10AX115R3F40E2SG vs 10AX115R1F40E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R3F40E2SG sa pamamagitan ng Intel at 10AX115R1F40E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115R3F40E2SG | 10AX115R1F40E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | 68,857,560 bits (68.86 Mbit) |
| M20K Memory Blocks | 2,738 | [DATA_NEEDED: M20K count] |
| DSP Blocks | 1,518 (variable-precision, hard FP) | 342 |
| Maximum User I/O | 342 | 768 |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | 2 |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm TSMC |
| Speed Grade | -2 | R1 (commercial) |
| Temperature Grade | E2 (0C to +100C) | E1 (enhanced) |
| Packhaging | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-BBGA / FCBGA (F40), 40 x 40 mm |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Tindminan RoHS | Compliant | Compliant |
| DSP Format | — | Variable-precision (fixed/floating-point) |
| Transceivers | — | [DATA_NEEDED: transceiver count for 10AX115 F40] |
| Transceiver Max Data Rate | — | 14.4 Gbps |
| Hard PCIe Cores | — | PCIe Gen3 x8 |
| Core Voltage | — | 0.9 V |