10AX115R2F40E2LG vs 10AX115R2F40I1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R2F40E2LG disebabkan oleh Intel dan 10AX115R2F40I1SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R2F40E2LG | 10AX115R2F40I1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,856 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| User I/O Pins | 342 | — |
| Transceivers | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) | [DATA_NEEDED: transceiver count for F40 package] |
| PCIe Hard IP | Gen3 x8 hard IP blocks | PCIe Gen3 x8 |
| Memory Controllers | 2x hard DDR4/DDR3/RLDRAM3 controllers | — |
| PLLs | 24 fractional PLLs | — |
| Speed Grade | -2 | I1 (industrial, fastest) |
| Temperature Grade | E2 (Extended) | Industrial (-40C to +100C) |
| Kemasan | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) |
| Process Technology | TSMC 20 nm | — |
| Status RoHS | Compliant | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 68,857,856 bits (68.86 Mbit) |
| DSP Blocks | — | 1,518 (variable-precision, hardened FP) |
| 18x19 Multipliers | — | 2,014 |
| User I/O Count | — | 342 |
| Transceiver Speed | — | Up to 14.1 Gbps (chip-dependent) |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 (hard controllers) |
| Process Node | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V |