10AX115R3F40E2SG vs 10AX115R1F40E1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R3F40E2SG disebabkan oleh Intel dan 10AX115R1F40E1SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R3F40E2SG | 10AX115R1F40E1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | 68,857,560 bits (68.86 Mbit) |
| M20K Memory Blocks | 2,738 | [DATA_NEEDED: M20K count] |
| DSP Blocks | 1,518 (variable-precision, hard FP) | 342 |
| Maximum User I/O | 342 | 768 |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | 2 |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm TSMC |
| Speed Grade | -2 | R1 (commercial) |
| Temperature Grade | E2 (0C to +100C) | E1 (enhanced) |
| Kemasan | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-BBGA / FCBGA (F40), 40 x 40 mm |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Status RoHS | Compliant | Compliant |
| DSP Format | — | Variable-precision (fixed/floating-point) |
| Transceivers | — | [DATA_NEEDED: transceiver count for 10AX115 F40] |
| Transceiver Max Data Rate | — | 14.4 Gbps |
| Hard PCIe Cores | — | PCIe Gen3 x8 |
| Core Voltage | — | 0.9 V |