10M25DAF256C7G vs 10M25DAF256C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF256C7G disebabkan oleh Intel dan 10M25DAF256C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF256C7G | 10M25DAF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 691,200 bits (M9K blocks) | 1,728 Kbits |
| User I/Os | 178 | — |
| Kemasan | 256-LBGA (F256) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Speed Grade | -C7 | C8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0 °C to 85 °C) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Integrated ADC | Yes, 12-bit (family feature) | — |
| DSP Blocks | Yes (family feature) | — |
| PLLs | Yes (family feature) | 4 |
| Status RoHS | Compliant | Compliant |
| Suhu Operasi | 0C to +85C | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |