10AX115N2F40E1SG vs 10AX115N2F40I2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115N2F40E1SG disebabkan oleh Intel dan 10AX115N2F40I2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115N2F40E1SG | 10AX115N2F40I2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,600 | 68,857,856 |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Variable-precision, hard floating-point |
| Maximum User I/O Pins | 600 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | [DATA_NEEDED: transceiver count exact value] |
| Maximum Transceiver Data Rate | 17.4 Gbps (chip-to-chip) | — |
| Hard PCIe IP Blocks | PCIe Gen3 | — |
| Process Technology | 20 nm | TSMC 20 nm |
| Core Voltage | 0.9 V | — |
| Kemasan | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch |
| Package Dimensions | 40 mm x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | N2 | 2 |
| Temperature Grade | E1 (commercial) | — |
| Suhu Hubungan Operasi | -40C to +100C | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (flip-chip BGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | 427,200 |
| Registers | — | 1,708,800 |
| User I/O | — | 600 |
| Transceiver Protocol | — | GX (up to 14.1 Gbps) |
| Suhu Operasi | — | -40C to +100C (Industrial) |