10AS057K2F35E2LG vs 10AS057K3F35E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS057K2F35E2LG disebabkan oleh Intel dan 10AS057K3F35E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS057K2F35E2LG | 10AS057K3F35E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570,000 |
| Process Node | TSMC 20 nm | — |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Max Frequency | 1.5 GHz | — |
| DSP Blocks | [DATA_NEEDED: 18x19 multiplier count] | [DATA_NEEDED: DSP block count] |
| Embedded Memory (M20K) | [DATA_NEEDED: M20K block count and total bits] | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | [DATA_NEEDED: transceiver count / rate] |
| PCIe Hard IP | Gen3 x4 (rootport/endpoint) | — |
| User I/Os | 396 | — |
| Kemasan | 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch | 1152-pin FC-FBGA (35x35 mm) |
| Speed Grade | E2 (commercial/extended) | — |
| Suhu Operasi | -40C to +100C (extended-industrial screening) | 0 C to +85 C (industrial) |
| Configuration | SRAM-based, partial reconfiguration, SEU mitigation, ECC | — |
| Memory Interfaces | DDR3/DDR4 with hard PHY (HPS + FPGA) | — |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Process Technology | — | 20 nm |
| Hard Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Voltage | — | 0.9 V |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes / Compliant |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Core Speed | — | up to 1.5 GHz |
| Configuration Memory | — | [DATA_NEEDED: bit-width / type] |
| Embedded Memory | — | [DATA_NEEDED: M20K block count / total] |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |