10AX115S3F45E2SG vs 10AX115S3F45E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115S3F45E2SG sa pamamagitan ng Intel at 10AX115S3F45E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115S3F45E2LG - Arria 10 GX 1150K LE FPGA | Intel | 1932-FCBGA
10AX115S3F45E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115S3F45E2SG | 10AX115S3F45E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Device Model | 10AX115 | — |
| Logic Elements (LE) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits (68.86 Mbits) | 68,857,856 bits |
| DSP Blocks | 1,518 (18x19 multipliers) | Hardened floating-point DSP |
| User I/Os | 624 | — |
| High-Speed Transceivers | Up to 24 channels at up to 17.4 Gbps | — |
| PCIe Hard IP | Gen3 x8 | PCIe Gen3 x8 hard IP |
| Speed Grade | -2 | -2 (Extended) |
| Process Technology | 20nm TSMC | 20 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 1932-ball FCBGA (F45), 45 mm | 1932-BBGA, FCBGA |
| Temperature na Operasyon | -40C to +100C (extended) | — |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements | — | 1,150,000 |
| User I/O | — | 624 |
| Footprint | — | F45 |
| Temperature Grade | — | Extended |
| Transceivers | — | Up to 28.05 Gbps backplane-capable |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |