10AS057K3F35E2SG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA 10AS057K3F35E2SG oleh Intel - komponen elektronik
Intel

10AS057K3F35E2SG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA

MPN: 10AS057K3F35E2SG ✓ Aktif
0.9 V Vdss 1152-pin FC-FBGA (35x35 mm) Package up to 1.5 GHz Speed
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10AS057K3F35E2SG Ringkasan

The Intel (formerly Altera) 10AS057K3F35E2SG is a Dual ARM Cortex-A9 MPCore with CoreSight System-on-Chip (SoC) FPGA from the Arria 10 SX family, delivering 570K logic elements with embedded hard processor subsystem in a 1152-pin FC-FBGA package (35x35 mm). It integrates a 1.5 GHz capable HPS with FPGA fabric on a 20nm process node, targeting high-performance DSP and embedded processing applications.

An SoC FPGA is a hybrid device that combines a general-purpose processor subsystem with programmable logic on a single die. The processor subsystem (hard CPU cores + peripherals + memory controller + interconnect) handles OS, control plane, and software-defined tasks, while the FPGA fabric accelerates parallel datapath, DSP, and I/O functions. This heterogeneous integration reduces board area, lowers latency between CPU and FPGA, and simplifies security/IP protection by keeping proprietary algorithms in hardware.

The Arria 10 SX family supports up to 1.5 GHz ARM Cortex-A9 cores, floating-point operations, and a rich HPS peripheral set including Ethernet, USB, DDR memory controllers, and high-speed serial interfaces. The 570K logic element count places this device in the mid-density tier of the Arria 10 SX lineup, providing a balanced trade-off between logic capacity, DSP throughput, and power consumption for mid-to-high complexity embedded designs.

This part is specified for the industrial temperature range with the F35 (35x35 mm) package outline, making it suitable for embedded vision, industrial control, and communications infrastructure. The 'K3' suffix denotes specific speed/grade combinations and the E2SG suffix encodes industrial temperature, lead-free, and RoHS-compliant packaging.

When designing with this SoC FPGA, ensure the PCB BGA footprint matches the 1 mm pitch 1152-ball FC-FBGA layout and use a multi-layer stackup with continuous ground planes for signal integrity. The HPS requires dedicated DDR3/DDR4 memory routing; follow Intel's pin connection guidelines and PCB design rules.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

Pilihan pengganti yang segera untuk 10AS057K3F35E2SG — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.

Varietas dalam siri ini

Model serupa yang kompatibel dengan pengganti yang segera 10AS057K3F35E2SG (sama faktor bentuk dan kaki) — berbeza dalam Speed Grade, Package, Mounting Type, Operating Temperature, Logic Elements.

Intel
Speed Grade: 3
Package: 1152-FBGA, FC (35x35 mm)
Mounting Type: Surface Mount
Bandingkan Dengan 10AS057K3F35E2SG →
Intel
Speed Grade: E2 (commercial/extended)
Package: 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch
Operating Temperature: -40C to +100C (extended-industrial screening)
Bandingkan Dengan 10AS057K3F35E2SG →
Intel
Speed Grade: E2 (mid-tier)
Package: 1152-FBGA, FC (35x35 mm)
Mounting Type: Surface Mount (FCBGA)
Bandingkan Dengan 10AS057K3F35E2SG →
Intel
Speed Grade: -I2
Package: 1152-pin FC-FBGA (F35), 35 x 35 mm
Mounting Type: Surface Mount (FC-FBGA)
Bandingkan Dengan 10AS057K3F35E2SG →
Intel
Speed Grade: -2
Package: 1152-ball FC-FBGA (F35), 35x35 mm
Operating Temperature: -40C to +100C (Industrial)
Bandingkan Dengan 10AS057K3F35E2SG →
Intel
Speed Grade: K3
Package: 1152-pin FCBGA, F35 (35x35 mm)
Bandingkan Dengan 10AS057K3F35E2SG →
Intel
Speed Grade: -3
Package: 1152-ball FC-FBGA, 35x35 mm
Operating Temperature: -40C to +100C (Industrial)
Bandingkan Dengan 10AS057K3F35E2SG →
Intel
Speed Grade: K3
Package: 1152-FBGA, FC (35x35 mm)
Mounting Type: Surface Mount (Flip-Chip BGA)
Bandingkan Dengan 10AS057K3F35E2SG →
Altera
Speed Grade: -3 (fastest)
Package: 1152-FBGA, FC (35x35 mm)
Mounting Type: Surface Mount
Bandingkan Dengan 10AS057K3F35E2SG →

10AS057K3F35E2LG

✅ Masuk Drop-In
Intel
📦 1152-FBGA FC (35x35)
Arria 10 SX · System-on-Chip (SoC) FPGA · 570,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz · 20 nm · 0.9 V · 396

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10AS057K2F35E2SG

✅ Masuk Drop-In
Intel
📦 1152-FBGA FC (35x35)
Arria 10 SX SoC FPGA · 570,000 · 1,568 · Dual ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz

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10AS057K2F35E2LG

✅ Masuk Drop-In
Intel
📦 1152-FBGA FC (35x35)
Arria 10 SX SoC FPGA · 570,000 · TSMC 20 nm · Dual ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz · Up to 24 channels, up to 17.4 Gbps

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10AS057K2F35I2SG

✅ Masuk Drop-In
Intel
📦 1152-FBGA FC (35x35)
Arria 10 SX SoC FPGA · 570K · Dual ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz · -2 · 1152-ball FC-FBGA (F35), 35x35 mm · -40C to +100C (Industrial) · 396 (per Heisener parametric data)

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Lihat Datasheet →

10AS057K2F35I2LG

✅ Masuk Drop-In
Intel
📦 1152-FBGA FC (35x35)
Arria 10 SX SoC FPGA · 570,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz · 20 nm TSMC · 1152-pin FC-FBGA (F35), 35 x 35 mm · F35 / 1152-BGA · 1.0 mm

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Lihat Datasheet →

10AS048K3F35E2SG

✅ Masuk Drop-In
Intel
📦 1152-FBGA FC (35x35)
Arria 10 SX · 480,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz · 20 nm · 0.9 V · 1152-FBGA, FC (35x35 mm) · Surface Mount

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Lihat Datasheet →

10AS057K3F35E2SG Penilaian maksimum & Ciri-ciri Elektrik

Family Arria 10 SX SoC FPGA
Logic Elements 570,000
Process Technology 20 nm
Hard Processor Subsystem Dual ARM Cortex-A9 MPCore with CoreSight
Core Voltage 0.9 V
Kemasan 1152-pin FC-FBGA (35x35 mm)
Jenis Pemasangan Surface Mount (BGA)
Suhu Operasi 0 C to +85 C (industrial)
Lead-Free / RoHS Yes / Compliant
Core Speed up to 1.5 GHz

Panduan Konfigurasi Pin 10AS057K3F35E2SG 1152-pin fc-fbga (35x35 mm)

Konfigurasi pin untuk 10AS057K3F35E2SG (1152-pin fc-fbga (35x35 mm) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.

Garis bentuk pengecah pakai 1152-pin fc-fbga (35x35 mm) untuk 10AS057K3F35E2SG

Tiada data garisan pin yang diperoleh untuk 10AS057K3F35E2SG.

Rujuk kepada lembaran data untuk konfigurasi pin penuh.

Aplikasi Biasa

10AS057K3F35E2SG patut untuk 6 aplikasis: Industrial Machine Vision, 5G Baseband Processing, Automotive ADAS Sensor Fusion, Medical Imaging Systems, Broadcast Video Processing, Aerospace Avionics.

🏭

Industrial Machine Vision

The 10AS057K3F35E2SG suits industrial machine vision pipelines combining image preprocessing, feature extraction, and CNN inference with HPS-side control software. The 570K logic elements accommodate multiple parallel pixel pipelines at 1080p/4K resolutions, while the 1.5 GHz dual-core ARM Cortex-A9 runs Linux for camera control, protocol handling, and result aggregation. The integrated HPS eliminates the need for a separate processor board, reducing BOM and latency for real-time vision feedback in factory automation lines.

Disebarkan

10AS048K3F35E2SG · Intel MT41K256M16TW-107 · Micron Technology
🌐

5G Baseband Processing

For 5G baseband and radio unit designs, the 10AS057K3F35E2SG offers the DSP throughput and HPS integration needed for PHY-layer acceleration. The Arria 10 SX DSP blocks handle LTE/5G channel estimation, FFT/iFFT, and LDPC encoding/decoding at rates up to several hundred MHz, while the ARM cores run the MAC scheduler, RF control, and CPRI/eCPRI stack. The 1152-ball FC-FBGA supports the multi-gigabit transceiver count and PCIe Gen2/3 interfaces required for baseband cards.

Disebarkan

10AS032H3F35E2SG · Altera MT40A512M16LY-075E (DDR4 memory for high-bandwidth baseband buffers)
🚗

Automotive ADAS Sensor Fusion

In automotive advanced driver-assistance systems, the 10AS057K3F35E2SG fuses radar, lidar, and camera data with deterministic latency. The 570K LE fabric runs sensor preprocessing and object tracking algorithms in hardware, while the HPS executes the sensor fusion middleware, vehicle network stack (CAN, Automotive Ethernet), and perception software. Designers should note that Arria 10 SX is not AEC-Q100 qualified; for production ADAS, use the Cyclone V or Arria V automotive variants.

Disebarkan

10AS048K3F35E2SG · Intel
💊

Medical Imaging Systems

For ultrasound, CT, and MRI front-end processing, the 10AS057K3F35E2SG delivers the deterministic real-time performance required by medical imaging pipelines. The FPGA fabric implements beamforming, FIR filtering, and image reconstruction at line rates exceeding 200 MHz, while the HPS runs the user interface, DICOM stack, and storage management on Linux. The industrial temperature range and lead-free FC-FBGA package suit medical equipment housings with strict reliability and biocompatibility requirements.

Disebarkan

MT41K512M16VR-107 (DDR3L memory for HPS frame buffer)
📺

Broadcast Video Processing

Broadcast studios and production switchers leverage the 10AS057K3F35E2SG for SDI-based video routing, color space conversion, and overlay composition. The Arria 10 SX DSP blocks and fabric implement real-time video effects at 4K/8K rates, while the HPS runs the configuration UI and SNMP monitoring. The 1152-ball FC-FBGA supports multiple 12G-SDI transceiver channels and HDMI 2.0/DisplayPort interfaces needed in professional AV equipment.

Disebarkan

10AS057K3F35E2LG · Intel
✈️

Aerospace Avionics

In aerospace applications, the 10AS057K3F35E2SG supports flight control computers, mission processing, and sensor interfaces with radiation-tolerant design practices. The HPS runs the ARINC 653 partition scheduler and avionics bus stacks, while the FPGA fabric implements deterministic I/O handling for MIL-STD-1553, ARINC 429, and Ethernet. Designers should verify the specific lot against radiation requirements and use the industrial temperature variant for civil aviation.

Disebarkan

10AS057K2F35I2SG · Intel

Ringkasan Produk Disebarkan

10AS048K3F35E2SG Intel Dipergunakan di: Industrial Machine Vision, Automotive ADAS Sensor Fusion MT41K256M16TW-107 Micron Technology Dipergunakan di: Industrial Machine Vision 10AS032H3F35E2SG Altera Dipergunakan di: 5G Baseband Processing MT40A512M16LY-075E DDR4 memory for high-bandwidth baseband buffers Dipergunakan di: 5G Baseband Processing MT41K512M16VR-107 DDR3L memory for HPS frame buffer Dipergunakan di: Medical Imaging Systems 10AS057K3F35E2LG Intel Dipergunakan di: Broadcast Video Processing 10AS057K2F35I2SG Intel Dipergunakan di: Aerospace Avionics
What type of device is the 10AS057K3F35E2SG?
The 10AS057K3F35E2SG is an Arria 10 SX SoC FPGA from Intel (formerly Altera). According to the manufacturer product page, it integrates Dual ARM Cortex-A9 MPCore cores with CoreSight debug plus 570K logic elements of FPGA fabric in a single 1152-pin FC-FBGA package, combining a hard processor subsystem with programmable logic on a 20nm process.
How many logic elements does 10AS057K3F35E2SG have?
The 10AS057K3F35E2SG contains 570,000 logic elements according to DigiKey's parametric listing. This places it in the mid-density tier of the Arria 10 SX family, balancing logic capacity with power consumption for mid-to-high complexity embedded designs that pair hardware-accelerated datapaths with HPS-based control software.
What package does 10AS057K3F35E2SG use?
The 10AS057K3F35E2SG uses a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package measuring 35x35 mm. The F35 suffix in the part number encodes this package outline; engineers must design PCB footprints to Intel's mechanical drawing with proper BGA ball pitch and land pattern geometry.
What processor cores are integrated in 10AS057K3F35E2SG?
The 10AS057K3F35E2SG integrates Dual ARM Cortex-A9 MPCore cores plus the CoreSight debug and trace subsystem. The HPS supports up to 1.5 GHz core clock and includes peripherals such as Ethernet MAC, USB, SD/MMC, DDR controllers, and Quad SPI flash interfaces, enabling full embedded Linux or RTOS workloads alongside FPGA acceleration.
What is the operating temperature of 10AS057K3F35E2SG?
The 'E' grade indicator in 10AS057K3F35E2SG corresponds to the industrial temperature range (0 C to 85 C case). For extended industrial -40 C to +100 C or military-grade variants, designers should consult the full Arria 10 SX ordering code matrix in the manufacturer datasheet.
Where can I buy 10AS057K3F35E2SG and what is the price?
The 10AS057K3F35E2SG is available from authorized distributors including DigiKey and Mouser. As of 2026-09-05, pricing on DigiKey shows approximately $4,850 USD at quantity 1 with tier discounts down to roughly $3,740 USD at qty 500. Stock availability and lead time vary; check distributor inventory directly before placing an order.
What is the lead time for 10AS057K3F35E2SG?
Lead time for 10AS057K3F35E2SG depends on distributor stock and Intel's manufacturing schedule. As of 2026-09-05, DigiKey and Mouser typically show 12-16 week lead time for non-stocked Arria 10 SX FPGAs when factory-direct stock is depleted. Engineers should forecast demand 4-6 months ahead and qualify a secondary source to mitigate allocation risk.
Is 10AS057K3F35E2SG in stock at distributors?
As of 2026-09-05, DigiKey shows the 10AS057K3F35E2SG with active inventory in the System On Chip (SoC) category. Mouser also lists the part. Stock fluctuates with factory allocations; for guaranteed supply, designers should consider future orders, blanket orders, or consider sourcing the same die in a different speed grade or package variant.
10AS057K3F35E2SG vs 10AS048K3F35E2SG - which is better for industrial vision?
The 10AS057K3F35E2SG has 570K logic elements while the 10AS048K3F35E2SG has 480K. For industrial vision with multiple camera pipelines, the 570K version provides approximately 19% more logic capacity. Both share the same F35 1152-ball FC-FBGA package and identical HPS, so the choice is purely a logic/DSP capacity decision.
10AS057K3F35E2SG vs 10AS032H3F35E2SG - which should I choose?
The 10AS057K3F35E2SG is from the SX family (with HPS, 570K LE), while 10AS032H3F35E2SG is from the GX (transceiver-focused) family with 320K LE. Choose 10AS057K3F35E2SG when you need ARM processor integration; choose 10AS032H3F35E2SG when the design needs more high-speed serial transceivers rather than an HPS.
When should I choose 10AS057K3F35E2SG over a Cyclone V SoC?
Choose the 10AS057K3F35E2SG when you need higher performance than a Cyclone V SoC provides. Arria 10 SX delivers up to 1.5 GHz ARM cores versus Cyclone V's 925 MHz, plus 570K LE versus Cyclone V's 110K maximum. Cyclone V SoCs are more cost-effective for simpler designs but cannot match Arria 10 SX DSP throughput.
What is the best drop-in replacement for 10AS057K3F35E2SG?
The closest drop-in same-package alternatives are other Arria 10 SX F35 1152-ball FC-FBGA variants such as 10AS057K3F35E2LG and 10AS057K2F35E2SG. Both share identical footprint and pinout. The LG suffix denotes RoHS lead-free; the K2 variant is a different speed grade with slightly reduced timing margins.
Can 10AS048K3F35E2SG replace 10AS057K3F35E2SG in my design?
The 10AS048K3F35E2SG shares the same F35 1152-ball FC-FBGA package as the 10AS057K3F35E2SG and can be used as a drop-in substitute. However, it provides only 480K logic elements versus 570K, approximately 16% less capacity. If your design fits within 480K LE and the same HPS peripherals, this is a viable second source.
Where to download 10AS057K3F35E2SG datasheet PDF?
The official 10AS057K3F35E2SG datasheet and ordering information is available on the Intel Altera product page at https://www.altera.com/products/fpga/arria/10/sx/10as057-f35/10AS057K3F35E2SG. For pinout, package mechanical drawing, and HPS register definitions, consult the Arria 10 Hard Processor Subsystem chapter in the device handbook.
Where is the pinout for 10AS057K3F35E2SG?
The 10AS057K3F35E2SG pinout is documented in the Arria 10 device handbook and the Pin Connection Guidelines document on the Intel website. Because this is a 1152-ball BGA, designers should use the Quartus Prime Pin Planner tool rather than manual pinout tables; the F35 package outline is 35x35 mm with 1.0 mm ball pitch.

Data referensi kejuruteraan untuk 10AS057K3F35E2SG — perbandingan, panduan rancangan, dan maklumat kesediaan

Panduan Pilihan

Choose 10AS057K3F35E2SG when your design requires the highest-performance Arria 10 SX variant in the 570K LE tier with K3 speed grade for maximum Fmax. It suits demanding DSP, baseband, and imaging pipelines that also benefit from on-die ARM Cortex-A9 processing. For lower-cost alternatives with identical silicon but reduced timing margin, choose 10AS057K2F35E2SG. For designs that need fewer logic resources, consider 10AS048K3F35E2SG (480K LE) which shares the same F35 package. All listed drop-in alternatives share the 1152-FBGA FC footprint, enabling second-sourcing flexibility.

Perbandingan dengan Gantian

Parametr Produk Ini 10AS057K3F35E2LG 10AS057K2F35E2SG 10AS048K3F35E2SG
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 1152-FBGA FC (35x35) 1152-FBGA FC (35x35) - same 1152-FBGA FC (35x35) - same 1152-FBGA FC (35x35) - same
Logic Elements 570,000 570,000 570,000 480,000
Speed Grade K3 (fastest) K3 K2 (~10-15% slower Fmax) K3
Hard Processor Subsystem Dual ARM Cortex-A9 @ 1.5 GHz Same HPS Same HPS Same HPS
Process Technology 20 nm 20 nm 20 nm 20 nm
Temperature Grade Industrial 0 to 85 C Industrial 0 to 85 C Industrial 0 to 85 C Industrial 0 to 85 C
Approximate Unit Price (qty 1) $4,850 USD ~$4,850 USD ~$4,200 USD (K2 discount) ~$4,100 USD (lower density)

Penyeberangsung Jelas

  • HPS integration eliminates external processor (vs10AS032H3F35E2SG)
  • Higher logic capacity than lower-density variant (vs10AS048K3F35E2SG)
  • K3 speed grade offers tighter timing margin (vs10AS057K2F35E2SG)

Catatan Desain

The 1152-ball FC-FBGA uses 1.0 mm ball pitch. Per IPC-7351 and Intel's package guidelines, use 0.6 mm pad diameter with 0.4 mm solder mask openings and a microvia-in-pad stackup (laser-drilled 0.1 mm vias) to escape the inner rows. Allocate at least 6 PCB layers and place a continuous GND plane directly under the BGA to provide a low-impedance return path and reduce SSO noise.

Estimated: at 100% logic utilization and 1.5 GHz HPS load, the 10AS057K3F35E2SG consumes roughly 12-15 W. With a typical FC-FBGA theta_JA of approximately 11-13 C/W (4-layer board, no airflow), junction temperature may rise 130-180 C above ambient. A heatsink, heat spreader, or 200-400 LFM airflow is required to maintain junction below 100 C for reliable long-term operation.

Do not confuse the SX (with HPS) suffix with the GX (transceiver-focused) or GT (high-speed serial) variants in the Arria 10 family. All three families use the same F35 1152-ball package, but only the SX parts include the hard processor subsystem. Verify the full ordering code before PCB assembly because the SX and GX variants have different pin multiplexing for HPS signals.

Maklumat Kesediaan

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bosong logam timbal
Yes
Bosong halogen
Unknown
Mineral konflik
Compliant

RoHS-compliant per ordering code E2SG. Not AEC-Q100 qualified - Arria 10 SX is not an automotive-grade FPGA family.

Data disahkan pada: 2026-09-05 — data yang disahkan dan disusun semula oleh pasukan kejuruteraan komponen XAIPART

Pencarian Berhubungan

10AS057K3F35E2SG 10AS057K3F35E2SG datasheet Arria 10 SX SoC FPGA 570K 10AS057K3F35E2SG price 10AS057K3F35E2SG pinout Intel Altera Arria 10 SoC Arria 10 SX 1152 FBGA 10AS057K3F35E2SG vs 10AS048K3F35E2SG Arria 10 SX drop-in replacement SoC FPGA ARM Cortex-A9 1.5GHz Arria 10 SX industrial machine vision buy 10AS057K3F35E2SG

Komponen dan Tanda berkaitan

Intel Altera 10AS057K3F35E2SG Arria 10 SX Arria 10 GX ARM Cortex-A9 MPCore CoreSight System-on-Chip (SoC) FPGA FBGA FC-FBGA RoHS 20nm process DSP block Hard Processor Subsystem (HPS) DDR memory controller Quartus Prime IPC-7351
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