10AX115S3F45E2SG vs 10AX115S3F45E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115S3F45E2SG disebabkan oleh Intel dan 10AX115S3F45E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115S3F45E2SG | 10AX115S3F45E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Device Model | 10AX115 | — |
| Logic Elements (LE) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits (68.86 Mbits) | 68,857,856 bits |
| DSP Blocks | 1,518 (18x19 multipliers) | Hardened floating-point DSP |
| User I/Os | 624 | — |
| High-Speed Transceivers | Up to 24 channels at up to 17.4 Gbps | — |
| PCIe Hard IP | Gen3 x8 | PCIe Gen3 x8 hard IP |
| Speed Grade | -2 | -2 (Extended) |
| Process Technology | 20nm TSMC | 20 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Kemasan | 1932-ball FCBGA (F45), 45 mm | 1932-BBGA, FCBGA |
| Suhu Operasi | -40C to +100C (extended) | — |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements | — | 1,150,000 |
| User I/O | — | 624 |
| Footprint | — | F45 |
| Temperature Grade | — | Extended |
| Transceivers | — | Up to 28.05 Gbps backplane-capable |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |
| Jenis Pemasangan | — | Surface Mount (BGA) |