10M16DAF256I7G vs 10M25DAF256I7P Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M16DAF256I7G sa pamamagitan ng Intel at 10M25DAF256I7P sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M16DAF256I7G | 10M25DAF256I7P |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | — |
| Logic Elements (LE) | 16000 | 25000 |
| Embedded Memory Bits | 562176 | — |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) | — |
| Maximum User I/O | 178 | — |
| I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 (fastest) | 7 |
| Packhaging | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-pin FBGA (17 mm x 17 mm) |
| Configuration Memory | On-die flash (non-volatile, instant-on) | On-chip flash (volatile mode optional) |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| Process Technology | 55 nm CMOS with embedded flash | 55 nm |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | MAX 10 |
| Embedded Memory (M9K) | — | 1134 Kbits |
| Embedded Multipliers (18x18) | — | 50 |
| Maximum User I/Os | — | 178 |
| On-die Flash Configuration | — | Dual-configuration supported |
| ADC | — | 12-bit, 1 MSPS, up to 16 analog inputs |
| Core Voltage | — | 1.2 V |