10M04DAF256C7G vs 10M04DAU324C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M04DAF256C7G disebabkan oleh Intel dan 10M04DAU324C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M04DAF256C7G | 10M04DAU324C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | — |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | — |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Kemasan | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 324-LFBGA |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | — |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | Yes | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements | — | 4,000 |
| Embedded Memory | — | 193,536 bits |
| User I/O | — | 246 |
| Package Code | — | U324 |
| Technology | — | 55 nm |
| Ordering Part Number | — | 10M04DAU324C8G |
| Speed Grade | — | C8G |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| I/O Standard Support | — | [DATA_NEEDED: I/O standard support] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Timing Performance | — | [DATA_NEEDED: timing performance] |
| Embedded Multiplier Count | — | [DATA_NEEDED: embedded multiplier count] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Maximum User I/O | — | 246 |
| Ball Grid Package | — | 324 balls |
| Device Manufacturer | — | Intel / Altera |