10AX115H2F34E2SG vs 10AX115N3F40E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115H2F34E2SG disebabkan oleh Intel dan 10AX115N3F40E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115H2F34E2SG | 10AX115N3F40E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | — |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCIe Gen3 (hard IP) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Variable-precision DSP |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Kemasan | 1152-ball FCBGA (F34) 35x35 mm | 1517-ball FCBGA (F40) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | Arria 10 GX |
| Process Technology | — | TSMC 20 nm |
| Core Voltage | — | 0.9 V |
| Embedded Memory | — | 68,857,856 bits (approximately 68.85 Mbit) |
| Transceiver Count | — | 600 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| Hard Memory Controllers | — | Yes (DDR4 support) |
| Package Code | — | BGA / FCBGA |
| Operating Temperature Grade | — | E2 (Enhanced, -40C to +100C) |
| Configuration Memory Technology | — | SRAM-based (volatile, requires external boot flash) |
| Recommended Toolchain | — | Intel Quartus Prime |