10AX115N2F40E1SG vs 10AX115N2F40I2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N2F40E1SG sa pamamagitan ng Intel at 10AX115N2F40I2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115N2F40I2SG - Arria 10 GX FPGA, 1.15M LEs, 1517-FCBGA | Intel
10AX115N2F40I2SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115N2F40E1SG | 10AX115N2F40I2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,600 | 68,857,856 |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Variable-precision, hard floating-point |
| Maximum User I/O Pins | 600 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | [DATA_NEEDED: transceiver count exact value] |
| Maximum Transceiver Data Rate | 17.4 Gbps (chip-to-chip) | — |
| Hard PCIe IP Blocks | PCIe Gen3 | — |
| Process Technology | 20 nm | TSMC 20 nm |
| Core Voltage | 0.9 V | — |
| Packhaging | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch |
| Package Dimensions | 40 mm x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | N2 | 2 |
| Temperature Grade | E1 (commercial) | — |
| Temperature ng Junction na Operasyon | -40C to +100C | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (flip-chip BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | 427,200 |
| Registers | — | 1,708,800 |
| User I/O | — | 600 |
| Transceiver Protocol | — | GX (up to 14.1 Gbps) |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |