/eCPRI transport, PHY-layer LDPC/Polar encoding, and beamforming weights updated every millisecond. The XCZU6CG-1FFVC900E's GTH transceivers carry 10/25G eCPRI, while PL-implemented LDPC kernels offload the A53 cores. The hardware AES/RSA engines accelerate MACsec and O-RAN security profiles. Industrial E temperature grade matches outdoor O-RAN radio unit thermal envelopes when paired with proper heatsinking.
추천
Automotive ADAS Prototyping
While the production XCZU6CG-1FFVC900E is not AEC-Q100 qualified, it is widely used as a development platform for ADAS prototyping where engineers can later port PL logic and PS firmware to the AEC-Q100 XA Zynq UltraScale+ parts. The 900-FCBGA package exposes enough I/O to interface multi-camera sensor fusion, radar preprocessing, and CAN-FD vehicle network. The Cortex-A53's NEON SIMD accelerates deep-learning inference using ARM Compute Library when paired with a Vitis AI toolchain.
추천
Medical Imaging and Diagnostic Equipment
Portable ultrasound, endoscopy, and point-of-care diagnostic carts benefit from the XCZU6CG-1FFVC900E's combination of A53 application processing, R5 deterministic control of analog front-ends, and PL-based beamforming or FFT pipelines. The hardware root-of-trust provides immutable boot chains needed for FDA cybersecurity premarket guidance. ECC-protected DDR4 reduces diagnostic-image artifacts caused by soft errors. The CG subfamily avoids the EG video codec when diagnostic workflows use lossless DICOM transfer only.
추천
추천 제품 요약
엔지니어링 참조 데이터: XCZU6CG-1FFVC900E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCZU6CG-1FFVC900I | XCZU6CG-2FFVC900E | XCZU6EG-1FFVC900E | XCZU6CG-2FFVC900I | XCZU6EG-1FFVC900I |
|---|---|---|---|---|---|---|
| Package | 900-ball FCBGA (31x31 mm, FFVC900) | 900-ball FCBGA (31x31 mm, FFVC900) - same | 900-ball FCBGA (31x31 mm, FFVC900) - same | 900-ball FCBGA (31x31 mm, FFVC900) - same | 900-ball FCBGA (31x31 mm, FFVC900) - same | 900-ball FCBGA (31x31 mm, FFVC900) - same |
| Brand | AMD (formerly Xilinx) | AMD - same | AMD - same | AMD - same | AMD - same | AMD - same |
| Subfamily | CG (cost-optimized, no VCU) | CG | CG | EG (with H.264/H.265 VCU) | CG | EG (with H.264/H.265 VCU) |
| Speed Grade | -1 | -1 | -2 | -1 | -2 | -1 |
| Temperature Grade | E (0C to +100C TJ) | I (-40C to +100C TJ) | E (0C to +100C TJ) | E (0C to +100C TJ) | I (-40C to +100C TJ) | I (-40C to +100C TJ) |
| Logic Cells | ~469K | ~469K - same | ~469K - same | ~469K - same | ~469K - same | ~469K - same |
| A53 Cores | Dual, 1.2 GHz max | Dual, 1.2 GHz max | Dual, 1.2 GHz max | Dual, 1.2 GHz max | Dual, 1.2 GHz max | Dual, 1.2 GHz max |
| Video Codec (VCU) | None (CG) | None | None | Yes (H.264/H.265) | None | Yes (H.264/H.265) |
주요 차별점
- Heterogeneous 3-class CPU topology on a single die (vs XC7Z020-1CLG484I)
- CG subfamily omits the video codec to reduce cost and power (vs XCZU6EG-1FFVC900E)
- Larger programmable logic and DSP budget than Zynq-7000 (vs XC7Z020-1CLG484I)
- DDR4/LPDDR4 with hardware encryption accelerators (vs XC7Z020-1CLG484I)
설계 노트
The Zynq UltraScale+ MPSoC requires multiple supply rails: VCCINT (0.85 V core), VCCAUX/VCCADC (1.8 V auxiliary), VCCO_HP/HD/HR (1.2-3.3 V I/O banks), PS DDR4 VTT (0.6 V via dedicated LPDDR4 terminator), and MGTRAIL for high-speed transceivers. Use a dedicated PMIC such as the AMD-recommended IRPS5401 with 6+ output rails. Estimated: worst-case total power for XCZU6CG at full PS+PL utilization is approximately 8-12 W; derate supply capacitors 30 percent for 100k-hour life at +85C ambient.
The 900-FCBGA (31x31 mm) package has theta-JA of approximately 4-6 C/W with a 4-layer JEDEC JESD51 test board. At 10 W, junction-to-ambient rise is roughly 50C above ambient, so a heatsink (15x15 mm or larger) with thermal interface material is mandatory for industrial enclosures. Without airflow, ambient should not exceed 50C; with 200 LFM forced-air ambient up to 75C is acceptable. Monitor PS Sysmon and PL XADC die temperature sensors to throttle PL clocks via Vivado EMIO before reaching +100C TJ.
The 900-ball FCBGA has 1.0 mm ball pitch; PCB must use microvia stack-up with HDI (high-density interconnect) build-up layers per IPC-6012 Class 3. BGA break-out should fan-out to buried vias under pads using 0.4 mm laser-drilled microvias. DDR4 traces must be length-matched to within +/- 25 mils for address/command and +/- 12 mils for byte-lane DQ. A continuous reference ground plane under the BGA is mandatory to control impedance for GTx serial GTRX lanes.
Do not assume the MGT (multi-gigabit transceiver) reference clocks are interchangeable - they require specific Si5338x or Si539x jitter cleaner devices meeting AMD GTH jitter mask. Always perform Vivado timing closure simulation before committing to layout; -1 speed grade can fail timing on DDR4 PHY if routes exceed 5 cm. The PS_MIO bank voltages must match the chosen boot mode (SD/QSPI/JTAG) and PMU firmware ROM boot sequence. Secure boot fuses are one-time-programmable - confirm boot image signature chain in software emulator first.
규정 준수 정보
RoHS and REACH compliant per AMD product page. Not AEC-Q100 qualified; for automotive production, use the XA7Z020-1CLG400Q or other AEC-Q100 qualified Zynq UltraScale+ variant. E temperature grade is 0C to +100C TJ; industrial I grade extends to -40C.
