10AX090R3F40E2LG vs 10AX090R2F40E2SG Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090R3F40E2LG disebabkan oleh Intel dan 10AX090R2F40E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
10AX090R2F40E2SG 10AX090R2F40E2SG - Arria 10 GX FPGA 900K LE | Intel

10AX090R2F40E2SG - Arria 10 GX FPGA 900K LE | Intel

10AX090R2F40E2SG ✓ Aktif

Pengandingan Spesifikasi

Parametr 10AX090R3F40E2LG 10AX090R2F40E2SG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria 10 GX Arria 10 GX
Logic Elements 900,000 900000
Embedded Memory 59,234,304 bits —
User I/O Count 342 342
Process Technology 20 nm —
Core Supply Voltage 0.9 V —
Kemasan 1517-Ball FCBGA —
Package Type Flip-Chip Ball Grid Array 1517-BBGA, FCBGA
Jenis Pemasangan Surface Mount Surface Mount (FCBGA ball grid)
Number of Terminals 1517 —
Transceivers Multi-gigabit serial transceivers (on-die) Up to 14.1 Gbps (Arria 10 GX feature)
DSP Blocks Hardened fixed/floating-point DSP blocks (on-die) Variable-precision, hardened floating-point capable
Memory Interfaces Hardened DDR3/DDR4 memory controller IP —
Hard IP PCI Express Gen3, 10/40/100 GbE Ethernet —
Configuration Partial reconfiguration supported —
Status RoHS Compliant —
LABs/CLBs — 339620
Total RAM Bits — 59234304
Package Code — F40 (approx. 40mm FCBGA)
Speed Grade — 2 (R2 -2 transceiver rating)
Temperature Grade — E2 (Extended: -40C to +100C junction)
Lead-Free / RoHS — Yes (SG suffix)
Process Node — TSMC 20nm
Aras MSL — 3 (168 Hours)
Packaging — Tray

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