10AS032H3F34I2LG vs 10AS032H3F35I2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032H3F34I2LG disebabkan oleh Intel dan 10AS032H3F35I2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS032H3F34I2LG | 10AS032H3F35I2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum HPS Clock Frequency | 1.5 GHz | — |
| Kemasan | 1152-FBGA, FC (35x35 mm) | 1152-FCBGA (35 x 35 mm) |
| Pin/Ball Count | 1152 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Operating Temperature Grade | Industrial | Industrial (-40C to +100C) |
| Temperature Range | -40C to +100C (junction, per industrial grade) | — |
| Process Node | 20 nm (Arria 10 generation) | — |
| Device Designator | 10AS032H3F34I2LG | — |
| Speed Grade | 2 | — |
| Lead-Free / RoHS | Yes (LG suffix) | — |
| Packaging Form | Tray (LG suffix) | — |
| Device Variant | — | 10AS032 |
| Hard Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | — | 1.5 GHz |
| Process Technology | — | 20 nm (TSMC) |
| Memory Interfaces | — | DDR3 / DDR4 external memory interfaces |
| DSP Blocks | — | Yes (variable-precision DSP blocks) |
| Transceivers | — | Multi-gigabit transceivers (up to 12.5 Gbps per grade) |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Configuration Memory | — | On-chip configuration |
| Hard Memory Controller | — | Yes (HPS-side) |