10M16DAF256I7G vs 10M25DAF256I7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M16DAF256I7G disebabkan oleh Intel dan 10M25DAF256I7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M16DAF256I7G | 10M25DAF256I7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements (LE) | 16000 | 25000 |
| Embedded Memory Bits | 562176 | — |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) | — |
| Maximum User I/O | 178 | — |
| I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 (fastest) | 7 |
| Kemasan | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-pin FBGA (17 mm x 17 mm) |
| Configuration Memory | On-die flash (non-volatile, instant-on) | On-chip flash (volatile mode optional) |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| Process Technology | 55 nm CMOS with embedded flash | 55 nm |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | MAX 10 |
| Embedded Memory (M9K) | — | 1134 Kbits |
| Embedded Multipliers (18x18) | — | 50 |
| Maximum User I/Os | — | 178 |
| On-die Flash Configuration | — | Dual-configuration supported |
| ADC | — | 12-bit, 1 MSPS, up to 16 analog inputs |
| Core Voltage | — | 1.2 V |